A flexible display device including a substrate; a driving element layer including a plurality of thin film transistors on the substrate; a display element layer including organic light-emitting diodes electrically connected to the thin film transistors on the driving element layer; a light transmissive layer on the display element layer and configured to adjust a neutral plane of the flexible display device to lie at the driving element layer and the display element layer when the flexible display device is bent; and a back plate film attached to a back side of the substrate and having a cut portion formed in a center region where the flexible display device is bent.

A flexible display and method of manufacturing the same are disclosed. In one aspect, the method includes forming a metal peroxide layer over a supporting substrate, forming a metal layer over the metal peroxide layer and forming a flexible substrate over the metal layer. The method also includes forming a display layer over the flexible substrate, irradiating the supporting substrate with laser light in a direction from the supporting substrate to the flexible substrate so as to form a metal oxide layer and separating the supporting substrate from the flexible substrate with the metal oxide layer as a boundary between the supporting substrate and the flexible substrate.

The invention relates to a method for manufacturing an electronic device, particularly a device including a flexible and/or low-cost substrate and/or carbon nanotubes, and also relates to electronic devices produced using said method. The method for manufacturing an electronic device, including a substrate mad of a material M and an active semiconductor material layer (3), includes the following steps: a) providing a carrier (10) made of an alkali metal salt or alkaline earth metal salt, preferably sodium chloride (NaCl) or potassium chloride (KCl); optionally, b) depositing a dielectric material layer (2) onto one surface of the carrier; c) forming an active semiconductor material layer (3) on one surface of the carrier when Step b) is not implemented or on the free surface of the layer when Step b) is implemented; d) forming different components of the electronic device on and/or under the layer; e) depositing a protective layer onto the layer stack, obtained in Step d), of the different components of the electronic device, said protective layer being made of the material M required for the substrate (1); and f) removing the carrier (10) by dissolving one or more of the components of said electronic device on a substrate different from the substrate (1). In said removal of the carrier, the method does not include any step for manufacturing one or more of the components of said electronic device on a substrate different from the substrate (1). The invention is of use in the field of electronics in particular.

Transfer films, articles made therewith, and methods of making and using transfer films to form an electrical stack are disclosed. The transfer films (100) may include a plurality of co-extensive electrical protolayers (22, 23, 24) forming an electrical protolayer stack (20), at least selected or each electrical protolayer independently comprising at least 25 wt % sacrificial material and a thermally stable material and having a uniform thickness of less than 25 micrometers. The transfer films may include a plurality of co-extensive electrical protolayers forming an electrical protolayer stack, at least selected or each protolayer independently exhibiting a complex viscosity of between 10.sup.3 and 10.sup.4 Poise at a shear rate of 100/s when heated to a temperature between its Tg and T.sub.dec.

The present disclosure provides a display substrate, a display panel and a display device, and belongs to the field of display technology. The display substrate includes a plurality of display islands and a plurality of connection parts; any two adjacent display islands are connected through one of the plurality of connection parts; the plurality of connection parts define a plurality of openings of a base substrate of the display substrate; at least part of the plurality of openings is provided therein with a torsional structure, the torsional structure is connected between two connection parts of connection parts defining the opening in which the torsional structure is located, the two connection parts extending in substantially a same direction; and the torsional structure is stretchable in a direction in which it is connected with the two connection parts.

The present disclosure relates to an organic light emitting display device and a method for manufacturing the same. The present disclosure suggests an organic light emitting display device including an organic layer; a display element layer including a display area representing video data and a pad area extended from the display area, on the organic layer; film elements formed on the display element layer; a film type printed circuit board connected to the pad area; and a reinforcing adhesive filling a space between the film type printed circuit board and the film elements.

A manufacturing method of an organic light emitting device may include the following. A panel displaying an image is formed. A buffering member including a dummy buffering member is adhered to the panel. A film is adhered to an upper surface of the buffering member. The film and the dummy buffering member are removed.

A method for manufacturing a flexible display device by forming a flexible base substrate on a carrier substrate, the flexible base substrate having a display region and a non-display region, forming a display unit comprising a plurality of pixels at the display region, separating the flexible base substrate from the carrier substrate, forming an adhesive layer under the flexible base substrate, forming a flexible carrier film under the adhesive layer, forming a pressed region of the adhesive layer by partially pressing the adhesive layer, and mounting a driving circuit at a portion of the non-display region overlapping the pressed region.

A method for manufacturing a display device including a light-emitting element, the method includes: storing, in a manufacturing process of the display device, a plurality of abutting positions where a back face of a support substrate locally abuts a manufacturing apparatus; forming, on a surface of the support substrate on a side on which the light-emitting element is to be formed, a peeling layer at a position opposing at least one position of the plurality of abutting positions stored; forming, on the support substrate, a resin layer to cover the peeling layer; forming a TFT layer on the resin layer; forming the light-emitting element on the TFT layer; and peeling the support substrate and the resin layer.

An organic light emitting diode (OLED) display device and a preparation method thereof, and a display apparatus are disclosed. The OLED display device includes a base substrate (21), an anode (23), a cathode (26) and an organic functional layer (25), the anode (23), the cathode (26) and the organic functional layer (25) formed on the base substrate (21), and the organic functional layer (25) located between the cathode (26) and the anode (23), the anode (23) and/or the cathode (26) being a topological insulator with a two-dimensional nanostructure, and the topological insulator with the two-dimensional nanostructure being adhered on the base substrate (21) by an adhesive layer. The OLED display device overcomes the problem of non-uniform display lightness which is caused by the high transmission resistance and high IR drop of metal electrodes of OLED display devices.