An apparatus includes a first semiconductor fin and a second semiconductor fin that is parallel to the first semiconductor fin. The first semiconductor fin extends from a first region of a substrate near a circuit that produces thermal energy when a circuit is in operation to a second region of the substrate, which is disposed away from the circuit. The second semiconductor fin extends from the first region to the second region and has a different material composition than the first semiconductor fin. The first and second semiconductor fins collectively exhibit a Seebeck effect when the circuit is in operation. The apparatus includes interconnects to couple the first and second semiconductor fins to a power supply circuit to transfer electricity generated due to the Seebeck effect to the power supply circuit.

An apparatus includes a first semiconductor fin and a second semiconductor fin that is parallel to the first semiconductor fin. The first semiconductor fin extends from a first region of a substrate near a circuit that produces thermal energy when a circuit is in operation to a second region of the substrate, which is disposed away from the circuit. The second semiconductor fin extends from the first region to the second region and has a different material composition than the first semiconductor fin. The first and second semiconductor fins collectively exhibit a Seebeck effect when the circuit is in operation. The apparatus includes interconnects to couple the first and second semiconductor fins to a power supply circuit to transfer electricity generated due to the Seebeck effect to the power supply circuit.

The objective of the present invention is to provide a temperature discretization digital device capable of achieving thermalBIT, which controls the characteristic of bifurcation of a temperature solution of a thermoelectric heat equation by adjusting an internal calorific value control parameter such as a current/voltage/thermoelectric property coefficient, so as to cause numbers 0 and 1 to correspond to the numerical range of a temperature solution.

To this end, the present invention comprises a thermalBIT solution realizing material having a multi-temperature solution in a medium-sized current or voltage area, controls the characteristic of bifurcation of a temperature solution of a thermoelectric heat equation by adjusting an internal calorific value control parameter; and causes numbers 0 and 1 to correspond to the numerical range of a multi-temperature solution so that thermalBIT is realized.

A feeding device and a 3D printer are provided. The feeding device includes a first connecting pipe, a second connecting pipe, a feeding power unit, a temperature adjusting device and a resin vat containing a resin liquid. The temperature adjusting device includes a heat exchange pipeline, a liquid intake end of the heat exchange pipeline is connected to a first end of the first connecting pipe, a liquid output end of the heat exchange pipeline is connected to a first end of the second connecting pipe, a second end of the first connecting pipe and a second end of the second connecting pipe are both located in the resin vat, and at least one of the first connecting pipe and the second connecting pipe is provided with the feeding power unit.

A solar thermoelectric power generation system includes roofing products such as shingles with solar heat reflective areas and roofing products with solar heat absorptive areas. Thermoelectric power generating elements are provided in thermal contact with the solar heat reflective areas and the solar heat absorptive areas.

A thermoelectric generator has a heat conducting body that exchanges heat with the environment according to environmental temperature changes, a heat storing body, and a thermoelectric conversion unit and thermal resistance body arranged between the heat conducting body and the heat storing body. One end of the thermal resistance body and one end of the thermoelectric conversion unit are in contact with each other. The other end of the thermal resistance body is in contact with the heat conducting body, and the other end of the thermoelectric conversion unit is in contact with the heat storing body. The surface of the heat storing body is covered by a covering layer having certain heat insulation properties. The temperature difference generated between the heat conducting body and the heat storing body is utilized to extract electric energy from the thermoelectric conversion unit.

Systems and methods are disclosed of a service cart for an aircraft or other vehicle, which includes a thermoelectric device capable of generating a current as a result of a temperature differential between a cold compartment of the cart and an ambient environment. The current can be either stored in a battery or other storage device, and used to power one or more electronic components associated with the cart.

A temperature controlled container includes a case which has a storage space formed therein; a thermoelectric element; a heat transfer body in communication with the thermoelectric element and facing the storage space. The heat transfer body includes a heat transfer case which has an enclosed space formed therein and is wider than the thermoelectric element, and includes a portion facing the thermoelectric element; a phase change material which is accommodated in the enclosed space; and a heat transfer body which is disposed in the heat transfer case so as to be positioned in the enclosed space. The heat transfer body has a first body portion which is in communication with the portion of the heat transfer case facing the thermoelectric element and a second body portion, and the first body portion in communication with the second body portion.

The present invention includes a server system that uses an airflow source that can be external to the computer that the airflow source cools. The computer may be sealed such that the conduits are the primary source of fluid ingress and egress. The airflow source can be positioned in a case of the computer, support members affixing the computer to a rack stand, the rack stand, or beyond conduit that conducts fluid to the rack stand.

Disclosed systems include a case for cooling electronic devices. In an example, the case includes a thermo-electric cooler that includes a first side positioned on an interior of the case and a second side opposite the first side and adjacent to a first outer side of the case. The thermo-electric cooler is configured to transfer heat from the first side to the second side. The case further includes a pump and a length of tubing connected to the pump. The tubing includes a first section positioned adjacent to the first side of the thermo-electric cooler, and a second section positioned adjacent a second outer side of the case. The pump is configured to pump coolant through the length of tubing, thereby facilitating cooling of the coolant by the thermo-electric cooler. The case further includes a power source configured to power the pump and power the thermo-electric cooler.