A mask plate group of an organic light emitting diode (OLED) panel, a cathode evaporation method thereof and an OLED panel are provided. The OLED panel includes a display area having an imaging area, and the mask plate group includes a first mask plate and a second mask plate. The first mask plate includes a common mask opening area. The common mask opening area covers an entire of the display area. The second mask plate includes a special-shaped mask opening area. The special-shaped mask opening area covers all the display area except the imaging area.

A manufacturing method for an electronic device includes a preparation step of preparing a layered body including a substrate, two or more first electrodes, and organic layers, the substrate having a first surface and a second surface that is positioned opposite to the first surface, the two or more first electrodes positioned above the first surface of the substrate, the organic layers positioned above the first electrodes; a second electrode formation step of forming a second electrode above the organic layers so that the second electrode overlaps the two or more first electrodes when viewed in a normal direction to the first surface of the substrate; and a removal step of partly removing regions of the second electrode that is positioned between the first electrodes in plan view.

A display substrate includes a first conductive layer on a base substrate, a first insulation layer on the first conductive layer, a second conductive layer on the first insulation layer, a second insulation layer on the second conductive layer, and a third conductive layer on the second insulation layer. The third conductive layer is connected to the first conductive layer and the second conductive layer through a contact hole passing through the first insulation layer, the second conductive layer, and the second insulation layer. A sidewall of the contact hole has a stepped shape.

An OLED display substrate, a manufacturing method thereof, a packaging structure and a display device are provided. The OLED display substrate includes a display region, a barrier structure arranged at a periphery of the OLED display substrate, and a cathode lapping region arranged between the display region and the barrier structure. The OLED display substrate has an uneven surface at the cathode lapping region.

Provided is a compound represented by Formula (1). ##STR00001##

The present disclosure relates to the field of manufacturing displays, and provides a method for manufacturing a display substrate, a method for manufacturing a mask plate, and a display device. The method for manufacturing a display substrate comprises: providing a first substrate; providing a mask plate opposite to the first substrate, the mask plate comprising one or more light-transmissive regions, and an electrically conductive material is provided on a surface of the mask plate facing the first substrate; and irradiating a surface of the mask plate facing away from the first substrate with light rays, such that the electrically conductive material is transferred to a surface of the first substrate facing the mask plate, thereby forming an electrically conductive layer having one or more electrically conductive portions, wherein a projection of each of the one or more electrically conductive portions on the mask plate coincides with a respective light-transmissive region.

A display device includes: a display area; a non-display area around the display area; a substrate; and a first terminal in the non-display area on the substrate, the first terminal including: a plurality of first conductive patterns spaced apart from each other, an insulating layer covering each of the plurality of first conductive patterns, and a second conductive pattern on the insulating layer, covering the plurality of first conductive patterns, and including concave and convex portions on a surface thereof.

A thin film etchant composition for preventing re-adsorption of an etched metal and uniformly etching a thin film is provided. The thin film etchant composition includes about 43 wt % to about 46 wt % of phosphoric acid, about 5 wt % to about 8 wt % of nitric acid, about 10 wt % to about 17 wt % of acetic acid, about 1 wt % to about 3 wt % of iron nitrate, about 0.7 wt % to about 1.5 wt % of phosphate, and deionized water as a remaining amount based on a total weight of the thin film etchant composition.

The present application discloses an organic light emitting diode array substrate having a subpixel region and an inter-subpixel region. The organic light emitting diode array substrate in the inter-subpixel region includes a first base substrate; a pixel definition layer on the first base substrate for defining a plurality of subpixels; a spacer layer on a side of the pixel definition layer distal to the first base substrate; an auxiliary electrode layer on a side of the spacer layer distal to the pixel definition layer; and a second electrode layer on a side of the auxiliary electrode layer distal to the spacer layer and is electrically connected to the auxiliary electrode layer.

A method of manufacturing a display apparatus includes forming a first conductive layer on a base substrate including a panel area and a margin area disposed next to the panel area, the margin area including a dummy pattern area, forming a photoresist layer on the first conductive layer, forming a photoresist pattern by exposing and developing the photoresist layer, forming a first conductive pattern by etching the first conductive layer using the photoresist pattern, and removing the photoresist pattern. The forming the first conductive pattern includes forming a first pixel circuit pattern in the panel area, and forming a dummy pattern in the dummy pattern area of the margin area. An opening ratio of a portion where the dummy pattern is not formed with respect to the dummy pattern area is about 30% or more.