A photoelectric conversion panel includes a TFT, a photodiode disposed at an upper layer than the TFT, a first organic film formed at an upper layer than the photodiode, a first inorganic insulating film covering at least a part of the first organic film, and a second organic film covering at least a part of the first inorganic insulating film. The first inorganic insulating film includes a first hole portion connecting the first organic film and the second organic film, and a first moisture-proof portion at least a part of which is disposed at a side of the photodiode with respect to the first hole portion. The first moisture-proof portion penetrates the first organic film.

According to one embodiment, a method of manufacturing a display device, includes forming a first thin film including a first light-emitting layer over a first subpixel, a second subpixel, and a third subpixel, removing the first thin film of the second subpixel, forming a second thin film including a second light-emitting layer over the first subpixel, the second subpixel, and the third subpixel, removing the second thin film of the first subpixel and the third subpixel, removing the first thin film of the third subpixel, forming a third thin film including a third light-emitting layer over the first subpixel, the second subpixel, and the third subpixel, and removing the third thin film of the first subpixel and the second subpixel.

According to one embodiment, a method of manufacturing a display device, includes forming a first thin film including a first light-emitting layer over a first subpixel, a second subpixel, and a third subpixel, removing the first thin film of the second subpixel, forming a second thin film including a second light-emitting layer over the first subpixel, the second subpixel, and the third subpixel, removing the second thin film of the first subpixel and the third subpixel, removing the first thin film of the third subpixel, forming a third thin film including a third light-emitting layer over the first subpixel, the second subpixel, and the third subpixel, and removing the third thin film of the first subpixel and the second subpixel.

Provided are a deposition mask, a method of manufacturing a display device using the deposition mask, and a display device. The deposition mask includes a main frame defining a first opening; ribs extending away from a side of the main frame, the ribs being apart from each other and defining second openings; and bridges connecting the ribs to one another across the second openings, wherein the bridges and the ribs form the same top surface, and a thickness of each of the bridges is less than a thickness of each of the ribs.

Provided are a deposition mask, a method of manufacturing a display device using the deposition mask, and a display device. The deposition mask includes a main frame defining a first opening; ribs extending away from a side of the main frame, the ribs being apart from each other and defining second openings; and bridges connecting the ribs to one another across the second openings, wherein the bridges and the ribs form the same top surface, and a thickness of each of the bridges is less than a thickness of each of the ribs.

The embodiments provide a process for easily producing an electrode having low resistance, easily subjected to post-process and hardly impairing the device; and also provide, as its application, a production process for a photoelectric conversion device. The process comprises the steps of: coating a hydrophobic substrate directly with a dispersion of metal nanomaterial, to form a metal nanomaterial layer, coating the surface of the metal nanomaterial layer with a dispersion of carbon material, to form a carbon material layer and thereby to form an electrode layer comprising a laminate of the metal nanomaterial layer and the carbon material layer, pressing the carbon material layer onto a hydrophilic substrate so that the surface of the carbon material layer may be directly fixed on the hydrophilic substrate, and peeling away the hydrophobic substrate so as to transfer the electrode layer onto the hydrophilic substrate.

A multi-junction photovoltaic device comprising a layer of metal oxynitride between a first sub-cell and a second sub-cell is disclosed, the first sub-cell having a layer comprising a perovskite light absorber material. In addition, a method of manufacturing said multi junction photovoltaic device is disclosed. The metal oxynitride is preferably titanium oxynitride. Advantageously, the device may be produced in a simple, fast, consistent and inexpensive manner, whilst the properties of the titanium oxynitride layer may be tuned to avoid the occurrence of local shunt paths and to reduce reflection losses.

A multi-junction photovoltaic device comprising a layer of metal oxynitride between a first sub-cell and a second sub-cell is disclosed, the first sub-cell having a layer comprising a perovskite light absorber material. In addition, a method of manufacturing said multi junction photovoltaic device is disclosed. The metal oxynitride is preferably titanium oxynitride. Advantageously, the device may be produced in a simple, fast, consistent and inexpensive manner, whilst the properties of the titanium oxynitride layer may be tuned to avoid the occurrence of local shunt paths and to reduce reflection losses.

The present disclosure is directed to methods for producing a photovoltaic junction that can include coating a bare junction with a composition. In one embodiment, the composition includes a plurality of quantum dots to create a film; exposing the film to a ligand to create a first layer; coating the first layer with the composition to form a film on the first layer; and exposing the film on the first layer to the ligand to create a second layer.

An OLED panel includes a light emitting substrate and a color filter substrate. The light-emitting substrate includes a multi-layer OLED film emitting white light. The color filter substrate includes a color filter array, a conductive layer that is electrically connected to a wall-shaped elastic conductor that is wearing a metal cap. The two substrates are laminated together in a manner that the metal cap is in direct contact with cathode electrode of the OLED at the site of pixel definition layer. The total resistance of the cathode layer of the OLED is therefore reduced significantly, and voltage-drop on cathode and associated image artifacts are minimized.