A thermoelectric conversion material includes a base material that is a semiconductor having Si and Ge as constituent elements, a first additive element that is different from the constituent elements, has a vacant orbital in a d or f orbital located inside an outermost shell thereof, and forms a first additional level in a forbidden band of the base material, and oxygen. The oxygen content ratio is 6 at % or less.

Systems, apparatuses, and methods are provided for scalable manufacturing of thermoelectric device modules for multiple uses on a single substrate. An example method can include disposing thermoelectric structures on a substrate, the substrate having a first substrate material, and the thermoelectric structures having a thermoelectric material disposed on a second substrate material. The example method can further include removing the second substrate material from each of the thermoelectric structures. The example method can further include forming electrical contacts on a top surface of each respective one of the thermoelectric structures. The example method can further include forming top headers over subsets of the electrical contacts. The example method can further include forming thermoelectric device modules, each of the thermoelectric device modules having at least a pair of the thermoelectric structures and at least one of the top headers.

A magnesium-based thermoelectric conversion material includes a first layer formed of Mg.sub.2Si and a second layer formed of Mg.sub.2Si.sub.xSn.sub.1-x (here, x is equal to or greater than 0 and less than 1), in which the first layer and the second layer are directly joined to each other, and within a junction surface with the first layer and in the vicinity of the junction surface, the second layer has a tin concentration transition region in which a tin concentration increases as a distance from the junction surface increases. The junction layer is regarded as a site in which a tin concentration is found to be equal to or lower than a detection limit by the measurement performed using EDX.

Integrated cooling device based on Peltier effect and manufacturing method thereof are provided. The device comprises one or more first heat dissipation structures around a device area. Each first heat dissipation structure comprises first N-type deep doped regions and first P-type deep doped regions arranged alternately, first vias, and first metal interconnection layers. The first vias are respectively located on two ends of each first N-type and each first P-type deep doped region. The first metal interconnect layers connect the first vias and such that the first heat dissipation structures are connected as a first S-shaped structure. When the first S-shaped structure is turned on, heat in the first N-type deep doped regions and the first P-type deep doped regions flows from a side close to the device area to its other side away from the device area, so as to realize heat dissipation in the device area.

Self-cooling semiconductor resistor and manufacturing method thereof are provided. The resistor comprises: multiple N-type and P-type wells in a semiconductor substrate, first polysilicon gates on each N-type well, second polysilicon gates on each P-type well, and metal interconnect layers. The multiple N-type and P-type wells are arranged alternately in row and column direction, respectively. N-type and P-type deep doped regions are formed on each N-type and P-type well, respectively. The first and second polysilicon gates are N-type and P-type deep doped respectively, and there is no gate oxide layer between the first and second polysilicon gates and the semiconductor substrate. The metal interconnect layers connect the multiple first and second polysilicon gates as an S-shaped structure. In the present application, the flow direction of heat is from the inside of the resistor to its surface, thereby realizing heat dissipation and cooling.

Provided is a thermoelectric material having an intermetallic compound in an Al—Fe—Si system as a main component, exhibiting a thermoelectric effect in a temperature range from a room temperature to 600° C., and becoming a p-type or n-type thermoelectric material by a composition control, a manufacturing method thereof, and a thermoelectric power generation module thereof. A thermoelectric material according to the present invention including at least Al, Fe, and Si and represented by a general formula of Al.sub.12+p−qFe.sub.38.5+3qSi.sub.49.5−p−2q (where p satisfies 0≤p≤16.5 and q satisfies −0.34≤q≤0.34) and including a phase represented by Al.sub.2Fe.sub.3Si.sub.3 as a main phase.

A thermoelectric element to convert thermal energy into electrical energy includes a first electrode part, a second electrode part having a different work function than the first electrode part and arranged at a distance from the first electrode part, on a same surface of a substrate as the first electrode part, and a middle part provided between the first electrode part and the second electrode part.

The present invention provides: a thermoelectric conversion material capable of being produced in a simplified manner and at a lower cost and excellent in thermoelectric performance and flexibility, and a method for producing the material. The thermoelectric conversion material has, on a support, a thin film of a thermoelectric semiconductor composition containing thermoelectric semiconductor fine particles, a heat-resistant resin and an inorganic ionic compound. The method for producing a thermoelectric conversion material having, on a support, a thin film of a thermoelectric semiconductor composition containing thermoelectric semiconductor fine particles, a heat-resistant resin and an inorganic ionic compound includes a step of applying a thermoelectric semiconductor composition containing thermoelectric semiconductor fine particles, a heat-resistant resin and an inorganic ionic compound onto a support and drying it to form a thin film thereon, and a step of annealing the thin film.

Proposed are an organic-inorganic composite thermoelectric material and a preparation method thereof. The organic-inorganic composite thermoelectric material includes an organic matrix and an inorganic thermoelectric portion dispersed in the organic matrix and including a nanomaterial. The organic matrix includes an organic conductor, and the nanomaterial includes at least one selected from the group consisting of a chalcogen element and a chalcogenide. The organic-inorganic composite thermoelectric material of the present invention has advantages of low cost and excellent thermoelectric properties through complexation of an aligned inorganic thermoelectric material and an organic thermoelectric material.

The disclosure is related to structures and method of making thermoelectric devices. The structures include an electrically and thermally nonconductive substrate with cylindrical or frustum-shaped tunnels. The tunnels may be filled with thermally and electrically conductive materials that resist diffusion. The structures include n-type and p-type materials, in homogeneous form or alternating with interlayers to block phonon conduction between layers of thermoelectric materials. The tunnels are individually associated with either n-type or p-type thermoelectric materials and connected in pairs to form alternating conductors on both sides of the substrate. The structures may also be coated with layers of gold and nickel and have thermoelectric materials deposited in the tunnels. The tunnels may be partially or fully capped with sintered nano-silver or solder. Notches may alternate sides to electrically isolate each side of the structure to provide current flow between the p-type and n-type thermoelectric layers.