A thermoelectric conversion device includes at least one thermoelectric conversion unit. The thermoelectric conversion unit includes at least one first electrode, at least one second electrode, a P-type thermoelectric material, and an N-type thermoelectric material. The first electrode includes a first fluid channel, such that the first electrode has a first hollow structure. The second electrode includes a second fluid channel, such that the second electrode has a second hollow structure. The P-type thermoelectric material is located between the first electrode and the second electrode, and the second electrode is located between the P-type thermoelectric material and the N-type thermoelectric material.

Embodiments of the present invention provide a thermoelectric element including a first element portion having a first cross-sectional area, a connection portion connected to the first element portion, and a second element portion connected to the connection portion and having a second cross-sectional area, wherein a cross-sectional area of the connection portion is smaller than at least one of the first cross-sectional area and the second cross-sectional area.

The embodiments of the present invention relate to a thermoelectric element and a thermoelectric module used for cooling, and the thermoelectric module can be made thin by having a first substrate and a second substrate with different surface areas to raise the heat-dissipation effectiveness.

The energy conversion performance, mechanical robustness, and cost associated with fabrication of a thermoelectric device may be improved by three-dimensional flexible thermoelectrics.

A heat flow distribution measurement device includes a sensor module having one multilayer substrate and a plurality of heat flow sensor portions arranged inside of the multilayer substrate. The multilayer substrate has one surface and another surface opposite to the one surface and includes a plurality of stacked insulating layers each formed of a thermoplastic resin. The heat flow sensor portions are each formed of thermoelectric conversion elements and are thermoelectrically independent. An arithmetic portion arithmetically determines a heat flow distribution based on an electromotive force generated in each of the heat flow sensor portions. The thermoelectric conversion elements are formed in the multilayer substrate and therefore manufactured by the same manufacturing process for manufacturing the multilayer substrate. This can minimize the performance difference between the individual thermoelectric conversion elements and allow the heat flow distribution to be measured with high precision.

Embodiments of a Transistor Outline (TO) can package having an integrated Thermoelectric Cooler (TEC) and methods of manufacturing a TO can package having an integrated TEC are disclosed. In some embodiments, a TO can package comprises a TO header and a TEC on a surface of the TO header. The TEC comprises an insulation layer on a surface of the TO header, where the insulation layer has a thickness that is less than 100 micrometers and comprises one or more thermally and electrically conductive materials. The TEC further comprises a plurality of thermoelectric devices on a surface of the insulation layer opposite the TO header. The thin insulation layer, as opposed to a relatively thick bottom header of a stand-alone TEC, enables taller N-type and P-type legs for the thermoelectric devices, and thus a higher Coefficient of Performance (COP), within a given height for the TEC.

A system for recapturing energy may include a thermoelectric generator (TEG) assembly for thermally attaching to a surface heated by plasma or ionization heating. The TEG assembly may include a first level thermoelectric generator module (TEM). The first level TEM may include a hot side that is thermally attached to the surface, a cold side and a plurality of TEG devices disposed between the hot side and the cold side. A second level TEM may be stacked on the first level TEM. A hot side of the second level TEM may be thermally attached to the cold side of the first level TEM. The plurality of TEG devices generate an electric current based on a temperature differential across the TEG devices. The TEG assembly may also include an electrical wiring system that electrically connects the TEMs and supplies the electric current generated to an electrical power apparatus.

Micro-scale thermoelectric devices having high thermal resistance and efficiency for use in cooling and energy harvesting applications and relating fabricating methods are disclosed. The thermoelectric devices include first substrates substantially parallel with second substrates. Scaffold members are deposited between the first and second substrate. The scaffold members include a plurality of cavities having sidewalls. The scaffold members may be formed from the second substrate. The sidewalls are substantially vertical with respect to the second substrate. The sidewalls may be substantially parallel. Thermoelectric materials are deposited on the sidewalls.

A solar cooling system including a support structure, a plurality of photovoltaic modules affixed to the support structure to receive sunlight and provide solar electricity, a plurality of thermoelectric generator modules affixed to support structure to receive temperature gradient and provide thermal electricity, a plurality of thermoelectric cooling modules affixed to the support structure to receive input electricity and provide cooling, and a battery assembly affixed to the support structure and electrically connected to the plurality of photovoltaic modules and the plurality of thermoelectric generator modules to receive, regulate, and store the solar electricity and the thermal electricity and provide the input electricity.

A thermoelectric device according to an embodiment of the present invention comprises: a fluid flow part including one surface and the other surface spaced apart from the one surface in a first direction; a first thermoelectric element arranged on one surface of the fluid flow part; and a second thermoelectric element arranged on the other surface of the fluid flow part, wherein a first through-hole penetrating from the one surface to the other surface thereof is arranged in the fluid flow part, and a wire electrically connected to the first thermoelectric element is electrically connected to the second thermoelectric element through the first through-hole.