H10K71/821

PACKAGING METHOD FOR ELECTRONIC DEVICE AND PACKAGING SYSTEM

The present invention provides a packaging method for an electronic device, which includes a step of forming a packaging substrate, the step of the forming a packaging substrate includes: forming, on a base substrate, a defining pattern which comprises a groove for defining position of frit; providing colloidal frit in the groove; presintering the colloidal frit to obtain preliminarily cured frit; polishing upper surfaces of the defining pattern and the preliminarily cured frit; and removing the defining pattern, and completely curing the preliminarily cured frit, so as to form solid frit on the base substrate. The present invention also provides a packaging system. By using the packaging method provided by the present invention, a better packaging effect can be achieved.

Mechanical method for producing micro- or nano-scale textures

A mechanical method for producing micro-scale and nano-scale textures that facilitates, for example, the cost-effective production of nanostructures on large-scale substrates, e.g., during the large-scale production of thin-film solar cells. A scratcher (multi-pointed abrasion mechanism) is maintained in a precise position relative to a target substrate such that micron-level features (protrusions) extending from the scratcher's base structure are precisely positioned to contact a surface material layer of the target substrate with a predetermined amount of force, and then moved relative to the substrate (e.g., by way of a conveying mechanism) while maintaining the pressing force such that the micron-level features define elongated parallel nano-scale grooves and/or form nano-scale ridges in the surface material layer (i.e., by mechanically displacing) portions of the surface material layer to form the nano-scale grooves/ridges).

Microstructure array and method of manufacturing the same and micro-light-emitting diode and method of manufacturing the same and display device

A method of manufacturing microstructure array, a microstructure array, a micro-light-emitting diode, and a method for manufacturing the same, and a display device. The method of manufacturing microstructure array includes: preparing a red light-emitting perovskite precursor solution, a green light-emitting perovskite precursor solution, and a blue light-emitting perovskite precursor solution; coating the red light-emitting perovskite precursor solution, the green light-emitting perovskite precursor solution, and the blue light-emitting perovskite precursor solution, on a substrate having partitioned first, second, and third regions to form a red light-emitting perovskite precursor film, a green light-emitting perovskite precursor film, and a blue light-emitting perovskite precursor film, respectively; disposing a mold having a plurality of concave micropatterns on the red light-emitting perovskite precursor film, the green light-emitting perovskite precursor film, and the blue light-emitting perovskite precursor film, respectively; heat-treating the red light-emitting perovskite precursor film, the green light-emitting perovskite precursor film, and the blue light-emitting perovskite precursor film in a plurality of concave micropatterns to obtain each of red light-emitting perovskite nanocrystals, green light-emitting perovskite nanocrystals, and blue light-emitting perovskite nanocrystals, and removing the mold to form a microstructure array.

Display substrate, display panel and display apparatus

A display substrate, a display panel and a display apparatus are provided. The display substrate comprises a base substrate, which includes a display area and a non-display area on one side of the display area; an encapsulation dam in the non-display area and arranged around the display area, where an organic insulating layer has a groove structure on the side of the packaging dam away from the display area; and a touch structure, which is located on the side of the organic insulating layer facing away from the base substrate, and which comprises a plurality of touch lines extending to the non-display area; an inorganic insulating layer has a hollow structure on the side of the packaging dam away from the display area, and the hollow structure covers the groove structure and does not overlap with the orthographic projection of the plurality of touch lines.

DISPLAY SUBSTRATE, DISPLAY PANEL AND DISPLAY APPARATUS

A display substrate, a display panel and a display apparatus are provided. The display substrate comprises a base substrate, which includes a display area and a non-display area on one side of the display area; an encapsulation dam in the non-display area and arranged around the display area, where an organic insulating layer has a groove structure on the side of the packaging dam away from the display area; and a touch structure, which is located on the side of the organic insulating layer facing away from the base substrate, and which comprises a plurality of touch lines extending to the non-display area; an inorganic insulating layer has a hollow structure on the side of the packaging dam away from the display area, and the hollow structure covers the groove structure and does not overlap with the orthographic projection of the plurality of touch lines.

Display device and method of manufacturing the same

A display device has a display area with a plurality of light emitting areas and a non-light emitting area between the light emitting areas and a non-display area around a periphery of the display area. The display device includes: a base substrate having a first surface and an opposite second surface; a light emitting element in each of the light emitting areas on the first surface; a light blocking pattern in the non-light emitting area and in a light blocking area of the non-display area; a printed circuit film attached to a pad area of the non-display area on the first surface; and a light blocking layer on the light blocking pattern and the printed circuit film. The pad area is nearer to an end of the base substrate than the light blocking area is, and the light blocking layer includes a black resin and overlaps the light blocking pattern.

METHOD FOR MANUFACTURING WINDOW AND ELECTRONIC DEVICE INCLUDING THE SAME WINDOW

A method for manufacturing a window includes providing a glass substrate including a first non-folding region, a second non-folding region, and a folding region interposed between the first non-folding region and the second non-folding region, forming a photoresist layer on the glass substrate, forming an opening pattern in the photoresist layer, wherein the opening pattern overlaps with the folding region and exposes the glass substrate, etching the glass substrate by supplying a first etchant to the glass substrate exposed through the opening pattern, removing the photoresist layer having the opening pattern, and polishing at least a portion of the glass substrate by supplying a second etchant to a top surface of the glass substrate.

Display device and method for manufacturing the same
12507580 · 2025-12-23 · ·

A display device includes: a display panel having one face, and another face opposite to the one face; a functional layer on the one face of the display panel, and including a light-blocking material; and a display driving substrate on the other face of the display panel, and electrically connected to the display panel. The functional layer includes a first portion in contact with the display driving substrate, and a second portion spaced from the display driving substrate, and a hardness of the first portion is greater than a hardness of the second portion.

Display apparatus and method of manufacturing the same
12563927 · 2026-02-24 · ·

A display apparatus includes: a substrate; an organic insulating layer on the substrate; a first electrode on the organic insulating layer; an auxiliary electrode on the organic insulating layer; intaglio patterns in the auxiliary electrode; a bank layer having a first bank opening overlapping with the first electrode, and a second bank opening overlapping with the auxiliary electrode; an intermediate layer on the first electrode and the auxiliary electrode, the intermediate layer having a hole exposing a portion of the auxiliary electrode; and a second electrode on the intermediate layer to overlap with the first electrode and the auxiliary electrode, and contacting the portion of the auxiliary electrode exposed through the hole in the intermediate layer.