Methods of forming films of aligned carbon nanotubes on a substrate surface are provided. The films are deposited from carbon nanotubes that have been concentrated and confined at a two-dimensional liquid/liquid interface. The liquid/liquid interface is formed by a dispersion of organic material-coated carbon nanotubes that flows over the surface of an immiscible liquid within a flow channel. Within the interface, the carbon nanotubes self-organize via liquid crystal phenomena and globally align along the liquid flow direction. By translating the interface across the substrate, large-area, wafer-scale films of aligned carbon nanotubes can be deposited on the surface of the substrate in a continuous and scalable process.

A metal mask substrate includes a metal obverse surface configured such that a resist is placed on the obverse surface. The obverse surface has a three-dimensional surface roughness Sa of less than or equal to 0.11 μm. The obverse surface also has a three-dimensional surface roughness Sz of less than or equal to 3.17 μm.

According to one embodiment, a deposition device includes a stage, a deposition head opposed to the stage, and a chamber accommodating the stage and the deposition head. The deposition head comprises a deposition source heating a material and generating vapor, a nozzle connected to the deposition source to emit the vapor generated by the deposition source, a control plate comprising a sleeve surrounding the nozzle, and a movement mechanism moving the control plate along an extension direction of the sleeve.

According to one embodiment, a deposition device includes a stage, a deposition head opposed to the stage, and a chamber accommodating the stage and the deposition head. The deposition head comprises a deposition source heating a material and generating vapor, a nozzle connected to the deposition source to emit the vapor generated by the deposition source, a control plate comprising a sleeve surrounding the nozzle, and a movement mechanism moving the control plate along an extension direction of the sleeve.

An organic light emitting display device includes a display panel including a display region where a plurality of pixels are disposed, a pad region including a bending region and a pad electrode region where pad electrodes are disposed, a polarizing layer disposed in the display region, and a lower protection film disposed on a lower surface of the display panel. The lower protection film includes a first and a second lower protection film pattern. The first lower protection film pattern is disposed in the display region, and the second lower protection film pattern in the pad electrode region such that a lower surface of the display panel in the bending region is exposed. The bending protection layer has an upper surface with a height that is less than a height of the polarizing layer, and is disposed in the bending region on the display panel.

An array substrate, a display panel, and a display device are disclosed. The array substrate includes a substrate and an array functional layer. The array substrate is provided with a through hole area including a through hole, a buffer area provided around the through hole area, and a display area provided around the buffer area. The buffer area includes part of the substrate and an inorganic film layer provided by the array functional layer. At least a groove is formed in the inorganic film layer around the through hole area, and the groove has a closed ring shape or a non-closed ring shape.

A method for depositing a film on a substrate, which includes the steps of forming a film using a liquid composition that includes a neutral surfactant and a charged lamellar compound, placing the film in contact with the substrate and depositing the film on substrate. Also, a process for analyzing a substrate onto which a film has been deposited by the method.

A method for manufacturing a mask includes providing a mask mother substrate including a first portion and a plurality of second portions adjacent to the first portion, forming a reflecting plate on the mask mother substrate, forming a photoresist layer on the reflecting plate, removing a third portion of the photoresist layer that overlaps the plurality of second portions using an auxiliary mask, removing a fourth portion of the reflecting plate that overlaps the plurality of second portions, and removing the plurality of second portions of the mask mother substrate using a laser.

A method for manufacturing a mask includes providing a mask mother substrate including a first portion and a plurality of second portions adjacent to the first portion, forming a reflecting plate on the mask mother substrate, forming a photoresist layer on the reflecting plate, removing a third portion of the photoresist layer that overlaps the plurality of second portions using an auxiliary mask, removing a fourth portion of the reflecting plate that overlaps the plurality of second portions, and removing the plurality of second portions of the mask mother substrate using a laser.

A method for manufacturing a mask may include the following steps: preparing a substrate; providing a first coating, which may be optically transparent, may cover a covered portion of the substrate, and may expose exposed portions of the substrate; forming a scattering layer between the first coating layer and the covered portion of the substrate; and removing the exposed portions of the substrate to form mask holes.