The disclosure provides an organic light-emitting display screen and a manufacturing method thereof. The organic light-emitting display screen includes a filter substrate, and further includes a color filter layer, a cathode layer, an organic light-emitting layer and an anode array sequentially formed on the filter substrate. The anode array includes a number of anode units spaced apart from each other, the color filter layer includes a number of filter units, and each of the anode units corresponds to each of the filter units.

The present disclosure relates to a display panel, a display device, and a method of manufacturing the display panel. The display panel includes a first substrate and a second substrate opposite to each other, a bonding portion that bonds a first peripheral region of the first substrate and a second peripheral region of the second substrate, and a protrusion disposed on at least one of the first peripheral region of the first substrate and the second peripheral region of the second substrate, wherein the protrusion is embedded in the bonding portion.

A display apparatus includes: a first semiconductor substrate that includes a light emitting unit and a first drive circuit, the first drive circuit driving the light emitting unit; and a second semiconductor substrate that includes a second drive circuit to be electrically connected to the first drive circuit, the second semiconductor substrate being bonded to the first semiconductor substrate.

A film-laminated metal sheet including a resin film configured to coat a metal sheet on at least one surface, wherein an arithmetic mean height Sa.sub.0 of a surface of the resin film is 3.0 nm or smaller, and an arithmetic mean height change ratio {(Sa.sub.1/Sa.sub.0)×100} of the surface of the resin film is 80% to 120%, where Sa.sub.1 denotes an arithmetic mean height of the surface of the resin film after thermal treatment at 100° C.

A display device includes: a first substrate that includes a semiconductor material layer in which a transistor has been formed, the transistor driving a light-emitting part that is included in a pixel; and a second substrate that includes a predetermined circuit. The first substrate and the second substrate are stuck together in such a way that respective joint surfaces face each other. A pad opening is provided from a side of the first substrate to face a pad electrode that has been provided on a side of the respective joint surfaces, in such a way that the pad electrode is exposed on a bottom surface.

The present invention provides a display panel packaging method and a packaging structure. The display panel packaging method includes: providing a first substrate and forming a water-blocking layer, dispensing a sealant on a second substrate, coating a polymeric adhesive material in a region surrounded by the sealant, coating a light-absorbing material on the polymeric adhesive material, bonding the two substrates and uniformly mixing the polymeric adhesive material and the light-absorbing material to form a uniformly mixed film, and curing them and finishing packaging. This display panel packaging is effective.

Wafer bonded GaN monolithic integrated circuits and methods of manufacture of wafer bonded GaN monolithic integrated circuits and their related structures for electronic and photonic integrated circuits and for multi-functional integrated circuits, are described herein. Other embodiments are also disclosed herein.

The present application discloses an organic light emitting diode display panel having a plurality of subpixels. The organic light emitting diode display panel includes an array substrate; and a counter substrate facing the array substrate. The counter substrate includes a plurality of organic light emitting diodes. The array substrate includes a first base substrate and a plurality of thin film transistors on the first base substrate for driving light emission of the plurality of organic light emitting diodes in the counter substrate.

The present invention provides an organic light emitting diode display panel and a fabricating method thereof. The organic light emitting diode display panel includes a lower substrate, having one side extending to form a signal path; an upper cover plate on the lower substrate, wherein a lower surface of the upper cover plate is connected to an upper surface of the lower substrate; and a barrier film package bag enclosing the upper cover plate and the lower substrate from a side away from the signal channel. The method of fabricating the OLED display panel includes following steps: forming a lower substrate; forming an upper cover plate; bonding the upper cover plate to the lower substrate; and packaging the display panel to be packaged by vacuum thermocompression. The present invention simplifies the packaging of the OLED display panel and can meet the package requirements of various types of OLED display panels.

A display apparatus, includes: a first pixel, a second pixel, and a third pixel each configured to emit different colors; an organic light-emitting diode on a substrate and including a pixel electrode, an intermediate layer, and an opposite electrode; a black matrix on the organic light-emitting diode; a column spacer on the same layer as the black matrix and spaced apart from the black matrix by a first distance in a plan view; and a first quantum conversion layer on the substrate to correspond to an emission area of the first pixel and including first quantum dots.