The present disclosure provides an OLED display motherboard and a method for manufacturing the same, a method for manufacturing the OLED display panel, and an OLED display device thereof. The OLED display motherboard includes a base substrate having a display region and a non-display region surrounding the display region, a TFT and an OLED device located within the display region of the base substrate, at least two crack stop slits located within the non-display region of the base substrate, an extending direction of the crack stop slit being the same as an extending direction of an edge of the display region of the base substrate, and adjacent crack stop slits being separated by a crack stop slit step, and an encapsulation layer covering the crack stop slit and the OLED device. A portion of the encapsulation layer has a non-uniform thickness.

A packaging method of a display panel, the packaging method including: defining, on a cover plate, at least one adhesive coating region that each is to cover a respective target specially-shaped pattern and have a regular shape; forming a packaging adhesive in the at least one adhesive coating region; bonding the cover plate formed with the packaging adhesive with a substrate formed with at least one target specially-shaped pattern, so that a display region of each target specially-shaped pattern is located within a respective adhesive coating region; and cutting the substrate and the cover plate that have been bonded according to the target specially-shaped pattern to obtain the display panel.

A method of manufacturing a display device includes providing a mother substrate including a first cell region, a second cell region, and a peripheral region. First alignment keys arranged in a first direction in the peripheral region on the mother substrate is formed such that the first alignment keys are adjacent to a first side portion of each of first and second light emitting structures, while forming the first and second light emitting structures in the first and second cell regions on the mother substrate, respectively. A photoresist is formed in a second direction on the first and second light emitting structures by using a coater such that the photoresist does not to overlap the first alignment keys. The mother substrate is rotated at a preset angle. A light is irradiated to the photoresist by moving an exposer in a direction in which the first alignment keys are arranged.

Disclosed is a method for manufacturing ultra-thin glass. The method includes: patterning, on a mother glass substrate comprising a plurality of display cells and a dummy area surrounding the display cells, a cutting line having a shape corresponding to the display cells; forming a mother glass protective film on the mother glass substrate; forming a through-hole which corresponds to the cutting line by etching the mother glass substrate; and cutting bridges which are formed by the mother glass substrate and connect the through-holes.

A method of manufacturing a flexible OLED module includes: forming a polymer layer on one surface of a base substrate; forming a thin glass sheet on one surface of the polymer layer; forming multiple OLED elements on one surface of the thin glass sheet; forming a protective layer on one surface of the thin glass sheet to cover the OLED elements; separating the base substrate and the polymer layer from each other through separation of the sacrificial layer by laser lift-off (LLO); and cutting the thin glass sheet and the protective layer to provide multiple unit OLED modules each including the OLED element.

A display substrate includes a substrate, at least one inorganic film, metal film(s) and organic film(s), the at least one inorganic film is disposed on the substrate; at least one edge portion of the entire at least one inorganic film is step-shaped. The metal film(s) are disposed on a side of the at least one inorganic film facing away from the substrate. A metal film includes a conductive pattern and residual pattern(s), and an orthographic projection of a residual pattern on the substrate is located within an orthographic projection of a step-shaped edge portion of the at least one inorganic film on the substrate. An organic film is disposed on a side of the metal film facing away from the substrate, and an edge portion of the organic film covers the residual pattern of the metal film.

A display device includes a pixel array disposed on a base substrate, a side terminal electrically connected to the pixel array, a connection pad including a first side surface contacting a side surface of the side terminal, and a driving device bonding to a second side surface of the connection pad, where the second side surface is opposite to the first side surface. The side terminal includes a resistance-reducing layer and an upper conductive layer, the resistance-reducing layer includes a first conductive material, the upper conductive layer is disposed on the resistance-reducing layer and includes a second conductive material having an oxidation resistance greater than the first conductive material. A portion of the upper conductive layer is disposed between the connection pad and the resistance-reducing layer such that the resistance-reducing layer is spaced apart from the connection pad.

The present disclosure protects a flexible substrate and prevents the generation of a crack and the development of a crack inside a display device. A display device includes a display area and a frame region which is a non-display area provided outside the display area, and in the frame region, at least a flexible substrate and a moisture-proof layer are disposed in this order, and a metal oxide film is further provided between the flexible substrate and the moisture-proof layer.

A method for manufacturing a display device including a display panel having a folding area to be folded along a virtual folding axis and first and second non-folding areas adjacent to both sides of the folding area, and a window disposed on the display panel, the method including preparing a mother substrate having an effective area and a non-effective area divided by a cutting line, performing a first laser process along a first cutting line disposed in the first non-folding area, performing a second laser process along a second cutting line disposed in the second non-folding area, and performing a third laser process along a third cutting line disposed in the folding area, in which one end of the third cutting line overlaps a first end of the first cutting line, and the other end of the third cutting line overlaps a first end of the second cutting line.

A display substrate motherboard has display areas and at least one cutting area located at least among the display areas. The display substrate motherboard includes a base substrate, first barrier groups disposed on the base substrate, an inert material layer and a first inorganic insulating layer. Each first barrier group is located on at least one side of a corresponding display area and includes two first barriers. A region between the two first barriers is located in a cutting area. The inert material layer is disposed in the region. The first inorganic insulating layer is disposed on a side of the first barrier groups away from the base substrate, and is further located in the display areas. An orthogonal projection of the first inorganic insulating layer on the base substrate is non-overlapping with an orthogonal projection of the inert material layer on the base substrate.