A cooling system for thermally conditioning a component which includes a battery and a heat spreader supporting the battery. Multiple thermoelectric devices are bonded to the heat spreader, for example, using solder or braze, which provides improved heat transfer. A cold plate assembly operatively thermally engages the thermoelectric devices.

The present invention relates to a temperature control device for a chemical liquid used in a semiconductor manufacturing process, which is located on a chemical liquid circulating and supplying tube to control a temperature of the chemical liquid. The device includes: a first heat sink having a cooling water flow path formed therein; a plurality of thermoelectric modules coming into contact with both side surfaces of the first heat sink, respectively; and a second heat sink coming into contact with the thermoelectric modules, while placing the first heat sink between the thermoelectric modules, and having a plurality of chemical liquid flow path tubes adapted to flow the chemical liquid therealong.

A system for adjusting properties of a seat for a vehicle, may include thermoelement modules configured to have a structure in which a plurality of flexible thermoelements is connected by conductive wires to each other, and mounted in a seat foam pad of the seat; a property adjustment region input unit configured to select a property adjustment region of the seat foam pad; a property adjustment amount input unit configured to input a target property adjustment amount of the seat foam pad; and a controller connected to the thermoelement modules, the property adjustment region input unit and the property adjustment amount input unit, and configured to control an amount of current supplied to some or all of the flexible thermoelements according to output signals from the property adjustment region input unit and the property adjustment amount input unit

A thermoelectric element according to an embodiment comprises: a first substrate; a first electrode part disposed on the first substrate; a thermoelectric semiconductor disposed on the first electrode part; second electrode parts disposed on the thermoelectric semiconductor; and a second substrate disposed on the second electrode parts, wherein the second substrate comprises: a first surface; and a second surface opposite to the first surface, the second electrode parts are disposed on the first surface, a terminal electrode part formed by extending at least one of the second electrode parts is disposed on the second surface, and the second substrate is formed between the terminal electrode part and the second electrode parts.

A thermal control system includes a component having a surface. A plurality of thermal generating devices include a first conductive plate, second and third conductive plates, a first semiconductor device arranged between the first conductive plate and the second conductive plate, and a second semiconductor device arranged between the first conductive plate and the third conductive plate. The first semiconductor device and the second semiconductor device have different types of doping. First ones of the plurality of thermal generating devices are arranged with the first conductive plate located adjacent to the surface of the component. Second ones of the plurality of thermal generating devices are arranged with the second and third conductive plates located adjacent to the surface of the component. The first ones and the second ones of plurality of thermal generating devices perform heating and cooling of the surface, respectively.

A system and method of determining three-dimensional coordinates is provided. The method includes, with a projector, projecting onto an object a projection pattern that includes collection of object spots. With a first camera, a first image is captured that includes first-image spots. With a second camera, a second image is captured that includes second-image spots. Each first-image spot is divided into first-image spot rows. Each second-image spot is divided into second-image spot rows. Central values are determined for each first-image and second-image spot row. A correspondence is determined among first-image and second-image spot rows, the corresponding first-image and second-image spot rows being a spot-row image pair. Tach spot-row image pair having a corresponding object spot row on the object. Three-dimensional (3D) coordinates of each object spot row are determined on the central values of the corresponding spot-row image pairs. The 3D coordinates of the object spot rows are stored.

A thermoelectric device includes a thermally conductive first plate and at least one thermoelectric sub-assembly comprises a thermally conductive second plate and a plurality of thermoelectric elements in a region between the first plate and the second plate. The at least one thermoelectric sub-assembly further includes a first material along a first portion of a perimeter of the region and having a first stiffness and a second material along a second portion of the perimeter of the region and having a second stiffness less than the first stiffness.

Thermocouples for high temperature applications are provided. A thermocouple includes a vessel formed from a dielectric material, the vessel defining a first chamber and a second chamber, the first chamber and second chamber in fluid communication. The thermocouple further includes a first thermoelement disposed in the first chamber, the first thermoelement formed from a first thermoelectric material. The thermocouple further includes a second thermoelement disposed in the second chamber, the second thermoelement formed from a second thermoelectric material different from the first thermoelectric material, and wherein the second thermoelement is a liquid at operating conditions of the thermocouple.

A thermal control system includes a component having a surface. A plurality of thermal generating devices include a first conductive plate, second and third conductive plates, a first semiconductor device arranged between the first conductive plate and the second conductive plate, and a second semiconductor device arranged between the first conductive plate and the third conductive plate. The first semiconductor device and the second semiconductor device have different types of doping. First ones of the plurality of thermal generating devices are arranged with the first conductive plate located adjacent to the surface of the component. Second ones of the plurality of thermal generating devices are arranged with the second and third conductive plates located adjacent to the surface of the component. The first ones and the second ones of plurality of thermal generating devices perform heating and cooling of the surface, respectively.

Disclosed is a header for a radiation detector assembly provided for mounting a detector head into an enclosure formed by the header and a detector can to form the radiation detector assembly. The detector head includes a semiconductor radiation detector arranged on a first side of a substrate and a thermoelectric cooler, TEC, arranged on a second side of the substrate, the header including: a base plate having a first side for mounting the TEC and a second side with an attachment mechanism for attaching the radiation detector assembly to a radiation-detecting appliance; contact pins that provide electrical coupling through the base plate protruding from the first side of the base plate to substantially define a rim for accommodating the TEC within the rim; and a draining outlet with an opening through the base plate between its first and second sides transferring a gas to and/or from the enclosure.