A display panel includes an upper display substrate and a lower display substrate. The upper display substrate includes a base substrate, a light shielding pattern, and including an opening part defined therein which corresponds to the pixel region, a color filter overlapped with the pixel region, an encapsulation layer disposed in lower sides of the light shielding pattern and the color filter, a partition wall disposed in a lower side of the encapsulation layer, overlapped with the light shielding region, and including a partition wall opening part defined therein which corresponds to the pixel region, and a quantum dot layer disposed inside the partition wall opening part. The partition wall includes a first layer directly disposed on the bottom surface of the encapsulation layer and a second layer directly disposed on a lower side of the first layer and having a larger optical density than the first layer.

A highly reliable light-emitting device and a manufacturing method thereof are provided. A light-emitting element and a terminal electrode are formed over an element formation substrate; a first substrate having an opening is formed over the light-emitting element and the terminal electrode with a bonding layer provided therebetween; an embedded layer is formed in the opening; a transfer substrate is formed over the first substrate and the embedded layer; the element formation substrate is separated; a second substrate is formed under the light-emitting element and the terminal electrode; and the transfer substrate and the embedded layer are removed. In addition, an anisotropic conductive connection layer is formed in the opening, and an electrode is formed over the anisotropic conductive connection layer. The terminal electrode and the electrode are electrically connected to each other through the anisotropic conductive connection layer.

Disclosed in embodiments of the present disclosure are a lamination tool and a lamination method for a flexible display panel. The lamination tool for a flexible display panel includes: a flexible substrate, the flexible substrate including a flat portion located at a middle position and a deformation portion located at an edge position, the deformation portion including a tightened state and an expanded state, when the deformation portion is in the tightened state, same is used for carrying the flexible display panel to be laminated, and when the deformation portion is in the expanded state, same is used for laminating the edge of the flexible display panel and a cover plate; a pre-fixing device for pre-fixing the flexible display panel to be laminated; a first press-fitting assembly acting on the flat portion of the flexible substrate; and second press-fitting assemblies acting on the deformation portion of the flexible substrate.

The invention provides a method of forming a perovskite film for an optoelectronic device, the method comprising: applying a perovskite precursor solution to at least one part of a hydrophilic region of a substrate, wherein the hydrophilic region is bounded by a hydrophobic boundary; allowing the perovskite precursor solution to spread over the hydrophilic region, wherein the perovskite precursor solution is retained within the hydrophilic region by at least a portion of the hydrophobic boundary; and drying the perovskite precursor solution to form a perovskite film on the hydrophilic region.

The present disclosure relates to a solid-state imaging device and a manufacturing method, and an electronic apparatus that allow the reduction of manufacturing steps to reduce costs. The solid-state imaging device includes a sensor substrate in which a plurality of pixels is formed, and a logic substrate in which at least a logic circuit is formed. Then, the sensor substrate and the logic substrate form a stacked structure by a step of picking out and bonding the sensor substrate that is a non-defective product to a logic wafer in which a plurality of the logic circuits is formed before the logic substrate is separated as an individual piece. The present technology can be applied to, for example, a back-illuminated stacked CMOS image sensor.

A display device including a peripheral circuit portion with high operation stability. The display device includes a first substrate and a second substrate. A first insulating layer is on a first plane of the first substrate, and a second insulating layer is on a first plane of the second substrate. An area of the first plane of the first substrate is the same as an area of the first plane of the second substrate. The first plane of the first substrate and the first plane of the second substrate face each other. A bonding layer is between the first insulating layer and the second insulating layer. A protection film is in contact with the first substrate, the first insulating layer, the bonding layer, the second insulating layer, and the second substrate.

A method of manufacturing a display apparatus includes: forming a plurality of displays including a light-emitting diode on a surface of a first mother substrate; preparing a second mother substrate; forming a first sealed area on a surface of at least one of the first mother substrate or the second mother substrate, wherein the first sealed area surrounds each of the plurality of displays and includes a frit; firstly bonding the first mother substrate to the second mother substrate by melting the frit in the first sealed area by radiating a first laser beam; and secondly bonding the first mother substrate to the second mother substrate by forming a second sealed area in which the frit and the first mother substrate, and/or the frit and the second mother substrate, are melted and mixed with each other by radiating a second laser beam partially in the first sealed area.

A display device according to an embodiment of the present technology includes an element substrate, a transparent substrate, a light shielding filter portion, and a transparent adhesive layer. The element substrate includes a first surface, an organic EL element that emits light from a display region of the first surface, and peripheral wiring disposed to overlap in plan view with a peripheral region surrounding the display region. The transparent substrate includes a second surface facing the first surface. The light shielding filter portion includes a first color filter disposed in the peripheral region of the first surface and a second color filter disposed on the second surface to face the first color filter, and shields the peripheral wiring from light. The transparent adhesive layer is provided between the first color filter and the second color filter and bonds the element substrate and the transparent substrate to each other.

A display device includes a substrate, pixel electrodes on the substrate, a bank in which opening areas partially exposing the pixel electrodes are defined, organic light emitting layers disposed on the pixel electrodes, a common electrode disposed on the organic light emitting layers and the bank, an encapsulation layer disposed on the common electrode, a touch electrode which is disposed on the encapsulation layer and does not overlap the opening areas in a thickness direction, a first adhesive member disposed on the touch electrode, a first light blocking layer which is disposed on the first adhesive member and does not overlap the opening areas in the thickness direction, color filters which are disposed on the first adhesive member and overlap the opening areas in the thickness direction, and a support layer which is disposed on the first light blocking layer and the color filters and includes a first organic material.

The present disclosure provides a display substrate and a manufacturing method thereof, a display panel and a manufacturing method and a driving method thereof, and a display apparatus. The display substrate includes: a base substrate; and a first electrode, a signal line, and an organic layer between the first electrode and the signal line, all of which are on the base substrate, wherein the display substrate further comprises a conductive pillar configured to penetrate the organic layer and electrically connect the first electrode to the signal line.