The present disclosure provides a light-emitting display device including a first substrate and a second substrate, a first circuit layer provided on one surface of the first substrate, a second circuit layer provided on one surface of the second substrate facing the first substrate, a first pad layer provided on one surface of the first circuit layer, a second pad layer provided on one surface of the second circuit layer and electrically connected to the first pad layer, and a light-emitting element layer provided on the other surface of the second substrate that does not face the first substrate, and a method of manufacturing the same.

A display device includes a flexible substrate, a self-luminescent element, and a support member. The flexible substrate has a first face and a second face opposed to the first face. The self-luminescent element is provided on the first face of the flexible substrate. The support member includes a magnetic material and is provided on the second face of the flexible substrate.

Disclosed herein are sealed devices comprising a first substrate, a second substrate, an inorganic film between the first and second substrates, and at least one weld region comprising a bond between the first and second substrates. The weld region can comprise a chemical composition different from that of the inorganic film and the first or second substrates. The sealed devices may further comprise a stress region encompassing at least the weld region, in which a portion of the device is under a greater stress than the remaining portion of the device. Also disclosed herein are display and electronic components comprising such sealed devices.

Disclosed herein are sealed devices comprising a first substrate, a second substrate, an inorganic film between the first and second substrates, and at least one weld region comprising a bond between the first and second substrates. The weld region can comprise a chemical composition different from that of the inorganic film and the first or second substrates. The sealed devices may further comprise a stress region encompassing at least the weld region, in which a portion of the device is under a greater stress than the remaining portion of the device. Also disclosed herein are display and electronic components comprising such sealed devices.

The present invention relates to a method for laminating solar cell modules comprising a plurality of solar cells electrically connected in series. The method comprises: providing a first and a second flexible substrate portion suitable for roll-to-roll deposition; providing a plurality of first electrodes on said first substrate portion and a plurality of second electrodes on said second substrate portion, wherein said plurality of first and second electrodes are provided as stripes spatially separated such that a plurality of gaps is formed; depositing a continuous or discontinuous active layer on said plurality of first electrodes or said plurality of second electrodes, where in said continuous or discontinuous active layer is an organic active layer; laminating by means of heat and pressure said first and said second substrate portions together in a roll-to-roll process such that the active layer is brought into physical contact with the other one of said plurality first electrodes or said plurality of second electrodes and such that the active layer is brought into electrical contact with said plurality of first electrodes and said plurality of second electrodes. The plurality of first electrodes is arranged off-set relative said plurality of second electrodes such that each of said plurality of gaps between said plurality of second electrodes are fully covered at least in one direction by respective one of said plurality of first electrodes. The present invention also relates to a solar cell module.

The present invention relates to a method for laminating solar cell modules comprising a plurality of solar cells electrically connected in series. The method comprises: providing a first and a second flexible substrate portion suitable for roll-to-roll deposition; providing a plurality of first electrodes on said first substrate portion and a plurality of second electrodes on said second substrate portion, wherein said plurality of first and second electrodes are provided as stripes spatially separated such that a plurality of gaps is formed; depositing a continuous or discontinuous active layer on said plurality of first electrodes or said plurality of second electrodes, where in said continuous or discontinuous active layer is an organic active layer; laminating by means of heat and pressure said first and said second substrate portions together in a roll-to-roll process such that the active layer is brought into physical contact with the other one of said plurality first electrodes or said plurality of second electrodes and such that the active layer is brought into electrical contact with said plurality of first electrodes and said plurality of second electrodes. The plurality of first electrodes is arranged off-set relative said plurality of second electrodes such that each of said plurality of gaps between said plurality of second electrodes are fully covered at least in one direction by respective one of said plurality of first electrodes. The present invention also relates to a solar cell module.

An organic light emitting diode display panel is disclosed. The organic light emitting diode display panel includes a first substrate and a second substrate disposed opposite to each other. The first substrate includes a first lead connected to a cathode. The second substrate includes a second lead connected to a peripheral circuit. The first lead is connected to the second lead through a connection portion.

The present disclosure relates to package structure, packaging method and display device. A package structure comprises: a first substrate and a second substrate disposed opposite to each other, a peripheral portion of at least one of the first substrate and the second substrate being provided with a sealing hole; a first sealing structure disposed between the first substrate and the second substrate and located at a peripheral region of the first substrate; and a second sealing structure disposed in the sealing hole, wherein the first sealing structure is bonded to the second sealing structure.

A bonding device includes: a stage and a pressing part, which is placed on the stage and is movable toward the stage. A first layer, which is disposed on an upper surface of the stage, includes a first flat portion and first bending portions. A second layer, which is disposed below a lower surface of the pressing part, includes a second flat portion and second bending portions. The first and second bending portions may be disposed between the stage and the pressing part, in a state bent with curvatures, respectively. The curvature of a lower surface of each of the second bending portions is smaller than the curvature of an upper surface of each of the first bending portions.

A bonding device includes: a stage and a pressing part, which is placed on the stage and is movable toward the stage. A first layer, which is disposed on an upper surface of the stage, includes a first flat portion and first bending portions. A second layer, which is disposed below a lower surface of the pressing part, includes a second flat portion and second bending portions. The first and second bending portions may be disposed between the stage and the pressing part, in a state bent with curvatures, respectively. The curvature of a lower surface of each of the second bending portions is smaller than the curvature of an upper surface of each of the first bending portions.