Disclosed systems include a case for cooling electronic devices. In an example, the case includes a thermo-electric cooler that includes a first side positioned on an interior of the case and a second side opposite the first side and adjacent to a first outer side of the case. The thermo-electric cooler is configured to transfer heat from the first side to the second side. The case further includes a pump and a length of tubing connected to the pump. The tubing includes a first section positioned adjacent to the first side of the thermo-electric cooler, and a second section positioned adjacent a second outer side of the case. The pump is configured to pump coolant through the length of tubing, thereby facilitating cooling of the coolant by the thermo-electric cooler. The case further includes a power source configured to power the pump and power the thermo-electric cooler.

An inkjet printer includes a pair of temperature regulation modules mounted on opposite sides of each printhead in the printer. Each temperature regulation module includes a thermoelectric cooling device that is activated by a controller when the temperature of the printhead exceeds a predetermined setpoint. By cooling the printheads, the temperature of the printheads can be kept in a temperature range that enables fast drying inks to obtain their optimal performance and that prevents duplex printing operations from raising the temperature of the printheads significantly above the predetermined setpoint.

An inkjet printer includes a pair of temperature regulation modules mounted on opposite sides of each printhead in the printer. Each temperature regulation module includes a thermoelectric cooling device that is activated by a controller when the temperature of the printhead exceeds a predetermined setpoint. By cooling the printheads, the temperature of the printheads can be kept in a temperature range that enables fast drying inks to obtain their optimal performance and that prevents duplex printing operations from raising the temperature of the printheads significantly above the predetermined setpoint.

An optical module includes: an optical element; and a thermoelectric module on which the optical element is mounted. Further, the thermoelectric module includes a first substrate, a second substrate disposed to face the first substrate, and a plurality of thermoelectric elements provided between the first substrate and the second substrate, and a pattern made of a material different from a material of the first substrate is formed on a surface of the first substrate opposite to a back surface of the first substrate facing the second substrate, and the optical element is mounted on the surface of the first substrate in association with the pattern.

A humidity control device includes a condenser and a water absorber-drainer. The condenser has a first region and a second region. The first region is a region having hydrophilicity and where moisture is condensed. The condensed moisture is moved by gravity to the water absorber-drainer via the second region. The water absorber-drainer includes a temperature control member and has a water absorption surface and a water drainage surface. When a temperature of the water absorber-drainer is in a first temperature region, the water absorber-drainer absorbs through the water absorption surface the moisture moved from the condenser. When the temperature of the water absorber-drainer is controlled to be in a second temperature region by an operation of the temperature control member, the water absorber-drainer drains the absorbed moisture through the water drainage surface.

The present invention includes a lateral support member for a server computer constructed to permit advantageous airflow. The present invention can be operated to shunt organized airflow into multiple computer cases and/or organized airflow from multiple computer cases to a dedicated heat reservoir.

A thermoelectric conversion element that includes a laminated body having a plurality of first thermoelectric conversion portions, a plurality of second thermoelectric conversion portions, and an insulator layer. The first thermoelectric conversion portions and the second thermoelectric conversion portions are alternately arranged in a Y-axis direction and bonded to each other in first regions, and the insulator layer is interposed between the first thermoelectric conversion portions and the second thermoelectric conversion portions in second regions. The insulator layer surrounds a periphery of each of the second thermoelectric conversion portions. A ratio (W2/W1) of a thickness (W2) of the first thermoelectric conversion portion to a thickness (W1) of the second thermoelectric conversion portion in the Y-axis direction is greater than 4 and 11 or less.

Provided is a semiconductor package. The semiconductor package comprises a semiconductor chip on a substrate, a voltage measurement circuit configured to measure an external voltage to be input into the semiconductor chip and a thermoelectric module configured to convert heat released from the semiconductor chip into an auxiliary power, and configured to apply the auxiliary power to the semiconductor chip, the thermoelectric module being separated from the voltage measurement circuit, wherein the voltage measurement circuit is configured to control the thermoelectric module to apply the auxiliary power to the semiconductor chip in response to a change in the external voltage.

A gas burner appliance for recycling wasted heat from a heating process and for distributing heat evenly to a vessel or product. A housing and a plate supported by the housing are provided for directly collecting wasted heat. A burner arm is also supported by the housing and disposed above the plate for receiving and combusting premixed fuel for uniformly distributing heat to the plate. An electric motor or a Stirling engine is supported by the housing and a gearless direct drive mechanism or chain and sprocket connect the motor to the burner arm. A thermal electric generator generates electricity directly from heat of the plate and can provide at least some of the generated electricity to the motor. A cutoff mechanism is operatively connected to the motor and to the thermal electric generator for detecting when no electricity is generated and for cutting off gas flow upon sensing that condition.

A heating and cooling device is disclosed comprising at least one integral low voltage heating and cooling source and an efficient flexible heat distribution means having a thermal conductivity of from 375 to 4000 W/mK for distributing the heat and cool across a surface. Further aspects include thermal interface compounds to provide full thermal contact as well as the use of a phase change material to provide a long lasting heating and/or cooling effect without the use of external electrical input. Preferred applications include automotive and furniture seating heating and cooling, along with outdoor garments having distributed heating and cooling effects.