H10K71/50

Roll press method and roll press system

A roll press method according to an embodiment comprises a roll gap measuring step for measuring a roll gap between an outer peripheral surface of the first roll and an outer peripheral surface of the second roll at one or more positions in a width direction of the first roll while rotating the first roll and the second roll and storing the measured roll gap and rotation angles of the first roll and the second roll in association with each other; and a roll press step for adjusting, according to the rotation angles, a position in the facing direction of the first roll by the adjustment mechanism such that the roll gap is kept within a predetermined variation range with respect to a target value and pressurizing the work by using the first roll in which positions are adjusted in accordance with the rotation angle and the second roll.

METHOD FOR MANUFACTURING DISPLAY DEVICE
20210050559 · 2021-02-18 ·

A display device manufacturing method according to the disclosure includes the steps of forming a first resin layer serving as a first flexible substrate on a first mother substrate, forming a first light-emitting layer on the first resin layer, and forming, on the first light-emitting layer, a first encapsulating layer encapsulating the first light-emitting layer, forming a second resin layer serving as a second flexible substrate on a second mother substrate, forming a second light-emitting layer on the second resin layer, and forming, on the second light-emitting layer, a second encapsulating layer encapsulating the second light-emitting layer, bonding the first mother substrate and the second mother substrate with a buffer sheet interposed between the first mother substrate and the second mother substrate so that the first encapsulating layer and the second encapsulating layer face each other, peeling the first resin layer from the first mother substrate in a state where the first resin layer and the second resin layer are layered with the buffer sheet interposed between the first resin layer and the second resin layer, and bonding a first support film to the first resin layer.

DISPLAY PANEL AND METHOD FOR MANUFACTURING SAME, BONDING METHOD, AND DISPLAY DEVICE

The present disclosure discloses a display panel and a method for manufacturing the same, a bonding method, and a display device. The display panel is provided with a bonding area and includes a bonding structure in the bonding area, and the bonding structure is provided with a through hole penetrating along a thickness direction of the bonding structure. The present disclosure helps to improve the bonding efficiency between the display panel and a flexible printed circuit.

METHOD FOR BONDING A SEMICONDUCTOR SUBSTRATE TO A CARRIER
20210090891 · 2021-03-25 ·

A method for fabricating a semiconductor device includes providing a semiconductor substrate and bonding the semiconductor substrate to a carrier. The semiconductor substrate includes an inert material layer and a semiconductor layer on the inert material layer. The semiconductor substrate is bonded to the carrier such that the inert material layer is between the carrier and the semiconductor substrate. By including an inert material layer between the carrier and the semiconductor substrate, a barrier against diffusion for any bonding agents used to bond the semiconductor substrate to the carrier is formed, thereby preserving the integrity of the semiconductor layer and allowing for the easy removal of the semiconductor substrate from the carrier.

DISPLAY MODULE AND FULL LAMINATION METHOD THEREOF
20210057673 · 2021-02-25 ·

The present invention provides a display module and a full lamination method. The display module includes a cover plate, a glass substrate, a display panel, and an adhesive layer. The adhesive layer includes a main part and an extension part. The adhesive layer is extended beyond the glass substrate, and UV irradiation is performed on a lateral side of the display module to solidify the extension part, so that impurities such as ambient water/moisture are prevented from entering the inside of the display module. Two deaerating treatments are performed to effectively avoid occurrence of bubbles at a boundary between a visible region and a black matrix region.

FLEXIBLE ELECTRONIC DEVICE AND MANUFACTURING METHOD THEREOF
20210076488 · 2021-03-11 ·

A flexible electronic device is disclosed and includes a first flexible substrate, a stress compensation adhesive layer, a second flexible substrate, and an element layer. The stress compensation adhesive layer is disposed on the first flexible substrate. The second flexible substrate is disposed on the stress compensation adhesive layer, in which the second flexible substrate is adhered to the first flexible substrate through stress compensation adhesive layer. The element layer is disposed on the second flexible substrate.

HYBRID STRUCTURE USING GRAPHENE-CARBON NANOTUBE AND PEROVSKITE SOLAR CELL USING THE SAME

Disclosed are a hybrid structure using a graphene-carbon nanotube and a perovskite solar cell using the same. The hybrid structure includes a graphene-carbon nanotube formed by laminating a second graphene coated with a polymer on an upper surface of a first graphene coated with a carbon nanotube. The perovskite solar cell includes: a substrate; a first electrode formed on the substrate and including a fluorine doped thin oxide (FTO); an electron transfer layer formed on the first electrode and including a compact-titanium oxide (c-TiO.sub.2); a mesoporous-titanium oxide (m-TiO.sub.2) formed on the electron transfer layer; a perovskite layer formed on the m-TiO.sub.2 and including a perovskite compound; and a graphene-carbon nanotube hybrid structure formed on the perovskite layer.

LIGHT EXTRACTION SUBSTRATE OF ORGANIC LIGHT-EMITTING DEVICE AND METHOD OF FABRICATING THE SAME
20210210732 · 2021-07-08 ·

Various aspects of a light extraction substrate, an organic light emitting device, and methods of fabrication are provided. A light extraction substrate of an organic light-emitting device includes a light-scattering layer disposed on a base substrate and contains a first material, and a number of holes (hole diameters ranging from 350 nm to 450 nm) extending between the first surface and the second surface. A planarization layer (thickness not greater than 200 nm) is disposed on the light-scattering layer and contains a second material.

Display device and method of fabricating the same

A display device includes a display area, a test pad, a plurality of first test transistors, and at least one outline. The display area includes pixels coupled to data lines and scan lines. The test pad receives a test signal. The first test transistors are coupled between the data lines of the display area and the test pad. The at least one outline is coupled between one of the first test transistors and the test pad. The at least one outline is located in a non-display area outside the display area.

Display device and method of fabricating the same

A display device includes a display area, a test pad, a plurality of first test transistors, and at least one outline. The display area includes pixels coupled to data lines and scan lines. The test pad receives a test signal. The first test transistors are coupled between the data lines of the display area and the test pad. The at least one outline is coupled between one of the first test transistors and the test pad. The at least one outline is located in a non-display area outside the display area.