The subject invention provides a capacitor-drive electroluminescent display, which includes a display substrate, row and column electrodes that are deposited on the substrate, and the light-emitting pixel that is electrically connected to (and in between) the row and column electrodes, wherein the light-emitting pixel includes a light-emitting device, a drive capacitor, and a charging switch; wherein, the light-emitting device and the drive capacitor is electrically connected in parallel, which is then electrically connected to the charging switch; wherein, the row or column electrode has a light-emitting windows for installation of the electroluminescent devices. Meanwhile, the subject invention also provides a method for producing the capacitor-drive electroluminescent display.

A transparent electrode material including a conductive layer having an active surface and a second surface, and an adjacent base layer, wherein: ∘ the conductive layer includes a conductive network formed by metallic nanowires and carbon nanotubes encapsulated in a conductive material; ∘ the second surface of the conductive layer has encapsulated nanowires and/or nanotubes projecting therefrom; and ∘ the encapsulated nanowires and/or nanotubes projecting from the second surface of the conductive layer are embedded in the adjacent base layer; whereby the active surface of the conductive layer is smooth and electrically active, and the transparent electrode material has a sheet resistance less than 50 Ω/sq and a transparency greater than 70%.

This invention relates to a method for fabrication of electrode material in electronic devices by in situ-electrodeposition of metal or metalloid ions that are present in the device. In another aspect, the present invention relates to electronic devices and charge storage devices comprising the electrodes manufactured by said method. Furthermore, the present invention further relates to a method of enhancing charge injection in an electronic device or charge storage device comprising the steps of: pre-assembling an electronic device or charge storage device and subsequently applying an electric field to effect electrodeposition of an electrode layer in situ by reducing the metal or metalloid ions to a non-ionic state.

A flexible array substrate structure and manufacturing method thereof are disclosed, in which the patterning process of an organic semi-conductive layer is achieved by using the inside wall of the opening of a color film layer as a bank, so that one mask can be saved. Also, a process for manufacturing a device can be simplified by an improved device structure, so that the flexible array substrate structure of the invention can be obtained by only using four masks.

Provided are a method of preparing a graphene-based thin-film laminate and the graphene-based thin-film laminate prepared by using the method. The method may include repeating following operations 60 times or less, the cycle including: (a) to (d) processes described above, a graphene-based thin-film laminate prepared using the same, and an electrode and electronic device including the graphene-based thin-film laminate.

Provided are a metal halide perovskite light emitting device and a method of manufacturing the same. The metal halide perovskite light emitting device includes a substrate, a first electrode formed on the substrate, a light emitting layer formed on the first electrode and including a metal halide perovskite material, and a second electrode disposed on the light emitting layer, the first electrode includes a conductive layer and a surface energy-tuning layer disposed on the conductive layer, the conductive layer includes a conductive polymer and a first fluorine-based material, and the surface energy-tuning layer includes a second fluorine-based material but does not include the conductive polymer. Therefore, the first electrode can come in ohmic contact with a metal halide perovskite light emitting layer by adjusting a work function, and can prevent the dissociation of excitons to enhance luminous efficiency, thereby effectively improving efficiency of a light emitting device.

An array substrate includes a base substrate, a pixel definition layer, a light-emitting layer, and a plurality of auxiliary electrodes. A pixel definition layer is formed on the base substrate, and includes patterned retaining walls and a plurality of openings defined by the retaining walls. A surface of each of the retaining walls facing away from the base substrate is provided with a first groove. A light-emitting layer is formed on the retaining wall and in the plurality of openings. The light-emitting layer conformally covers respective first grooves of the retaining walls to form respective second grooves. Each of the plurality of auxiliary electrodes is formed in a respective one of the second grooves.

An organic EL display device includes a pixel electrode, a pixel isolation insulating film on which an opening at a bottom of which the pixel electrode is exposed is formed, an aggregate of an organic material partially formed on the pixel electrode that is exposed at the bottom of the opening, an organic film, including a light emitting layer, that covers the pixel electrode and the aggregate, and an opposing electrode that covers the organic film. The aggregate is formed at a corner formed by the pixel electrode that is exposed at the bottom of the opening and an inner wall that forms the opening of the pixel isolation insulating film.

Detectors and methods of forming the same include aligning a semiconducting carbon nanotubes on a substrate in parallel to form a nanotube layer. The aligned semiconducting carbon nanotubes in the nanotube layer are cut to a uniform length corresponding to a detection frequency. Metal contacts are formed at opposite ends of the nanotube layer.

The metal thin film production method of the present invention includes, in the following order, the steps of: preparing a substrate (1) having thereon an underlayer (2) formed of an insulating resin; subjecting a surface of the underlayer (2) to a physical surface treatment for breaking bonds of organic molecules constituting the insulating resin; subjecting the substrate (1) to a heat treatment at a temperature of 200° C. or lower; applying a metal nanoparticle ink to the underlayer (2); and sintering metal nanoparticles contained in the metal nanoparticle ink at a temperature equal to or higher than a glass transition temperature of the underlayer (2). A fused layer (4) having a thickness of 100 nm or less is formed between the underlayer (2) and a metal thin film (3) formed by sintering the metal nanoparticles.