Patent classifications
H10K71/50
Organic EL panel, method for producing same, and color filter substrate
An organic EL panel includes: an organic EL substrate; a color filter substrate; and a resin layer, wherein the organic EL substrate and the color filter substrate are adhered to each other via the resin layer, the color filter substrate further includes a moisture absorbent layer, the moisture absorbent layer being vapor-deposited on the colored layers, facing the resin layer, and containing magnesium oxide, and a temperature of the second substrate during vapor deposition of the moisture absorbent layer is 200 degrees Celsius or lower.
Articles Including Nanostructured Surfaces and Enclosed Voids, and Methods of Making Same
The present disclosure provides an article including a layer having a nanostructured first surface including nanofeatures and an opposing second surface, and an organic layer including a major surface attached to a portion of the nanofeatures. The nanostructured first surface includes protruding features that are formed of a single composition and/or recessed features. The nanofeatures and the major surface of the second layer together define at least one void. The present disclosure also provides a method of making the article including contacting nanofeatures of a layer having a nanostructured surface with a major surface of an organic layer and reacting at least one material to secure the two layers together. In addition, the present disclosure provides an optical information display and an OLED device including the article. The nanostructured surface of the article is protected from damage and contamination by the organic layer.
DISPLAY DEVICE AND METHOD OF MANUFACTURING THE SAME
A display device includes a first substrate, a second substrate comprising a pixel portion configured to display an image, and a dummy portion spaced from the pixel portion, a side of the dummy portion being exposed to the outside, and an interlayer between the first substrate and the second substrate, wherein the pixel portion and the dummy portion each include multiple layers, and at least one layer of the pixel portion and at least one layer of the dummy portion include a same material.
Lighting device, light-emitting device, and manufacturing method and manufacturing apparatus thereof
The sizes of an evaporation mask used for a full-color light-emitting device and an evaporation mask used for a lighting device are different from each other. For this reason, separate evaporation masks are necessary, and in the case of processing a large number of substrates at once, many evaporation masks are prepared in accordance with the number of substrates to be processed, thereby increasing the total footprint of a manufacturing apparatus. One object of the present invention is to solve a problem of such an increase. A full-color display device can be manufactured by using a color filter and white light-emitting elements in combination. By this manner, a manufacturing line for the light-emitting device can have some steps in common with a manufacturing line for the lighting device; consequently, the total footprint of the manufacturing apparatus is reduced.
Organic light emitting diode display panel with barrier film package bag and fabricating method thereof
The present invention provides an organic light emitting diode display panel and a fabricating method thereof. The organic light emitting diode display panel includes a lower substrate, having one side extending to form a signal path; an upper cover plate on the lower substrate, wherein a lower surface of the upper cover plate is connected to an upper surface of the lower substrate; and a barrier film package bag enclosing the upper cover plate and the lower substrate from a side away from the signal channel. The method of fabricating the OLED display panel includes following steps: forming a lower substrate; forming an upper cover plate; bonding the upper cover plate to the lower substrate; and packaging the display panel to be packaged by vacuum thermocompression. The present invention simplifies the packaging of the OLED display panel and can meet the package requirements of various types of OLED display panels.
Substrate-sealing method, frit and electronic device
The present disclosure provides a substrate-sealing method, frit and an electron device, and relates to the field of sensitive electronic components sealing technology. The method includes: coating glass cement on a first glass substrate within a sealing area, the glass cement including carbon nanotubes; pressing the first glass substrate and a second glass substrate together, and melting and sintering the glass cement between the first glass substrate and the second glass substrate at the sealing area by irradiating the sealing area with a laser.
MANUFACTURING METHOD OF A RIGID ORGANIC LIGHT-EMITTING DIODE (OLED) DISPLAY PANEL AND A DISPLAY PANEL
Disclosed is a manufacturing method of a rigid organic light-emitting diode (OLED) display panel and a display panel. The method comprises steps of providing a first substrate having a first glass substrate and a flexible film; coating an organic compound on the first glass substrate; providing a second substrate; packaging the display area; and cutting and stripping a part of the first glass substrate at the non-display area of the packaged display panel, thereby improving the screen accounting of the display area in the rigid OLED display panel.
DISPLAY SUBSTRATE, PREPARATION METHOD THEREOF, AND DISPLAY DEVICE
The present disclosure relates to a display substrate. The display substrate may include a base substrate; and a plurality of pixels in a display area on the base substrate. At least one of the plurality of pixels includes a first sub-pixel and a third sub-pixel. The first sub-pixel may include an OLED component that emits light of a first color, the third sub-pixel may include a LED component that emits light of a third color, and the first color and the third color are different colors. All sub-pixels including OLED components may be disposed on a same side of the base substrate, and all sub-pixels including LED components may be disposed on another side of the base substrate opposite the side on which the OLED components are disposed.
DISPLAY PANEL PACKAGING METHOD AND PACKAGING STRUCTURE
The present invention provides a display panel packaging method and a packaging structure. The display panel packaging method includes: providing a first substrate and forming a water-blocking layer, dispensing a sealant on a second substrate, coating a polymeric adhesive material in a region surrounded by the sealant, coating a light-absorbing material on the polymeric adhesive material, bonding the two substrates and uniformly mixing the polymeric adhesive material and the light-absorbing material to form a uniformly mixed film, and curing them and finishing packaging. This display panel packaging is effective.
DISPLAY DEVICE AND METHOD FOR MANUFACTURING DISPLAY DEVICE
A display device and a method for manufacturing a display device are provided. The display device includes an array substrate and a cover plate. The array substrate is a silicon-based organic light-emitting diode array substrate. An orthographic projection of the array substrate in a plane parallel to the array substrate covers an orthographic projection of the cover plate in the plane, the orthographic projection of the array substrate includes a plurality of edges, the orthographic projection of the cover plate includes a plurality of edges, the plurality of edges of the array substrate are in one-to-one correspondence to the plurality of edges of the cover plate. At least two edges of the orthographic projection of the array substrate do not overlap with corresponding edges of the orthographic projection of the cover plate and are located outside the orthographic projection of the cover plate.