A deposition mask set includes a first mask, a second mask, and a third mask. Each of the first mask, second, and third masks includes a first edge substantially parallel to a first direction, a second edge substantially parallel to a second direction, and a plurality of first openings. Each of the openings includes a first opening side that is substantially parallel to a third direction and a second opening side that is substantially parallel to a fourth direction, and each of the openings corresponds to one of a first, second, or third color area at one of pixel areas. The third and fourth directions are not parallel to the first and second directions, and the first, second, and third color areas are adjacent to each other in the third direction.

A method of manufacturing a display panel includes forming a circuit layer including a gate, a source, and a drain on a base substrate and forming a light emitting element layer on the circuit layer. The forming of the circuit layer includes sequentially forming a preliminary metal layer, a preliminary oxide layer comprising molybdenum and tantalum, and a preliminary capping layer which comprise a preliminary electrode layer, cleaning the preliminary electrode layer, forming a photoresist layer pattern on the preliminary electrode layer, etching the preliminary electrode layer, and removing the photoresist layer pattern. During the etching of the preliminary electrode layer, a ratio between a removal speed ER.sub.1 of the preliminary oxide layer and a removal speed ER.sub.2 of the preliminary metal layer satisfies Equation 1 to maintain a low reflection property

1≤ER.sub.2/ER.sub.1≤3.   [Equation 1]

An opto-electronic device includes: a first electrode; an organic layer disposed over the first electrode; a nucleation promoting coating disposed over the organic layer; a nucleation inhibiting coating covering a first region of the opto-electronic device; and a conductive coating covering a second region of the opto-electronic device.

A method of manufacturing a display device may include sequentially forming a first conductive layer, a second conductive layer including copper (Cu), a third conductive layer, and a fourth conductive layer on a substrate, patterning the first conductive layer, the second conductive layer, the third conductive layer, and the fourth conductive layer together to form a conductive pattern including a first layer, a second layer, a third layer, and a fourth layer sequentially on the substrate, removing the fourth layer of the conductive pattern, forming a protective layer covering at least a sidewall of the conductive layer on the substrate, and forming a display element on the protective layer.

A display panel includes an emitting part including a light emitting element and a transmitting part adjacent to the emitting part and including a low adhesion part including a carbon compound. The low adhesion pattern includes fluorine (F).

An organic interposer includes dielectric material layers embedding redistribution interconnect structures, package-side bump structures located on a first side of the dielectric material layers, and die-side bump structures located on a second side of the dielectric material layers. A gap region is present between a first area including first die-side bump structures and a second area including second die-side bump structures. Stress-relief line structures are located on, or within, the dielectric material layers within an area of the gap region in the plan view. Each stress-relief line structures may include straight line segments that laterally extend along a respective horizontal direction and is not electrically connected to the redistribution interconnect structures. The stress-relief line structures may include the same material as, or may include a different material from, a metallic material of the redistribution interconnect structures or bump structures that are located at a same level.

An etching composition for a silver-containing thin film, the etching composition comprising an inorganic acid compound, a sulfonic acid compound, an organic acid compound, a nitrate, a metal oxidizing agent, an amino acid compound, and water.

A method of manufacturing an organic light-emitting display apparatus includes: forming a lift-off layer on a substrate including a first electrode, the lift-off layer including a fluoropolymer; forming a pattern layer on the lift-off layer; etching the lift-off layer between patterns of the pattern layer by utilizing a first solvent to expose the first electrode; forming an organic functional layer on the first electrode and the pattern layer, the organic functional layer including an emission layer; removing remaining portions of the lift-off layer by utilizing a second solvent; and forming a second electrode on the organic functional layer.

A method for enhancing aggregation state stability of organic semiconductor (OSC) films includes constructing the OSC film; introducing uniform and discontinuous nanoparticles on a surface of the film or an inside of the film. Electrical properties of the OSC film are not influenced by introducing the nanoparticles. Grain boundary, dislocation, stacking fault, and surface of the film are pinned by the nanoparticles, increasing potential barrier of the aggregation state evolution of the film, and thus enhancing the stability of the aggregation state and greatly improving maximum working temperature and storage lifetime of organic field-effect transistors. Under room temperature storage, morphology of the OSC film introduced with the nanoparticles is difficult to change, so that the stability of electrical properties of organic transistor components prepared from the film is ensured in a high-temperature and atmospheric working environment.

Disclosed in embodiments of the present disclosure are a display panel, a manufacturing method therefor, and a display apparatus. The display panel includes a substrate, the substrate has a plurality of sub-pixel units; each sub-pixel unit includes at least two first electrodes which are independently arranged in the same layer; each first electrode includes at least two conductive layers which are arranged in a stacked manner; an edge of a top conductive layer that is away from the substrate exceeds an edge of a bottom conductive layer; the orthographic projection of the bottom conductive layer on the substrate falls within the range of the orthographic projection of the top conductive layer on the substrate; and a portion of the edge of the top conductive layer exceeding the edge of the bottom conductive layer extends towards one side of the substrate to constitute a sloping surface.