Patent classifications
H10K71/621
ETCHANT COMPOSITION AND MANUFACTURING METHOD OF DISPLAY DEVICE USING THE SAME
An etchant composition includes: an inorganic acid compound at 9.0 wt % to 9.9 wt %; an inorganic salt compound at 5.0 wt % to 10.0 wt %; an organic acid compound at 35 wt % to 45 wt %; a lactate-based compound at 10 wt % to 20 wt %; a nitrogen cyclic compound containing oxygen at 0.1 wt % to 1.0 wt %; and a remaining amount of water such that a total weight of the etchant composition is 100 wt %, wherein the inorganic acid compound is an etchant composition having an acid dissociation constant (pKa) value of −1.0 to −3.0.
Conductor and method of manufacturing the same
A conductor includes a plurality of metal nanostructures and an organic material, where a portion of the organic material surrounding each of the metal nanostructures is selectively removed, and the conductor has a haze of less than or equal to about 1.1, a light transmittance of greater than or equal to about 85% at about 550 nm, and a sheet resistance of less than or equal to about 100 Ω/sq. An electronic device includes the conductor, and a method of manufacturing a conductor includes preparing a conductive film including a metal nanostructure and an organic material, and selectively removing the organic material from the conductive film using a cluster ion beam sputtering.
Semiconductor devices
A technique, comprising: forming in situ on a support substrate: a first metal layer; a light-absorbing layer after the first metal layer; a conductor pattern after the light-absorbing layer; and a semiconductor layer after the conductor pattern; patterning the semiconductor layer using a resist mask to form a semiconductor pattern defining one or more semiconductor channels of one or more semiconductor devices; and patterning the light-absorbing layer using the resist mask and the conductor pattern, so as to selectively retain the light-absorbing layer in regions that are occupied by at least one of the resist mask and the conductor pattern.
Method of manufacturing display device including a formation process of a conductive film and laser curing the conductive film and manufacturing device for display device
A method of manufacturing a display device includes: providing a first substrate, a second substrate, and a plurality of connection lines, wherein the first substrate has a base substrate, wherein the second substrate faces the first substrate, and wherein the plurality of connection lines are disposed between the base substrate and the second substrate; grinding a side surface of the base substrate, a side surface of the second substrate, and side surfaces of the plurality of connection lines; and simultaneously transferring a conductive film and laser-curing the conductive film, wherein the conductive film is transferred to the ground side surface of the base substrate, the ground side surface of the second substrate, and the ground side surfaces of the plurality of connection lines.
DISPLAY APPARATUS AND METHOD OF MANUFACTURING THE SAME
Provided are a display apparatus and a method of manufacturing the same. The display apparatus includes a substrate, a first conductive layer disposed on the substrate, and a first insulating pattern disposed on the first conductive layer. The first insulating pattern includes a fluorine compound and a nitrogen compound. The nitrogen compound is represented by Formula 1:
NR.sub.1R.sub.2R.sub.3OH <Formula 1> wherein in Formula 1, R.sub.1 to R.sub.3 are each independently selected from hydrogen, a substituted or unsubstituted C.sub.1-C.sub.20 alkyl group, a substituted or unsubstituted C.sub.6-C.sub.30 aryl group, and a substituted or unsubstituted C.sub.7-C.sub.30 aralkyl group.
DISPLAY DEVICE
A second connection wire is electrically connected to a first connection wire via a display-side contact portion and terminal-side contact portion in a bending section. The first connection wire and the second connection wire do not overlap each other at least partly between the display-side contact portion and terminal-side contact portion.
Electrode exhaust structure, electrode, display panel and manufacturing method therefor, and display apparatus
The disclosure relates to an electrode exhaust structure, an electrode, a display panel and a fabrication method thereof, a display device. The electrode exhaust structure includes first exhaust holes arrayed in a matrix and arranged on an electrode, and second exhaust holes arrayed in a matrix and arranged on the electrode. A column of the second exhaust holes are arranged between adjacent columns of the first exhaust holes, and a row of the second exhaust holes are arranged between adjacent rows of the first exhaust holes; the length of the second exhaust hole in the row direction is greater than or equal to the distance between the adjacent columns of the first exhaust holes; and the length of the second exhaust hole in the column direction is greater than or equal to the distance between the adjacent rows of the first exhaust holes.
Photoelectric conversion element and method of manufacturing thereof
A photoelectric conversion element includes: a first photoelectric conversion layer including: a bottom electrode; a photoelectric conversion layer; and a top electrode; and a second photoelectric conversion part including: a bottom electrode; a photoelectric conversion part; and a top electrode. A conductive layer is formed on the bottom electrode. The top electrode and the bottom electrode are electrically connected by a conductive portion and the conductive layer. The conductive portion is formed of a part of the top electrode filled in a first groove that makes a surface of the conductive layer exposed and separates a photoelectric conversion layer and a photoelectric conversion layer from each other. The top electrodes are physically separated by a second groove provided to make a step surface of a stepped portion provided in the photoelectric conversion layer exposed and have a bottom surface thereof overlap the surface of the conductive layer.
Method of forming display electrodes and pixel defining layers without an increase of masks
A method of manufacturing a light-emitting display apparatus and a light-emitting display apparatus are provided. The method includes forming a first photosensitive layer on a conductive material layer, forming a pixel electrode by etching the conductive material layer by using the first photosensitive layer as a mask, ashing the first photosensitive layer disposed on the pixel electrode, forming a pixel defining layer that covers an edge portion of the pixel electrode and includes a first opening overlapping the ashed first photosensitive layer, removing the ashed first photosensitive layer disposed in the first opening, forming an intermediate layer including a functional layer and an emission layer on the pixel defining layer, and forming an opposite electrode on the intermediate layer.
DISPLAY DEVICE
A display device includes: a substrate including a display area and a non-display area; a transistor and a light emitting element, which are disposed on the display area; a pad portion disposed in the non-display area, where the pad portion includes a first metal pattern; and a printed circuit board or a data driver, which is connected with the pad portion. The transistor includes a semiconductor layer disposed on the substrate and a source electrode or a drain electrode which is electrically connected with the semiconductor layer. The source electrode or the drain electrode includes a first layer including a first metal, a second layer including a second metal, and a third layer including the first metal, where the first metal pattern includes the first metal, and is connected with the printed circuit board or the data driver.