H10K71/80

STRETCHABLE DISPLAY PANEL AND METHOD FOR MANUFACTURING SAME, AND DISPLAY DEVICE
20220407023 · 2022-12-22 ·

A stretchable display panel and a method for manufacturing same, and a display apparatus, which belong to the technical field of display. The method comprises: forming an organic protection structure (100) and an inorganic protection structure (200), which are stacked, on a rigid substrate (000); forming a flexible substrate (300) on the inorganic protection structure (200); forming, on the flexible substrate (300), a plurality of pixel islands and inter-island connection pieces for connecting adjacent pixel islands; forming package layers on the pixel islands and the inter-island connection pieces; and lifting off the rigid substrate (000). The package layers are not in contact with the rigid substrate (000), but the organic protection structure (100) is always in contact with the rigid substrate (000). It is extremely easy for the organic protection structure (100) to be lifted off from the rigid substrate (000), and the probability of a crack occurring during the lifting-off process is relatively low, thereby effectively reducing the probability of package failure of the package layers, and further prolonging the service life of light-emitting devices in the pixel islands.

Process and apparatus for producing transparent electrode

The embodiments provide a process and an apparatus for easily producing a transparent electrode of low resistance and of high transparency. The process comprises: coating a hydrophobic polymer film with a dispersion of metal nanowires, press-bonding an electroconductive substrate directly onto the metal nanowires on the polymer film, and peeling and transferring the metal nanowires from the polymer film onto the conductive substrate. The embodiments also relates to an apparatus for the process.

Manufacturing method of flexible electronic substrate and substrate structure

A manufacturing method of a flexible electronic substrate and a substrate structure are disclosed. The manufacturing method includes: providing a first substrate comprising a first surface and a second surface which are opposite; forming a separation layer on the first surface of the first substrate, the separation layer being in a film form; providing a second substrate on the separation layer, the second substrate being configured as a flexible substrate; and processing the separation layer, such that at least a part of the separation layer is cracked from the film form, thereby separating the second substrate from the first substrate.

Method of manufacturing flexible OLED module

A method of manufacturing a flexible OLED module includes: forming a polymer layer on one surface of a base substrate; forming a thin glass sheet on one surface of the polymer layer; forming multiple OLED elements on one surface of the thin glass sheet; forming a protective layer on one surface of the thin glass sheet to cover the OLED elements; separating the base substrate and the polymer layer from each other through separation of the sacrificial layer by laser lift-off (LLO); and cutting the thin glass sheet and the protective layer to provide multiple unit OLED modules each including the OLED element.

Laser printing of color converter devices on micro LED display devices and methods

Embodiments disclosed herein include micro light emitting device (LED) display panels and methods of forming such devices. In an embodiment, a display panel includes a display backplane substrate, a light emitting element on the display backplane, a transparent conductor over the light emitting element, a dielectric layer over the transparent conductor, and a color conversion device over the light emitting element. In an embodiment, the dielectric layer separates the transparent conductor from the color conversion device.

Display Substrate and Preparation Method thereof, and Display Apparatus
20220393122 · 2022-12-08 ·

The present disclosure provides a display substrate and a preparation method thereof, and a display apparatus. The display substrate includes a pixel area and a hole area, the pixel area includes a display structure layer arranged on a base substrate, and the hole area includes a hole structure layer arranged on the base substrate; the hole area includes at least one stretch hole penetrating through the base substrate and the hole structure layer; an inner wall of the stretch hole includes an inorganic material inner wall section and an organic material inner wall section, the inorganic material inner wall section and the organic material inner wall section are arranged along a direction from the base substrate to the hole structure layer, and the organic material inner wall section is located on a side of the stretch hole away from the hole structure layer.

DISPLAY DEVICE AND METHOD FOR FABRICATING ELECTRONIC DEVICE USING THE SAME
20220393136 · 2022-12-08 ·

A display device includes a window, a display module disposed under the window, and a protection tape that is disposed on a rear surface of the display module and that protects the display module. The protection tape includes an insulating base layer including a first area and a second area, an adhesive layer disposed between the insulating base layer and the rear surface of the display module in the second area, and a step layer disposed on the insulating base layer in the first area. An end of the protection tape is located further outward than an end of the window with respect to a center area of the display module, and the step layer and the insulating base layer are not integrally formed with each other.

Stretch display device and preparation method

The present disclosure discloses a stretch display device and a preparation method. The method includes providing a substrate on which a flexible substrate is disposed, and a film layer constituting a thin film transistor disposed on a side of the flexible substrate away from the substrate, the film layer being away from the flexible substrate. One side defines a plurality of pixel regions; a hollow portion is formed between adjacent two of the pixel regions, the hollow portion penetrates through the film layer and the flexible substrate; and thermal separation is provided in the hollow portion via a gel; a light-emitting element is disposed in the pixel region, and an encapsulating film layer is disposed on a side of the light-emitting element and the thermal separation gel away from the flexible substrate; heating the thermal separation gel, and the flexible liner. The bottom and the substrate are peeled off. Therefore, when the substrate is peeled off by this method, the problem of breakage of the flexible substrate and the film layer constituting the thin film transistor can be alleviated, and the production yield of the stretch display device can be remarkably improved.

DISPLAY APPARATUS AND METHOD FOR MANUFACTURING DISPLAY APPARATUS

A method for manufacturing a display apparatus according to an embodiment includes: preparing a carrier substrate and forming a sacrificial layer on a top surface of the carrier substrate, where the sacrificial layer includes a cover area and an exposure area located on at least one side of the cover area; forming a first flexible material having a bottom surface in contact with the sacrificial layer on a top surface of the cover area of the sacrificial layer to expose the exposure area of the sacrificial layer; and removing the exposure area of the sacrificial layer.

Method for manufacturing display device including bonding first mother substrate and second mother substrate with buffer sheet
11515513 · 2022-11-29 · ·

A display device manufacturing method according to the disclosure includes the steps of forming a first resin layer serving as a first flexible substrate on a first mother substrate, forming a first light-emitting layer on the first resin layer, and forming, on the first light-emitting layer, a first encapsulating layer encapsulating the first light-emitting layer, forming a second resin layer serving as a second flexible substrate on a second mother substrate, forming a second light-emitting layer on the second resin layer, and forming, on the second light-emitting layer, a second encapsulating layer encapsulating the second light-emitting layer, bonding the first mother substrate and the second mother substrate with a buffer sheet interposed between the first mother substrate and the second mother substrate so that the first encapsulating layer and the second encapsulating layer face each other, peeling the first resin layer from the first mother substrate in a state where the first resin layer and the second resin layer are layered with the buffer sheet interposed between the first resin layer and the second resin layer, and bonding a first support film to the first resin layer.