H10K71/851

DISPLAY MOTHERBOARD

A display motherboard is provided. The display motherboard is provided with barrier walls on at least one of an array substrate or a cover plate in a non-display region, so that stress generated by a cutting will be blocked and released by the barrier walls when the display motherboard is cut. Therefore, the stress will not enter the sealant and the display region, and the stress is released, thereby to prevent microcracks in the sealant and even fractures in films of the display motherboard. Moreover, the stress cannot enter the display region, and the encapsulation of the display region is complete.

DISPLAY DEVICE AND MANUFACTURING METHOD OF THE SAME

A display device includes a display panel including a display area in which a plurality of pixels is disposed and a bending area bent from the display area, a polarizing layer disposed on the display panel and a light-blocking film layer disposed under the display panel, where an entirety of an upper surface of the light-blocking film layer directly contacts a lower surface of the display panel in the display area, and an area of a lower surface of the light-blocking film layer is smaller than an area of the upper surface of the light-blocking film layer.

MANUFACTURING METHOD OF ELECTRONIC DEVICE
20220367529 · 2022-11-17 · ·

A manufacturing method of an electronic device is provided by the present disclosure. The method includes: providing a substrate including a non-discarding portion and a discarding portion adjacent to the non-discarding portion; forming a first test wiring extending through the non-discarding portion and the discarding portion; cutting the substrate on a target line, wherein the target line is aligned with a boundary between the non-discarding portion and the discarding portion; performing a first conducting test on the first test wiring; and determining the substrate to be in an off-target cutting state when a result of the first conducting test is a short circuit state, or determining the substrate to be in an on-target cutting state when the result of the first conducting test is an open circuit state.

Protective film, display module, display assembly, method for preparing display assembly and display device

The present disclosure discloses a protective film, a display module, a display assembly, a method for preparing the display assembly and a display device. The protective film is configured to be attached to a surface on a display side of the flexible display substrate before a mother set is cut. The protective film includes a base material layer, a first adhesive layer and a second adhesive layer, wherein the first adhesive layer is located on the side, facing the flexible display substrate, of the base material layer; the viscosity of the first adhesive layer is 0.5 gf/inch to 1.5 gf/inch; the second adhesive layer is located on the side, facing the flexible display substrate, of the base material layer, is independently arranged relative to the first adhesive layer; and the viscosity of the second adhesive layer is 3 gf/inch to 4 gf/inch.

Display substrate, organic light emitting device and display device with vapor-deposited organic film layers

Disclosed is a display substrate, comprising a display area and a non-display area surrounding the display area. At least one limit mark group is disposed in the non-display area; the display area has a plurality of sides, and rounded chamfers are formed between adjacent two sides; the non-display area includes a frame part opposite to the sides of the display area and corner parts opposite to the rounded chamfers; and the limit mark group is located at the corner part. Accordingly, the disclosure also provides an organic light emitting device, a film vapor-deposition detecting method of an organic light emitting device, and a display device. According to the disclosure, it is possible to reduce the display defect and the accuracy of film vapor-deposition detection.

Method for manufacturing electrooptical device comprising cutting a substrate with a laser beam, method for manufacturing organic electroluminescence device, organic electroluminescence device, and electronic apparatus
11502281 · 2022-11-15 · ·

A method for manufacturing an electro-optical device according to the present disclosure includes bonding a counter substrate to a substrate, cutting a first portion by irradiation of a laser beam, and removing the first portion, wherein during cutting of the first portion, a first surface and a second surface sandwiching the first portion in plan view are formed by the irradiation of the laser beam, one or both of the first surface and the second surface is inclined with respect to a first plate surface, and a first distance between the first surface and the second surface in the first plate surface is greater than a second distance between the first surface and the second surface in a second plate surface, on the substrate side, of the counter substrate.

DISPLAY PANEL AND MANUFACTURING METHOD THEREOF
20220359330 · 2022-11-10 ·

A display panel and a manufacturing method thereof are provided. In the manufacturing method of the display panel, a corner-cutting area of a to-be-cut display panel is provided with a cutting groove. The cutting groove penetrates a buffer layer and extends into a flexible substrate. Furthermore, the cutting groove is provided with an inorganic encapsulation layer and a sacrificial layer. Therefore, when cutting the to-be-cut display panel along the cutting groove, cracks generated during a process can be reduced, thereby alleviating a problem of micro-cracks affecting a packaging effect of conventional display panels during a secondary cutting process.

Display substrate, manufacturing method thereof, and display apparatus

A display substrate includes a supporting material layer having at least one flexible material sub-layer and at least one blocking sub-layer, which can be alternately and successively arranged in layers. One blocking sub-layer is at a topmost sub-layer of the supporting material layer, and is provided with a well, located in a display area and configured for accommodating a display component therewithin. One or more of the at least one flexible material sub-layer or the at least one blocking sub-layer is configured as a target material layer. The target material layer includes a planar portion and a protruding portion over the planar portion. An orthographic projection of the protruding portion on a bottom surface of the supporting material layer forms a ring-like structure having an opening that covers an orthographic projection of a bottom surface of the well on the bottom surface of the supporting material layer.

Display panel and method of manufacturing the same

Systems and methods are described for a display panel and a method of manufacturing the display panel. The systems and methods may provide for a substrate having a first surface and a second surface that face each other, a display unit including an organic light-emitting device arranged on the first surface of the substrate; and a thin-film encapsulation layer arranged on the display unit to shield the display unit, wherein an edge of the first surface or an edge of the second surface are inclined with respect to the first surface or the second surface. The inclined surfaces are designed to prevent damage to the display due to fine cracks during the manufacturing process as the display panel is trimmed or cut from a single base member. A display panel having improved strength characteristics may be manufactured, as well.

Display device comprising TFT layer and light-emitting element layer

In a display device, a second wiring line extends in a display region and includes an imaginary straight line that extends from the second wiring line in an extension direction of the second wiring line and intersects with an opening of an edge cover. The second wiring line extends along the peripheral edge of the opening without intersecting with the opening of the edge cover.