H10K71/80

DISPLAY APPARATUS AND METHOD OF MANUFACTURING THE SAME
20230068019 · 2023-03-02 ·

A display apparatus includes: an overcoat layer; a first color filter layer, a second color filter layer, and a third color filter layer arranged on the overcoat layer; a first planarization layer arranged on the first color filter layer, the second color filter layer, and the third color filter layer; a second planarization layer arranged on the first planarization layer and defining a first through-hole, a second through-hole, and a third through-hole therein; a first quantum dot layer in the first through-hole; and a second quantum dot layer in the second through-hole.

Light-emitting device and electronic device using the same

A lightweight flexible light-emitting device which is able to possess a curved display portion and display a full color image with high resolution and the manufacturing process thereof are disclosed. The light-emitting device comprises: a plastic substrate; an insulating layer with an adhesive interposed therebetween; a thin film transistor over the insulating layer; a protective insulating film over the thin film transistor; a color filter over the protective insulating film; an interlayer insulating film over the color filter; and a white-emissive light-emitting element formed over the interlayer insulating film and being electrically connected to the thin film transistor.

DISPLAY PANEL, DISPLAY DEVICE, AND METHOD OF MANUFACTURING OF THE DISPLAY DEVICE
20220328569 · 2022-10-13 ·

A display panel including a substrate having a central area and a corner area including a central corner area including a plurality of extension areas and a first adjacent corner area adjacent to the central corner area, a plurality of display elements including a first display element arranged in the plurality of extension areas and a second display element and a third display element arranged in the first adjacent corner area, and an organic pattern surrounding each of the first display element, the second display element, and the third display element. Ends of the plurality of adjacent extension areas are spaced apart from each other by a first penetration area, and an end of the central corner area and an end of the first adjacent corner area that are adjacent to each other are spaced apart from each other by a second penetration area.

Flexible array substrate, manufacturing method thereof and display device

A flexible array substrate, a manufacturing method thereof and a display device are provided. The flexible array substrate includes: a first flexible substrate with a first surface; a thin film transistor on the first surface; and a light-shielding layer between the first flexible substrate and the thin film transistor. An orthographic projection of the light-shielding layer on the first flexible substrate covers an orthographic projection of a channel region of the thin film transistor on the first flexible substrate.

Flexible substrate and fabrication method thereof, and flexible display apparatus

The embodiments of the disclosure disclose a flexible display apparatus. The flexible display apparatus includes a flexible substrate, a display device and a flexible encapsulation layer. The flexible substrate includes a first organic layer, an inorganic buffer layer, and a second organic layer, the inorganic buffer layer is between the first organic layer and the second organic layer, and the first organic layer includes inorganic nano-particles; the display device is located between the flexible substrate and the flexible encapsulation layer; the flexible encapsulation layer is configured to encapsulate the display device.

METHOD OF MANUFACTURING DISPLAY PANEL
20230165035 · 2023-05-25 ·

A method of manufacturing a display panel includes fabricating a display portion on a glass substrate; adhering a protection film on the glass substrate outside the display portion, and the protection film having an opening accommodating the display portion; forming an encapsulation film on the protection film and the display portion; and obtaining a panel area by removing the protection film and the encapsulation film outside a predetermined limited area on the glass substrate. The predetermined limited area corresponds to the display portion.

HETEROJUNCTION OPTOELECTRONIC DEVICE AND METHOD OF MANUFACTURING THE SAME
20230165018 · 2023-05-25 ·

The present disclosure relates to an optoelectronic device including a heterojunction of a halide perovskite single crystal and a two-dimensional semiconductor material layer and a method of manufacturing the same.

HETEROJUNCTION OPTOELECTRONIC DEVICE AND METHOD OF MANUFACTURING THE SAME
20230165018 · 2023-05-25 ·

The present disclosure relates to an optoelectronic device including a heterojunction of a halide perovskite single crystal and a two-dimensional semiconductor material layer and a method of manufacturing the same.

PRODUCTION METHOD FOR PATTERNED ORGANIC FILM, PRODUCTION APPARATUS FOR PATTERNED ORGANIC FILM, ORGANIC SEMICONDUCTOR DEVICE PRODUCED BY SAME, AND INTEGRATED CIRCUIT INCLUDING ORGANIC SEMICONDUCTOR DEVICE

A method for producing a patterned organic film includes: forming a hydrophobic organic film on a hydrophilic and non-water-soluble first substrate using a coating method, pressing the organic film formed on the first substrate against a convex portion of a stamp having the convex portion and a concave portion, transferring the organic film to the convex portion by applying water or an aqueous solution to an interface between the first substrate and the organic film, and pressing the organic film transferred to the convex portion against a second substrate to transfer the organic film to the second substrate to obtain a patterned organic film, wherein at least one of the organic film and the second substrate is an organic semiconductor.

PRODUCTION METHOD FOR PATTERNED ORGANIC FILM, PRODUCTION APPARATUS FOR PATTERNED ORGANIC FILM, ORGANIC SEMICONDUCTOR DEVICE PRODUCED BY SAME, AND INTEGRATED CIRCUIT INCLUDING ORGANIC SEMICONDUCTOR DEVICE

A method for producing a patterned organic film includes: forming a hydrophobic organic film on a hydrophilic and non-water-soluble first substrate using a coating method, pressing the organic film formed on the first substrate against a convex portion of a stamp having the convex portion and a concave portion, transferring the organic film to the convex portion by applying water or an aqueous solution to an interface between the first substrate and the organic film, and pressing the organic film transferred to the convex portion against a second substrate to transfer the organic film to the second substrate to obtain a patterned organic film, wherein at least one of the organic film and the second substrate is an organic semiconductor.