A display panel including a metal film, an adhesive layer disposed on the metal film, a first resin substrate disposed on the adhesive layer, light-emitting elements disposed above the first resin substrate, and a second resin substrate disposed above the light-emitting elements. The adhesive layer includes contact portions in contact with the metal film and gaps are present between the contact portions where the adhesive layer is not in contact with the metal film.

A manufacturing method of a display device includes irradiating a laser beam onto a work panel along a beam irradiation line corresponding to an outer edge of the display device including a first thickness area and a second thickness area. The irradiating of the laser beam includes first irradiating the laser beam under a first driving condition to provide a first portion of the beam irradiation line at the first area, stopping driving of the laser beam while changing the first driving condition to a second driving condition different from the first driving condition, after the first irradiating of the laser beam, and second irradiating the laser beam under the second driving condition to provide a second portion of the beam irradiation line at the second area, after the stopping of the driving of the laser beam.

A display substrate motherboard and a preparation method thereof, a display substrate and a preparation method thereof are disclosed. The display substrate motherboard includes a base substrate, a first flexible organic layer, a first inorganic layer, a second flexible organic layer and a pixel driving circuit layer. The pixel driving circuit layer includes a plurality of pixel driving circuit portions respectively used for a plurality of display substrates, and the plurality of pixel driving circuit portions are insulated from each other. An orthogonal projection of the second flexible organic layer on the base substrate is located inside an orthogonal projection of the first inorganic layer on the base substrate. An orthogonal projection of each of the pixel driving circuit portions on the base substrate is located inside the orthogonal projection of the second flexible organic layer on the base substrate.

The, present disclosure relates to a method of fabricating a display panel. The method may include: forming a separation layer having first openings on a surface of the substrate; forming a flexible substrate layer covering the separation layer and the first openings; forming a TFT layer having second openings on a surface of the flexible substrate layer opposite from the substrate; removing a part of the flexible substrate layer that is underneath the second openings; forming a PDL layer covering the TFT layer, side walls of the third openings, and a part of the separation layer in the third openings, thereby forming fourth openings having a fourth width larger than the first width; forming an encapsulation layer covering the PDL layer and the fourth openings; and separating the flexible substrate layer from the substrate.

An active matrix substrate includes a plurality of first contact holes extending through an inorganic insulating film, a first protection layer that is a silicon nitride film, and a second protection layer, a plurality of second contact holes extending through the inorganic insulating film and the second protection layer, a first transistor, and a second transistor. A channel region of the second transistor does not overlap the first protection layer.

A flexible organic EL display device includes a plurality of short ring wiring lines. Each of the plurality of short ring wiring lines contacts a flattening film that is a resin layer on an end face of a terminal portion region in the flexible organic EL display device.

The disclosure provides a display panel and a method of manufacturing same. In the display panel, an organic light-emitting structural layer and an encapsulating structural layer are formed on a pixel defining layer and covers an entire surface of a through hole. The through hole is defined before the organic light-emitting structural layer and the encapsulating structural layer covers the surface of the through hole. Therefore, the encapsulating structural layer covers an interior lateral wall of the through hole, which prevents atmospheric moisture from invading into gaps between layers of an OLED device from the through hole and eroding a metal layer and an organic light-emitting layer in a display region.

A method of manufacturing a display device includes: providing a first substrate, a second substrate, and a plurality of connection lines, wherein the first substrate has a base substrate, wherein the second substrate faces the first substrate, and wherein the plurality of connection lines are disposed between the base substrate and the second substrate; grinding a side surface of the base substrate, a side surface of the second substrate, and side surfaces of the plurality of connection lines; and simultaneously transferring a conductive film and laser-curing the conductive film, wherein the conductive film is transferred to the ground side surface of the base substrate, the ground side surface of the second substrate, and the ground side surfaces of the plurality of connection lines.

A manufacturing method of an electronic device is provided by the present disclosure. The method includes: providing a substrate including a non-discarding portion and a discarding portion adjacent to the non-discarding portion; forming a first test wiring extending through the non-discarding portion and the discarding portion; cutting the substrate on a target line, wherein the target line is aligned with a boundary between the non-discarding portion and the discarding portion; performing a first conducting test on the first test wiring; and determining the substrate to be in an off-target cutting state when a result of the first conducting test is a short circuit state, or determining the substrate to be in an on-target cutting state when the result of the first conducting test is an open circuit state.

The present application discloses a display panel and a display device. The display panel includes a display area and a non-display area; the non-display area includes a bonding area away from the display area, and a plurality of terminals are disposed in the bonding area; and the non-display area further includes an anti-overflow portion disposed around the plurality of terminals. The present application prevents the problem of ACF overflow by disposing the anti-overflow portion around the plurality of terminals in the non-display area, such that the peeling of the glass substrate is facilitated, and the yield of the product is improved.