H10B41/70

SEMICONDUCTOR DEVICE
20230307467 · 2023-09-28 ·

An object of the present invention is to provide a semiconductor device having a novel structure in which in a data storing time, stored data can be stored even when power is not supplied, and there is no limitation on the number of writing. A semiconductor device includes a first transistor including a first source electrode and a first drain electrode; a first channel formation region for which an oxide semiconductor material is used and to which the first source electrode and the first drain electrode are electrically connected; a first gate insulating layer over the first channel formation region; and a first gate electrode over the first gate insulating layer. One of the first source electrode and the first drain electrode of the first transistor and one electrode of a capacitor are electrically connected to each other.

Semiconductor device

An object is to provide a semiconductor device with a novel structure in which stored data can be held even when power is not supplied and there is no limit on the number of write operations. The semiconductor device includes a first memory cell including a first transistor and a second transistor, a second memory cell including a third transistor and a fourth transistor, and a driver circuit. The first transistor and the second transistor overlap at least partly with each other. The third transistor and the fourth transistor overlap at least partly with each other. The second memory cell is provided over the first memory cell. The first transistor includes a first semiconductor material. The second transistor, the third transistor, and the fourth transistor include a second semiconductor material.

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE

A semiconductor device having favorable electrical characteristics is provided. The semiconductor device includes a plurality of transistors; each of the plurality of transistors includes a first insulator, a first oxide, a second oxide, a first conductor, a second conductor, a third oxide, a second insulator, and a third conductor; the third oxide included in one of the plurality of transistors and the third oxide included in another of the plurality of transistors, which is adjacent to the one of the plurality of transistors, are provided to be apart from each other in the channel width direction of the plurality of transistors; the second insulator included in one of the plurality of transistors includes a region continuous with the second insulator included in another of the plurality of transistors, which is adjacent to the one of the plurality of transistors; and the third conductor included in one of the plurality of transistors includes a region continuous with the third conductor included in another of the plurality of transistors, which is adjacent to the one of the plurality of transistors.

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
20220020883 · 2022-01-20 ·

A semiconductor device with favorable electrical characteristics is provided. The semiconductor device includes a first insulator, a first oxide over the first insulator, a second insulator provided between the first insulator and the first oxide, a second oxide in contact with the first insulator and in contact with a side surface of the first oxide, and a third insulator over the first insulator, the second oxide, and the first oxide. The third insulator includes a region in contact with a top surface of the first oxide. The second insulator and the third insulator include a material which is less likely to pass oxygen than the second oxide.

PREVENTING PARASITIC CURRENT DURING PROGRAM OPERATIONS IN MEMORY
20210358549 · 2021-11-18 ·

The present disclosure includes apparatuses, methods, and systems for preventing parasitic current during program operations in memory. An embodiment includes a sense line, an access line, and a memory cell. The memory cell includes a first transistor having a floating gate and a control gate, wherein the control gate of the first transistor is coupled to the access line, and a second transistor having a control gate, wherein the control gate of the second transistor is coupled to the access line, a first node of the second transistor is coupled to the sense line, and a second node of the second transistor is coupled to the floating gate of the first transistor. The memory cell also includes a diode, or other rectifying element, coupled to the sense line and a node of the first transistor.

Semiconductor device or memory device

A novel semiconductor device is provided. Alternatively a memory device which can retain more multi-level data is provided. One of a source or a drain of a write transistor is electrically connected to a bit line, and the other of the source or the drain of the write transistor is electrically connected to a data retaining portion. Data written to the data retaining portion is provided to the data retaining portion through a write bit line and the write transistor. Rising of a threshold voltage which is caused in a write operation can be inhibited and more multi-level data can be retained(stored) through electrically connecting a back gate of the write transistor to the write bit line.

Semiconductor device and method for manufacturing semiconductor device

A semiconductor device that can have favorable electrical characteristics and can be highly integrated is provided. The semiconductor device includes a first insulator; a second insulator over the first insulator; an oxide over the second insulator; a first conductor and a second conductor over the oxide; a third insulator over the oxide; a third conductor positioned over the third insulator and overlapping with the oxide; a fourth insulator in contact with the second insulator, a side surface of the oxide, a side surface of the first conductor, a top surface of the first conductor, a side surface of the second conductor, a top surface of the second conductor, and a side surface of the third insulator; and a fifth insulator in contact with a top surface of the third insulator and a top surface of the third conductor, and a top surface of the fourth insulator is in contact with the fifth insulator.

Semiconductor device and manufacturing method of the same

A minute transistor is provided that includes a first insulator, a second insulator, a first, conductor, a second conductor, and third conductor, in which an angle is formed between a side surface of the first insulator and a top surface of the first conductor, and a length between the first conductor and a surface of the second conductor closest to the first conductor is at least greater than a length between the first conductor and the third conductor.

SEMICONDUCTOR DEVICE
20210343751 · 2021-11-04 ·

A semiconductor device is described, which includes a first transistor, a second transistor, and a capacitor. The second transistor and the capacitor are provided over the first transistor so as to overlap with a gate of the first transistor. A semiconductor layer of the second transistor and a dielectric layer of the capacitor are directly connected to the gate of the first transistor. The second transistor is a vertical transistor, where its channel direction is perpendicular to an upper surface of a semiconductor layer of the first transistor.

DISPLAY APPARATUS

A novel display apparatus is provided. The display apparatus includes a first layer and a second layer over the first layer. The first layer includes a functional circuit. The second layer includes a display unit including a plurality of pixels and a memory unit including a plurality of memory cells. Each of the plurality of pixels includes a pixel circuit and a light-emitting element over the pixel circuit. The functional circuit includes a display unit driver circuit and a control circuit. The memory unit has a function of storing image data that is to be output through the display unit driver circuit to the display unit. The memory cell includes a first transistor for retaining a potential corresponding to the image data, and a second transistor for reading the potential. The first transistor is provided in the second layer, and the second transistor is provided in the first layer.