The present invention provides a method of manufacturing high-resolution Micro-OLED, including following steps: S1: providing a base substrate and preparing a light-emitting pixel layer on the base substrate; S2: preparing a thin film packaging layer on the light-emitting pixel layer to encapsulating the light-emitting pixel layer; S3: preparing a black matrix layer and a light converting layer for converting one color into another color on the thin film packaging layer, and the light converting layer comprising color change layer; S4: encapsulating the black matrix layer and the light converting layer to obtain high-resolution Micro-OLED. Compared with the prior arts, the method of the present invention uses the localized surface plasmon resonance effect of the metal in the light conversion layer to make the intensity of the fluorescence peak the sub-pixel increases and make the blue peak disappeared, thereby effectively improving the overall color gamut.

An organic light emitting diode (OLED) display panel and a display device are provided. The OLED display panel includes a light emitting functional layer and a display area disposed on a transistor array substrate. The reinforcement layer is formed on a surface of a bending area of the transistor array substrate. A blocking member is formed on a surface of the transistor array substrate and located between the reinforcement layer and the light emitting functional layer. By providing the blocking member, the control accuracy of the amount of glue overflow in the bending area is improved.

The present application provides a display panel and a display device. The display panel includes a display region, a peripheral region, and a light transmissive region. The peripheral region surrounds the light transmissive region, and the display region surrounds the peripheral region. The display panel includes an inorganic insulating layer, an organic insulating layer, and a thin film encapsulation layer stacked on each other. By forming a groove in the inorganic insulating layer in the peripheral region, the thin film encapsulation layer is in contact with the inorganic insulating layer through the groove, so that cracks are stopped from extending inwardly during cutting in the light transmissive region.

An organic light-emitting diode device and a manufacturing method thereof are provided. The organic light-emitting diode device includes an array substrate, a light-emitting layer and a thin-film encapsulation layer stacked in order from bottom to top. The thin-film encapsulation layer includes a first inorganic layer, an organic layer and at least one dielectric structure layer in a stack. There is the dielectric structure layer is disposed in the thin-film encapsulation layer.

An organic light-emitting diode display panel is disclosed. By using four display panels sequentially disposed in a stack arrangement from top to bottom, light emitted in a same direction from each of the display panels, and subpixels of the four display panels not overlapping one another, a screen resolution of the organic light-emitting diode display panel can increase by three times without increasing pixel density of masks or density of array layers.

A display panel is provided in the present disclosure. The display panel has an additional function area, and the display panel includes a substrate, an array layer and a light-emitting device layer disposed in sequence on the substrate, an encapsulation layer covering the light-emitting device layer, and a touch layer disposed on the encapsulation layer. An opening area surrounded by the additional function area is disposed at an edge position of the additional function area. An opening penetrating the array layer and extending to a surface of the substrate is defined by the opening area, and the opening is filled with a light-blocking layer.

An organic light-emitting diode (OLED) display panel, a manufacturing method thereof, and a display device are provided. The OLED display panel includes a substrate; an array functional layer; a light-emitting layer; a thin-film encapsulation layer; and a liquid crystal layer, which is disposed on the thin-film encapsulation layer, including a first liquid crystal region arranged on a non-pixel region and a second liquid crystal region arranged on a pixel region, wherein liquid crystal molecules positioned in the first liquid crystal region are aligned parallel to the substrate.

A display panel, a mask plate, and a manufacturing method of the display panel are provided. The display area includes an installation area and a non-installation area. The installation area is configured to install a preset component. The display panel further includes a pixel layer. The pixel layer includes a plurality of first sub-pixels disposed in the non-installation area and a plurality of second sub-pixels disposed in the installation area. Each of the plurality of first sub-pixels includes a first cathode, and each of the plurality of second sub-pixels includes a second cathode, wherein a thickness of the second cathode is less than a thickness of the first cathode.

A display apparatus and a manufacturing method therefor. The display apparatus comprises: a substrate; a display device, which is located on the substrate; a touch-control electrode layer, which is located on the side of the display device that faces away from the substrate; and an anti-reflection structure, which is located between the display device and the touch-control electrode layer, wherein the anti-reflection structure comprises transparent dielectric layers and a metal layer, which are arranged in an alternating and stacked manner, the metal layer being located between the transparent dielectric layers, there being at least two transparent dielectric layers, and there being at least one metal layer.

A method for fabricating a stretchable display panel includes: providing a substrate, wherein a displaying unit, a connecting unit and a hollowed-out region are provided on the substrate; forming film-layer components on the substrate, wherein orthographic projections of the film-layer components on the substrate are within the displaying unit, the connecting unit and the hollowed-out region; forming a first planarization layer on a surface of the film-layer components that is away from the substrate; forming a color-film layer on one side of the first planarization layer that is away from the substrate, wherein an orthographic projection of the color-film layer on the substrate is within the displaying unit; forming a color-film protecting layer on one side of the color-film layer that is away from the substrate ; and performing an ashing process to the hollowed-out region, to remove the first planarization layer and the film-layer components within the hollowed-out region.