The technology relates to an integrated circuit (IC) package. The IC package may include a substrate. An IC die may be mounted to the substrate. One or more photonic modules may be attached to the substrate and one or more serializer/deserializer (SerDes) interfaces may connect the IC die to the one or more photonic modules. The IC die may be an application specific integrated circuit (ASIC) die and the one or more photonic modules may include a photonic integrated circuit (PIC) and fiber array. The one or more photonic modules may be mounted to one or more additional substrates which may be attached to the substrate via one or more sockets.

An organic photodetector includes an activation layer including a p-type semiconductor compound and an n-type semiconductor compound, an optical auxiliary layer including a first optical auxiliary layer including a first amine compound and a second optical auxiliary layer including a second amine compound, a highest occupied molecular orbital (HOMO) energy absolute value of the first amine compound is smaller than a HOMO energy absolute value of the second amine compound, and the first optical auxiliary layer faces the first electrode.

Provided are a photoelectric device, a light absorption sensor, a sensor-embedded display panel, and an electronic device. The photoelectric device includes a first electrode and a second electrode facing each other, and a light absorbing layer between the first electrode and the second electrode, wherein the light absorbing layer is configured to absorb light of a red wavelength spectrum, a green wavelength spectrum, a blue wavelength spectrum, an infrared wavelength spectrum, or any combination thereof, the light absorbing layer includes a p-type semiconductor and an n-type semiconductor, and the n-type semiconductor includes a compound represented by Chemical Formula 1. Details for Chemical Formula 1 are as described in the detailed description.

The technology relates to an integrated circuit (IC) package. The IC package may include a substrate. An IC die may be mounted to the substrate. One or more photonic modules may be attached to the substrate and one or more serializer/deserializer (SerDes) interfaces may connect the IC die to the one or more photonic modules. The IC die may be an application specific integrated circuit (ASIC) die and the one or more photonic modules may include a photonic integrated circuit (PIC) and fiber array. The one or more photonic modules may be mounted to one or more additional substrates which may be attached to the substrate via one or more sockets.

A solar cell includes a first substrate, a first hole transport layer, a first photoelectric conversion layer containing a perovskite compound, and a second photoelectric conversion layer containing a photoelectric conversion material in this order. A band gap of the perovskite compound is greater than a band gap of the photoelectric conversion material. With respect to an absorption wavelength of the first photoelectric conversion layer 3, a refractive index n.sub.A of the first hole transport layer 2 satisfies refractive index of the first substrate?n.sub.A?refractive index of the first photoelectric conversion layer. Further, with respect to a transmission wavelength of the first photoelectric conversion layer 3 and an absorption wavelength of the second photoelectric conversion layer 5, a refractive index n.sub.B of the first hole transport layer 2 satisfies refractive index of the first substrate?n.sub.B?refractive index of the first photoelectric conversion layer.

A perovskite photodiode includes a first electrode and a second electrode, and a perovskite photoelectric conversion layer between the first electrode and the second electrode and including a Pb-free perovskite, and an auxiliary layer between the first electrode and the perovskite photoelectric conversion layer, and including a compound represented by Chemical Formula 1.

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In Chemical Formula 1, X.sup.1, X.sup.2 and R.sup.1 to R.sup.6 are as defined in the specification.

A thin-film solar cell allowing for transparency, according to an embodiment of the present invention, comprises: multiple first electrode layers disposed on the top portion of a glass substrate so as to be spaced apart from each other on the glass substrate and have a predetermined pattern; a lower end layer disposed below the first electrode layers; an upper end layer disposed between the first electrode layers and the lower end layer, and formed on the top surface of the lower end layer through a dry etching process by using the first electrode layers as masks; and a barrier layer disposed in an area of the top surface of the lower end layer other than an area in which the upper end layer is formed.

A process of forming an electrode interconnection between at least two adjacent unit devices in an integrated multilayer thin-film electronic device comprising: providing an intermediary device that comprises: a first electrode layer on a thin film substrate comprising a first patterned coating that includes at least two spaced apart first electrode sections of adjacent unit devices; a first functional layer comprising a substantially continuous coating over the first electrode layer; and a second functional layer comprising a second patterned coating on the first functional layer comprising at least two spaced apart functional sections, each functional section positioned on the first functional layer to overlay a portion of one of the first electrode sections so to define a gap portion between adjacent functional sections that includes a portion of that first electrode section and the first functional layer; and applying a second electrode layer over the second functional layer as a third patterned coating that includes at least two spaced apart second electrode sections of adjacent unit devices, each second electrode section being positioned to overlay at least one functional section of the second functional layer and a portion of an adjoining gap portion that includes at least one portion of the first electrode section of an adjacent unit device, the third patterned coating being formed using a solution including a conductive species and at least a first solvent, wherein the first functional layer is soluble in the first solvent and the second functional layer has a low to zero solubility in the first solvent, such that application of the second electrode layer to the gap portion forms at least one electrically conductive path through the first functional layer between the first electrode and the second electrode of adjacent unit devices.

A polymer comprising a donor repeat unit and an acceptor repeat unit wherein the acceptor repeat unit comprise a repeat unit of formula (I): A.sup.1 is selected from formula (IIa): formula (lib); O; S; and NR.sup.1 wherein R.sup.1 is H or a substituent: (Ha) (lib) Ar.sup.3 is a monocyclic or polycyclic aromatic group; X.sup.1 and X.sup.2 are each independently selected from N and CR.sup.2 wherein R.sup.2 in each occurrence is H or a substituent with the proviso that at least one of X.sup.1 and X.sup.2 is selected from N and CR.sup.2 wherein R.sup.2 is an electron withdrawing group; Ar.sup.1 is selected from pyrrole, benzene, pyridine and 1,4-diazine; A.sup.2 is O, S, SO.sub.2, NR.sup.1, PR.sup.1, C(R.sup.3).sup.2 and Si(R.sup.3)2 wherein R.sup.3 in each occurrence is independently H or a substituent; and Ar.sup.2 is a monocyclic or polycyclic aromatic group.

A system may include a flexible leaf having a fastener, the fastener being electrically conductive, the flexible leaf having a solar cell incorporated therein, the solar cell electrically coupled to the fastener. The system may further include an article of clothing including a respective fastener, the respective fastener being electrically conductive, the flexible leaf configured to couple to the article of clothing via at least the fastener and the respective fastener. The system may also include an electrical circuit incorporated in the article of clothing, the electrical circuit electrically coupled to the respective fastener.