A first product may be provided that comprises a substrate having a first surface, a first side, and a first edge where the first surface meets the first side; and a device disposed over the substrate, the device having a second side, where at least a first portion of the second side is disposed within 3 mm from the first edge of the substrate. The first product may further comprise a first barrier film that covers at least a portion of the first edge of the substrate, at least a portion of the first side of the substrate, and at least the first portion of the second side of the device.

The present disclosure relates to a display panel. The display panel may include a substrate. The substrate may include a display area, a dummy area inside the display area, and a boundary area between the dummy area and the display area on the substrate. The display substrate may further include an isolation protrusion on the substrate at the boundary area. The isolation protrusion may be configured to isolate a functional layer in the display area from the functional layer in the dummy area, and at least a side surface of the isolation protrusion facing the dummy area may be covered by an isolation inorganic layer.

An object of one embodiment of the present invention is to provide a more convenient highly reliable light-emitting device which can be used for a variety of applications. Another object of one embodiment of the present invention is to manufacture, without complicating the process, a highly reliable light-emitting device having a shape suitable for its intended purpose. In a manufacturing process of a light-emitting device, a light-emitting panel is manufactured which is at least partly curved by processing the shape to be molded after the manufacture of an electrode layer and/or an element layer, and a protective film covering a surface of the light-emitting panel which is at least partly curved is formed, so that a light-emitting device using the light-emitting panel has a more useful function and higher reliability.

According to one embodiment, a method of manufacturing a display device, includes forming a partition including a lower portion disposed on a first surface of a base and an upper portion protruding from a side surface of the lower portion, and measuring the distance between a side surface of the lower portion and an end portion of the upper portion from a side of a second surface opposing the first surface of the base.

The present disclosure provides a cutting method of a display module, including: providing a display module to be cut, the display module to be cut including a display panel and a spacing layer on the display panel, and the display panel including a region to be cut, the spacing layer being provided with a first through hole exposing the region to be cut, and the first through hole being provided therein with an encapsulation adhesive; and performing laser cutting on the display module to be cut at a position of the region to be cut so as to remove the region to be cut to form a cutting groove. In the laser cutting, at least part of the encapsulation adhesive is melted and covers a sidewall of the cutting groove.

A laser apparatus and a method for manufacturing a display device are provided. A laser apparatus includes: a stage; a laser providing unit above the stage and configured to provide a laser beam; a scanner configured to adjust an optical path of the laser beam such that the laser beam is irradiated to an irradiation line formed above the stage; and a control unit to control an operation of the scanner, and the scanner includes a shutter located on an optical path of the laser beam emitted from the laser providing unit and configured to perform an opening/closing operation.

A method for manufacturing a display device includes providing a panel substrate including a panel area, a peripheral area, and a dummy pattern disposed at a boundary between the panel area and the peripheral area. A protection part is disposed on the panel substrate. A first processing line overlaps a first outline of the panel area extending from a first point of an outline of the panel area. A second processing line overlaps a second outline extending from the first point in a direction different from the first outline are defined. The protection part is partially cut along the first processing line. The protection part is fully cut along the second processing line. The dummy pattern overlaps the first point.

The display substrate may include a base substrate (1), a display structure (20) on a display area (B) of the base substrate (1), at least one blocking structure on a peripheral area around the display area (B) of the base substrate (1), and a first water-blocking layer (10) on the substrate (1). The first water-blocking layer (10) may cover the display structure (20) and the at least one blocking structure. The blocking structure may be configured to block cracks generated on the first water-blocking layer (10) at a side of the blocking structure opposite from the display area (B) from propagating to the display area (B).

The present disclosure relates to display screens and manufacturing methods of display screens. The display screen includes a packaged component, a non-display area including an effective package area adjacent to the packaged component, and a package shadow area located at a periphery of the effective package area. The package shadow area includes a supporting substrate defining a groove for disconnecting a thin film package structure formed on the support substrate. The thin film package structure is disconnected at the groove.

A method of fabricating a semiconductor device, which includes a separation step and has a high yield, is provided. A metal layer is formed over a substrate, fluorine is supplied to the metal layer, and the metal layer is then oxidized, whereby a metal compound layer is formed. A functional layer is formed over the metal compound layer, heat treatment is performed on the metal compound layer, and the functional layer is separated from the substrate with use of the metal compound layer. By performing first plasma treatment using a gas containing fluorine, fluorine can be supplied to the metal layer. By performing second plasma treatment using a gas containing oxygen, the metal layer supplied with fluorine can be oxidized.