The disclosed technology generally relates to ferroelectric materials and semiconductor devices, and more particularly to semiconductor memory devices incorporating doped polar materials. In one aspect, a semiconductor device comprises a capacitor which in turn comprises a polar layer comprising a base polar material doped with a dopant. The base polar material includes one or more metal elements and one or both of oxygen or nitrogen. The dopant comprises a metal element that is different from the one or more metal elements and is present at a concentration such that a ferroelectric switching voltage of the capacitor is different from that of the capacitor having the base polar material without being doped with the dopant by more than about 100 mV. The capacitor stack additionally comprises first and second crystalline conductive oxide electrodes on opposing sides of the polar layer. The capacitor stack further comprises first and second barrier metal layers on respective ones of the first and second crystalline conductive oxide electrodes on opposing sides of the polar layer

Disclosed are a semiconductor device and a semiconductor memory device including the same. A semiconductor device may include a first electrode, a second electrode on the first electrode, a ferroelectric layer between the first electrode and the second electrode, an anti-ferroelectric layer in contact with the ferroelectric layer, and an insertion layer spaced apart from the ferroelectric layer and in contact with the anti-ferroelectric layer.

Disclosed are a semiconductor device and a semiconductor memory device including the same. A semiconductor device may include a first electrode, a second electrode on the first electrode, a ferroelectric layer between the first electrode and the second electrode, an anti-ferroelectric layer in contact with the ferroelectric layer, and an insertion layer spaced apart from the ferroelectric layer and in contact with the anti-ferroelectric layer.

A capacitor device and a semiconductor device including the capacitor device are provided. The capacitor device includes first and second electrodes spaced apart from each other, and a dielectric layer provided between the first electrode and the second electrode. The dielectric layer includes a dielectric material in which ferroelectrics and antiferroelectrics are mixed with each other.

A memory device includes a bit line group having a first bit line and a second bit line. The bit line group includes a first segment, a second segment, and a twist segment conductively connected to the first segment and the second segment. The first segment includes a first portion of the first bit line and a first portion of the second bit line. The second segment includes a second portion of the first bit line and a second portion of the second bit line. The twist segment includes a third portion of the first bit line and a third portion of the second bit line. The first and second portions of the first bit line and the second bit line each extends in a first lateral direction. The third portion of the first bit line is conductively connected to the first and second portions of the first bit line.

A method for fabricating a semiconductor device is provided. The method includes depositing a ferroelectric layer over the substrate; performing a first ionized physical deposition process to deposit a top electrode layer over the ferroelectric layer; patterning the top electrode layer into a top electrode; and patterning the ferroelectric layer to into a ferroelectric element below the top electrode.

Methods, systems, and devices for memory array with multiplexed select lines are described. In some cases, a memory cell of the memory device may include a storage component, a first transistor coupled with a word line, and a second transistor coupled with a selection line to selectively couple the memory cell with a digit line. The selection line may be provided in parallel to each digit line for multiplexing the digit lines toward a sense amplifier while a plurality of drivers, one for each selection line, may be provided in a staggered configuration under the memory array and split in even drivers and odd drivers for corresponding adjacent tiles of the memory array.

Various embodiments of the present disclosure are directed towards a ferroelectric random-access memory (FeRAM) cell or some other suitable type of memory cell comprising a bottom-electrode interface structure. The memory cell further comprises a bottom electrode, a switching layer over the bottom electrode, and a top electrode over the switching layer. The bottom-electrode interface structure separates the bottom electrode and the switching layer from each other. Further, the interface structure is dielectric and is configured to block or otherwise resist metal atoms and/or impurities in the bottom electrode from diffusing to the switching layer. By blocking or otherwise resisting such diffusion, leakage current may be decreased. Further, endurance of the memory cell may be increased.

A thin film transistor includes an active layer located over a substrate, a first gate stack including a stack of a first gate dielectric and a first gate electrode and located on a first surface of the active layer, a pair of first contact electrodes contacting peripheral portions of the first surface of the active layer and laterally spaced from each other along a first horizontal direction by the first gate electrode, a second contact electrode contacting a second surface of the active layer that is vertically spaced from the first surface of the active layer, and a pair of second gate stacks including a respective stack of a second gate dielectric and a second gate electrode and located on a respective peripheral portion of a second surface of the active layer.

A pocket integration for high density memory and logic applications and methods of fabrication are described. While various examples are described with reference to FeRAM, capacitive structures formed herein can be used for any application where a capacitor is desired. For instance, the capacitive structure can be used for fabricating ferroelectric based or paraelectric based majority gate, minority gate, and/or threshold gate.