A mask assembly includes a frame including a frame opening, and a mask disposed on the frame. The mask includes a body portion including an upper surface and a lower surface opposing each other and deposition openings spaced apart from each other, protrusions protruding from the upper surface and surrounding the corresponding deposition openings, and at least one step formation pattern overlapping the protrusions in a plan view and disposed in the body portion.

A manufacturing method of a display device includes providing a first organic layer in a display area and a non-display area, to cover a pixel electrode and a pad electrode, respectively, providing a first electrode of a light emitting element, in the display area, the first organic layer being between the pixel electrode and the first electrode, after forming the first electrode, removing a portion of the first organic layer which is in the non-display area, to expose the pad electrode from the first organic layer; and providing a light emitting layer of the light emitting element, corresponding to the first electrode.

The present invention relates to a process for the preparation of a top-gate, bottom-contact organic field effect transistor on a substrate, which organic field effect transistor comprises source and drain electrodes, a semiconducting layer, a cured first dielectric layer and a gate electrode, and which process comprises the steps of: i) applying a composition comprising an organic semiconducting material to form the semiconducting layer, ii) applying a composition comprising a first dielectric material and a crosslinking agent carrying at least two azide groups to form a first dielectric layer, iii) curing portions of the first dielectric layer by light treatment, iv) removing the uncured portions of the first dielectric layer, and v) removing the portions of the semiconducting layer that are not covered by the cured first dielectric layer, wherein the first dielectric material comprises a star-shaped polymer consisting of at least one polymer block A and at least two polymer blocks B, wherein each polymer block B is attached to the polymer block A, and wherein at least 60 mol % of the repeat units of polymer block B are selected from the group consisting of Formulas (1A), (1B), (1C), (1D), (1E) and (1F), wherein R.sup.1, R.sup.2, R.sup.3, R.sup.4, R.sup.5, R.sup.6, R.sup.7 and R.sup.8 are independently and at each occurrence H or C.sub.1-C.sub.10-alkyl. ##STR00001##

An OLED, a method for fabricating the same, and a display device are disclosed. The OLED includes a first electrode, a first carrier transporting layer, an organic light emitting layer, a second carrier transporting layer, a second electrode, and a light extracting layer between the first electrode and the organic light emitting layer. The light extracting layer is made from a first carrier transporting material. The light extracting layer is formed between the first electrode and the organic light emitting layer at a light exit side of the OLED, and is formed from the first carrier transporting material. This increases the light extracting efficiency of the OLED. The light extracting layer further acts as the first carrier transporting layer, thus simplifying the structure of OLED, making OLED easy to fabricate, and efficiently controlling cost.

A display device includes: a substrate; an inorganic insulating layer disposed on the substrate; a conductor disposed on the inorganic insulating layer; and an organic insulating layer disposed on the conductor, where an opening is defined through the organic insulating layer to expose a part of the upper surface of the conductor, and at least one material selected from a siloxane, a thiol, a phosphate, a disulfide including a sulfur series, and an amine is bonded on the part of the upper surface of the conductor exposed through the opening.

A display device includes: a substrate; an inorganic insulating layer disposed on the substrate; a conductor disposed on the inorganic insulating layer; and an organic insulating layer disposed on the conductor, where an opening is defined through the organic insulating layer to expose a part of the upper surface of the conductor, and at least one material selected from a siloxane, a thiol, a phosphate, a disulfide including a sulfur series, and an amine is bonded on the part of the upper surface of the conductor exposed through the opening.

A method for the fabrication of organic electronic devices includes forming a fluoropolymer layer over a first area of a substrate and a first set of organic electronic devices. The first set of organic electronic devices are pre-fabricated on a second area of the substrate. The method further includes selectively removing the formed fluoropolymer layer from areas within the first area of the substrate by using a liquid solvent. The method further includes subsequent fabrication of organic electronic devices on the substrate.

A method of patterning a substrate includes applying a first potential to a spray nozzle, applying a second potential to at least one first cell electrode among a plurality of cell electrodes on a first surface of the substrate, applying a third potential to at least one second cell electrode excluding the at least one first cell electrode among the cell electrodes, and applying a fourth potential to a second surface that is opposite to the first surface of the substrate.

The present disclosure discloses a method for manufacturing a light-emitting device using laser etching including: a first light-emitting layer forming step for depositing a first light-emitting layer on an surface of a hole transport layer deposited on an upper surface of an anode substrate; a first light-emitting device forming step for etching the first light-emitting layer to form a first light-emitting device; a second light-emitting layer depositing step for depositing a second light-emitting layer on a region including the upper surface of the hole transport layer; a second light-emitting device forming step for etching the second light-emitting layer to form a second light-emitting device; a third light-emitting layer depositing step for depositing a third light-emitting layer on a region including the upper surface of the hole transport layer; and a third light-emitting device forming step for etching the third light-emitting layer to form a third light-emitting device.

According to one embodiment, a method of manufacturing a display device, a substrate including a pair of partitions and a lower electrode disposed between the pair of partitions is formed. Then, an organic EL layer including a first portion including a pair of end surfaces which cover the lower electrode and are in contact with side surfaces of the pair of partitions, and a second portion located on each of the pair of partitions and spaced apart from the first portion, is formed. Thereafter, the second portion is removed by etching. Further, an upper electrode which covers the first portion is formed.