A display device, a method for controlling the same, and a display panel are provided, the display device includes: a transparent substrate; a plurality of electroluminescent devices arranged in an array on the substrate, a device with variable transmittance located between the electroluminescent devices and the substrate, the device with variable transmittance is configured so that a transmittance of the device with variable transmittance is switchable between a first transmittance and a second transmittance, and the first transmittance is greater than the second transmittance; and an image acquisition device on a side of the substrate away from the electroluminescent devices, in a case where the transmittance of the device with variable transmittance is switched to the first transmittance, external light irradiating the display device can pass through the device with variable transmittance and be incident on the image acquisition device.

A display device includes a side surface which is exposed to outside the display device, a circuit element layer including a gate line layer spaced apart from the side surface of the display device, a data line layer which is exposed to outside the display device at the side surface of the display device, and an insulating layer between the gate line layer and the data line layer, and a pad which faces the side surface of the display device and is connected to the circuit element layer at the data line layer.

The disclosure provides a polyimide (PI) substrate and a manufacturing method thereof. The PI substrate includes a first area and a plurality of second areas, wherein the second areas are spaced apart from each other in the first area, and the PI substrate includes a glass substrate and a plurality of PI layers disposed on the glass substrate.

A display device includes a substrate including a display area, a non-display area and a conductive material, a display layer on a top surface of the substrate and including a light-emitting element, a signal line extending from the display layer and into the non-display area, a conductive adhesive member on a bottom surface of the substrate, and a circuit board which is electrically connected to the signal line by contact of the circuit board with the conductive adhesive member, together with contact of the conductive material in the substrate with both the signal line and the conductive adhesive member.

A display panel, a display device, and a manufacturing method of the display panel are disclosed. The display panel includes an array substrate and a light-emitting function layer disposed on the array substrate. The display panel includes a display area and a sensor light-receiving area adjacent to the display area. The array substrate includes a thin film transistor array disposed in the display area, the light-emitting function layer is disposed in the display area and the sensor light-receiving area, and the thin film transistor array is electrically connected to the light-emitting function layer.

A method of manufacturing a display panel includes providing an insulating substrate that includes a hole area, a display area that surrounds the hole area, and a peripheral area adjacent to the display area, forming a semiconductor pattern in the display area, forming an insulating layer, forming contact holes in the insulating layer that expose portions of the semiconductor pattern, and forming a module hole by etching a portion of the insulating layer and a portion of the insulating substrate that overlap the hole area.

A display substrate motherboard has display areas and at least one cutting area located at least among the display areas. The display substrate motherboard includes a base substrate, first barrier groups disposed on the base substrate, an inert material layer and a first inorganic insulating layer. Each first barrier group is located on at least one side of a corresponding display area and includes two first barriers. A region between the two first barriers is located in a cutting area. The inert material layer is disposed in the region. The first inorganic insulating layer is disposed on a side of the first barrier groups away from the base substrate, and is further located in the display areas. An orthogonal projection of the first inorganic insulating layer on the base substrate is non-overlapping with an orthogonal projection of the inert material layer on the base substrate.

Articles are described including a substrate and a copper halide layer on the substrate, where the interfacial free energy between the substrate and the copper halide layer allows the copper halide layer to form continuously, wherein the copper halide layer conforms to the shape of the substrate. The articles may further include an adhesion layer disposed in-between the substrate and the copper halide layer, where the surface free energy between the adhesion layer and the copper halide layer allows the copper halide layer to form continuously, wherein the copper halide layer or the adhesion layer conform to the shape of the substrate. Also described are methods of forming an article using chemical vapor deposition.

A display panel is provided. The display panel has a display region and a non-display region. The non-display region has an aperture region and a non-aperture region surrounding the aperture region. The display panel includes a plurality of light-emitting elements disposed in the display region. The display panel includes a plurality of first light absorbing patterns and a plurality of second light absorbing patterns disposed in the non-aperture region. The plurality of first light absorbing patterns and the plurality of second light absorbing patterns are configured to absorb different colors of lights.

Discussed is a tandem solar cell manufacturing method including etching a crystalline silicon substrate, whereby a solar cell can be obtained which does not have a pyramid-shaped defect on a surface of the substrate, inhibits the generation of a shunt through the substrate having excellent surface roughness properties, and can secure fill factor properties, the solar cell being capable of being obtained through the tandem solar cell manufacturing method. The method includes preparing a crystalline silicon substrate; performing an isotropic etching process of the substrate; and removing a saw damage on a surface of the substrate by performing an anisotropic etching process of the isotropically etched substrate.