A sealant, a display panel and a display device are provided. The sealant includes: a main body material and a reflective material distributed in the main body material. In the case that the display device adopts the sealant, due to the scattering effect of the reflective material, the light incident onto the sealant is scattered by the reflective material and the light scattered by the reflective material cannot be continuously propagated along an original total reflection propagation direction, so that the light, which is originally totally reflected, emerges from the display panel, and thus the light extraction efficiency of the display panel is improved.

A method of cutting a substrate includes: forming a first protective layer on a first surface of the substrate; forming a removal area where a portion of the first protective layer is removed by irradiating the first protective layer at the portion of the first protective layer with a first laser beam; and forming a cutting area by removing a portion of the substrate by irradiating the substrate with a second laser beam at the removal area, after irradiating the first protective layer with the first laser beam.

Provided is a mother substrate comprising a glass substrate including a plurality of cutting lines, an organic film overlapping the plurality of cutting lines on the glass substrate, and a plurality of cells spaced apart from each other with each of the plurality of cutting lines therebetween on the glass substrate.

A display apparatus includes a substrate including a display area and a peripheral area, a thin film transistor including a semiconductor layer, a gate electrode, a source electrode, and a drain electrode, a first inorganic insulating layer located on the substrate and under the gate electrode and covering the semiconductor layer, a second inorganic insulating layer located on the first inorganic insulating layer and covering the gate electrode, a third inorganic insulating layer located on the second inorganic insulating layer and including a 1-3th opening in the peripheral area, an organic insulating layer located on the third inorganic insulating layer, covering the source electrode and the drain electrode, and including a second opening overlapping the 1-3th opening in the peripheral area, and a pattern portion located on a layer under the organic insulating layer and overlapping the 1-3th opening and the second opening.

A manufacturing substrate, on which a lamination is formed, is disposed on a first substrate. The lamination includes a first sheet substrate having flexibility and adhered to the first substrate, an organic layer that emits light such that brightness is controlled in each of a plurality of pixels forming an image in a display area, and a sealing layer. A light blocking area that does not overlap the display area in a plan view is formed on the first substrate, and after the first substrate is irradiated with light on a side that opposite to the sheet substrate, the first substrate is delaminated from the first sheet substrate.

A manufacturing method of a display device includes locating a base member on a support substrate; and removing a part of the support substrate by preventing a first surface portion having a predetermined region in a border plane between the support substrate and the base member from being irradiated with laser light through the support substrate, whereas irradiating a second surface portion, other than the predetermined region, in the border plane between the support substrate and the base member with the laser light through the support substrate.

A cracks propagation preventing, polarization film attaches to outer edges of a lower inorganic layer of an organic light emitting diodes display where the display is formed on a flexible substrate having the lower inorganic layer blanket formed thereon. The organic light emitting diodes display further includes a display unit positioned on the inorganic layer and including a plurality of organic light emitting diodes configured to display an image, and a thin film encapsulating layer covering the display unit and joining with edges of the inorganic layer extending beyond the display unit.

Various embodiments may relate to a method for processing an electronic component. The method includes applying a planar structure provided with predetermined separation locations to the electronic component, and removing a part of the applied planar structure, wherein removing includes separating the planar structure at the predetermined separation locations.

An electro-optical apparatus includes an element substrate which includes a display region in which a plurality of light emitting elements are arranged in a matrix form, and a terminal region in which mounting terminals are arranged outside the display region; a sealing film which seals the plurality of light emitting elements; and a sealing substrate which is arranged on the element substrate via the sealing film, in which a distance between the sealing substrate and the mounting terminal is equal to or longer than a thickness dimension of the sealing substrate when seen from a surface normal direction of the element substrate.

A process of producing a radiation-emitting organic-electronic device having a first and a second electrode layer and an emitter layer includes: A) providing a phosphorescent emitter with an anisotropic molecule structure and a matrix material, B) applying the first electrode layer to a substrate, C) applying the emitter layer under thermodynamic control, with vaporization of the phosphorescent emitter and of the matrix material under reduced pressure and deposition thereof on the first electrode layer such that molecules of the phosphorescent emitter are in anisotropic alignment, and D) applying the second electrode layer on the emitter layer.