Provided is a method for encapsulating a display substrate, including: forming a first barrier wall and a second barrier wall in a peripheral region of the display substrate; and forming inorganic thin-film encapsulation layers and organic thin-film encapsulation layers alternately laminated on the display substrate, all of the organic thin-film encapsulation layers being located in a region surrounded by the first barrier wall, the forming at least one of the inorganic thin-film encapsulation layers comprises: forming the inorganic thin-film encapsulation layer on the display substrate, a portion of the inorganic thin-film encapsulation layer being located between the first barrier wall and the second barrier wall; and disconnecting the portion of the inorganic thin-film encapsulation layer between the first barrier wall and the second barrier wall from the other portions of the inorganic thin-film encapsulation layer, and removing the portion.

Techniques and devices are provided for attaching a die to a metal manifold. A metal-containing ink is used to deposit a metal trace on the die and thereby to form a gasket, after which the die is compressed against the manifold to form a sealed connection between the two.

Disclosed are a display panel, a preparation method thereof and a display device. The display panel includes a display region and a non-display region. The preparation method includes: providing a base substrate; preparing a first metal layer on a side of the base substrate; preparing a first insulation layer on a side of the first metal layer; performing a patterning process on the first insulation layer by using a mask plate to form a plurality of first via holes; preparing a passivation layer on a side of the first insulation layer; performing the patterning process on the passivation layer by using the same mask plate to form a plurality of second via holes, where a vertical projection of each of the first via holes on a plane where the base substrate is located covers a vertical projection of one of the second via holes on the plane.

A method for manufacturing a display panel includes forming a circuit element layer including a transistor on a plurality of cell areas of a first working substrate. Each of the cell areas includes a hole area on which at least one first sub-opening groove on which the circuit element layer is not formed is located. The method further includes forming a display element layer including a light emitting element on the plurality of cell areas, removing at least one inorganic layer of the display element layer formed in the first sub-opening groove by stamping to define a second sub-opening groove, coupling the first working substrate to a second working substrate to define a working panel, and cutting the working panel into portions corresponding to the plurality of cell areas.

Disclosed are a display panel, a preparation method thereof and a display device. The display panel includes a display region and a non-display region. The preparation method includes: providing a base substrate; preparing a first metal layer on a side of the base substrate; preparing a first insulation layer on a side of the first metal layer; performing a patterning process on the first insulation layer by using a mask plate to form a plurality of first via holes; preparing a passivation layer on a side of the first insulation layer; performing the patterning process on the passivation layer by using the same mask plate to form a plurality of second via holes, where a vertical projection of each of the first via holes on a plane where the base substrate is located covers a vertical projection of one of the second via holes on the plane.

An electroluminescent display panel, a method for manufacturing the same, and a display device are disclosed, wherein the electroluminescent display panel comprises a bending region and a non-bending region, a plurality of first pixels arranged in an array are provided in the non-bending region, a plurality of second pixels arranged in an array are provided in the bending region, and an open area of the second pixels is smaller than that of the first pixels; in the bending region, at least one elastic region with an extending direction consistent with a bending axis direction is provided at a gap of the second pixels along a direction perpendicular to the bending axis direction, a groove is provided in an insulating composite film layer in each of the elastic region, and the insulating composite film layer comprises a planarization layer and a pixel definition layer positioned over the planarization layer; an elastic member is filled in the groove, which has an elastic modulus greater than that of the planarization layer.

A method of fabricating a color filter is provided. In the method of fabricating the color filter, a patterned sacrificial layer having a thickness difference is formed on a substrate such that a patterned black photosensitive spacing material layer is formed by a single-tone photomask or a half-tone photomask and has effects of an original black matrix, a main spacer, and a sub-spacer. Thus, production costs can be reduced and a high yield can be carried out.

A method of fabricating a color filter is provided. In the method of fabricating the color filter, a patterned sacrificial layer having a thickness difference is formed on a substrate such that a patterned black photosensitive spacing material layer is formed by a single-tone photomask or a half-tone photomask and has effects of an original black matrix, a main spacer, and a sub-spacer. Thus, production costs can be reduced and a high yield can be carried out.

A method of fabricating a light emitting device comprises providing a mold having an unpolished surface with an arithmetic mean roughness R.sub.a in a range from 0.1 m to 10 m, depositing a thin polymer film over the surface of the mold, wherein the film has a thickness in a range from 1 m to 100 m, positioning a light emitting body onto the thin polymer film, wherein the light emitting body includes an anode, a cathode, and a light emitting layer positioned between the anode and the cathode, and separating the thin polymer film with the light emitting body from the mold. A light emitting device is also described.

A display may have organic light-emitting diode pixels formed from thin-film circuitry. The thin-film circuitry may be formed in thin-film transistor (TFT) layers and the organic light-emitting diodes may include anodes and cathodes and an organic emissive layer formed over the TFT layers between the anodes and cathodes. The organic emissive layer may be formed via chemical evaporation techniques. The display may include moisture blocking structures such as organic emissive layer disconnecting structures that introduce one or more gaps in the organic emissive layer during evaporation so that any potential moisture permeating path from the display panel edge to the active area of the display is completely terminated.