A semiconductor device, the device including: a first level including control circuits, where the control circuits include a plurality of first transistors and a plurality of metal layers; and a memory level disposed on top of the first level, where the memory level includes an array of memory cells, where each of the memory cells includes at least one second transistor, where the control circuits control access to the array of memory cells, where the first level is bonded to the memory level, where the bonded includes oxide to oxide bonding regions and a plurality of metal to metal bonding regions, and where at least a portion of the array of memory cells is disposed directly above at least one of the plurality of metal to metal bonding regions.

A semiconductor device includes a semiconductor substrate, first and second stack units disposed over the semiconductor substrate, and a feature disposed between the first and second stack units. Each of the first and second stack units includes at least one stack that includes a conductive film and a dielectric film stacked on each other. The feature includes a plurality of repeating units and a plurality of separators disposed to alternate with the repeating units. Each of the repeating units includes an inner portion including a pair of conductive pillars, and an outer portion including a memory film and a channel film. A method for manufacturing the semiconductor device is also disclosed.

A semiconductor device includes a semiconductor substrate, first and second stack units disposed over the semiconductor substrate, and a feature disposed between the first and second stack units. Each of the first and second stack units includes at least one stack that includes a conductive film and a dielectric film stacked on each other. The feature includes a plurality of repeating units and a plurality of separators disposed to alternate with the repeating units. Each of the repeating units includes an inner portion including a pair of conductive pillars, and an outer portion including a memory film and a channel film. A method for manufacturing the semiconductor device is also disclosed.

Some embodiments include an integrated assembly having pillars arranged in an array. The pillars have channel regions between upper and lower source/drain regions. Gating structures are proximate to the channel regions and extend along a row direction. Digit lines are beneath the pillars, extend along a column direction, and are coupled with the lower source/drain regions. Linear structures are above the pillars and extend along the column direction. Bottom electrodes are coupled with the upper source/drain regions. The bottom electrodes have horizontal segments adjacent the upper source/drain regions and have vertical segments extending upwardly from the horizontal segments. The vertical segments are adjacent to lateral sides of the linear structures. Ferroelectric-insulative-material and top-electrode-material are over the bottom electrodes. A slit passes through the top-electrode-material, is directly over one of the linear structures, and extends along the column direction.

Some embodiments include an integrated assembly having pillars arranged in an array. The pillars have channel regions between upper and lower source/drain regions. Gating structures are proximate to the channel regions and extend along a row direction. Digit lines are beneath the pillars, extend along a column direction, and are coupled with the lower source/drain regions. Linear structures are above the pillars and extend along the column direction. Bottom electrodes are coupled with the upper source/drain regions. The bottom electrodes have horizontal segments adjacent the upper source/drain regions and have vertical segments extending upwardly from the horizontal segments. The vertical segments are adjacent to lateral sides of the linear structures. Ferroelectric-insulative-material and top-electrode-material are over the bottom electrodes. A slit passes through the top-electrode-material, is directly over one of the linear structures, and extends along the column direction.

A semiconductor device includes a substrate, a fin protruding over the substrate, a gate structure over the fin, a bottom electrode over and electrically coupled to the gate structure, a ferroelectric layer around the bottom electrode, and a top electrode around the ferroelectric layer.

A semiconductor device includes a substrate and a gate structure disposed over the substrate. The gate structure includes gate electrode layers and interlayer insulation structures that are alternately stacked with each other. The semiconductor device includes a dielectric structure disposed over the substrate to contact a sidewall surface of the gate structure, and a channel layer disposed on a sidewall surface of the dielectric structure over the substrate. Each of the interlayer insulation structure includes an insulation layer and a metal-organic framework layer that are disposed on the same plane.

A semiconductor device, the device including: a first level including control circuits, where the control circuits include a plurality of first transistors and a plurality of metal layers; a memory level disposed on top of the first level, where the memory level includes an array of memory cells, where each of the memory cells include at least one second transistor, where the control circuits control the array of memory cells, where the first level is bonded to the memory level, where the bonded includes oxide to oxide bonding regions and a plurality of metal to metal bonding regions, and where at least one of the memory cells is disposed directly above at least one of the plurality of metal to metal bonding regions.

A semiconductor storage device includes a field-effect transistor, an interlayer insulation film, a source contact, an opening, and a capacitor. The field-effect transistor is provided on a semiconductor substrate. The interlayer insulation film is provided on the semiconductor substrate. The source contact runs through the interlayer insulation film and is electrically coupled to a source of the field-effect transistor. The opening is provided in a region of the interlayer insulation film including the source contact and allows the source contact to project therein. The capacitor includes a lower electrode, a ferroelectric film, and an upper electrode. The lower electrode is provided along an inside shape of the opening. The ferroelectric film is provided on the lower electrode. The upper electrode is provided on the ferroelectric film to fill the opening.

A semiconductor storage device includes a field-effect transistor, an interlayer insulation film, a source contact, an opening, and a capacitor. The field-effect transistor is provided on a semiconductor substrate. The interlayer insulation film is provided on the semiconductor substrate. The source contact runs through the interlayer insulation film and is electrically coupled to a source of the field-effect transistor. The opening is provided in a region of the interlayer insulation film including the source contact and allows the source contact to project therein. The capacitor includes a lower electrode, a ferroelectric film, and an upper electrode. The lower electrode is provided along an inside shape of the opening. The ferroelectric film is provided on the lower electrode. The upper electrode is provided on the ferroelectric film to fill the opening.