According to one aspect of the invention, a flexible pad for a display device lamination process includes: a generally straight area having an upper surface defining substantially the same height along a first direction and a generally convex shape along a second direction generally perpendicular to the first direction; a first inclined area having a first upper surface inclined along the first direction at a first inclination angle and being generally flat along the second direction; and a second inclined area disposed between the first inclined area and the generally straight area, wherein the second inclined area has a second upper surface inclined along the first direction at a second inclination angle smaller than the first inclination angle.

An apparatus and method for manufacturing a display device are provided. The apparatus for manufacturing the display device, includes: a stage, and an ejection head including an ejection outlet, which is open upward in a first direction. The ejection head is disposed under the stage and configured to move in a second direction, which intersects the first direction. “upward in the first direction” is opposite to a direction of gravity.

A display device includes: a resin layer on the circuit layer including a groove surrounding and separating a display area; light-emitting elements on an upper surface of the resin layer so as to emit light with luminances controlled by the currents; a sealing layer covering the light-emitting elements; a second substrate above the sealing layer; a sealing material provided between the sealing layer and the second substrate sc as to surround the display area and the groove; and a filling layer surrounded by the sealing material between the sealing layer and the second substrate. The groove is formed along a line describing a shape that is inscribed in a rectangle and not in contact with corners of the rectangle as viewed in a direction vertical to the upper surface of the resin layer.

A display device manufacturing method according to the disclosure includes the steps of forming a first resin layer serving as a first flexible substrate on a first mother substrate, forming a first light-emitting layer on the first resin layer, and forming, on the first light-emitting layer, a first encapsulating layer encapsulating the first light-emitting layer, forming a second resin layer serving as a second flexible substrate on a second mother substrate, forming a second light-emitting layer on the second resin layer, and forming, on the second light-emitting layer, a second encapsulating layer encapsulating the second light-emitting layer, bonding the first mother substrate and the second mother substrate with a buffer sheet interposed between the first mother substrate and the second mother substrate so that the first encapsulating layer and the second encapsulating layer face each other, peeling the first resin layer from the first mother substrate in a state where the first resin layer and the second resin layer are layered with the buffer sheet interposed between the first resin layer and the second resin layer, and bonding a first support film to the first resin layer.

A display device includes: a resin layer on the circuit layer including a groove surrounding and separating a display area; light-emitting elements on an upper surface of the resin layer so as to emit light with luminances controlled by the currents; a sealing layer covering the light-emitting elements; a second substrate above the sealing layer; a sealing material provided between the sealing layer and the second substrate so as to surround the display area and the groove; and a filling layer surrounded by the sealing material between the sealing layer and the second substrate. The groove is formed along a line describing a shape that is inscribed in a rectangle and not in contact with corners of the rectangle as viewed in a direction vertical to the upper surface of the resin layer.

The present disclosure discloses a display panel and a method for manufacturing the same, a bonding method, and a display device. The display panel is provided with a bonding area and includes a bonding structure in the bonding area, and the bonding structure is provided with a through hole penetrating along a thickness direction of the bonding structure. The present disclosure helps to improve the bonding efficiency between the display panel and a flexible printed circuit.

A transparent display panel, a method for manufacturing the same, and a transparent display device are provided. the transparent display panel includes a first display substrate including: a first substrate and first pixel units thereon; and a second display substrate including: a second substrate and second pixel units thereon, the second pixel units are in one-to-one correspondence with the first pixel units, each first pixel unit includes a first display unit and a first transparent unit, and each second pixel unit includes a second display unit and a second transparent unit, an orthographic projection of the first display unit on the second substrate substantially coincides with that of the corresponding second display unit on the second substrate, and an orthographic projection of the first transparent unit on the second substrate substantially coincides with that of the corresponding second transparent unit on the second substrate.

The present disclosure relates to a display substrate. The display substrate may include a base substrate; and a plurality of pixels in a display area on the base substrate. At least one of the plurality of pixels includes a first sub-pixel and a third sub-pixel. The first sub-pixel may include an OLED component that emits light of a first color, the third sub-pixel may include a LED component that emits light of a third color, and the first color and the third color are different colors. All sub-pixels including OLED components may be disposed on a same side of the base substrate, and all sub-pixels including LED components may be disposed on another side of the base substrate opposite the side on which the OLED components are disposed.

The present disclosure provides a back plate for OLED display substrate, and a method for manufacturing the same. The back plate comprises a pixel definition layer comprising a body layer and an interface layer disposed on the surface of the body layer. The interface layer exhibits different lyophilic or lyophobic properties with respect to a functional layer of the OLED depending on the temperature of the interface layer. When the OLED display substrate is manufactured by using the back plate according the present disclosure, the cost can be reduced, and the device yield of the display substrate can be ensured.

A display motherboard and a manufacturing method thereof are provided. The display motherboard includes a first substrate and a second substrate that are assembled, a plurality of mutually independent display devices located between the first substrate and the second substrate, a first seal, and a second seal. The first seal is provided in a peripheral area of the display motherboard, the second seal is provided in a cutting area of the display motherboard, the cutting area is located around each of the display devices, and the second seal surrounds at least one of the display devices.