A multi-stage thermoelectric cooler is processed from semiconductor starting wafers. Efficiency for cooling is enhanced with semiconductor phononic nanowires increasing the ratio of electrical conductivity to thermal conductivity within a Peltier thermoelectric device. In embodiments, the phononic structure comprises phononic crystal. Applications include micro-refrigerators for cooling photonic detectors in applications such as focal plane array (FPA) imagers and semiconductor diode detectors. Other applications for the micro-refrigerator includes providing a cooled platform for a media of interest, including chemicals, a chemical reaction, and a variety of semiconductor devices.

A thermoelectric device may include a plurality of thermoelectric modules each having a plurality of thermoelectric elements. The device may also include a plurality of elongated first sheet-metal shaped parts thermally coupling the plurality of thermoelectric modules to two first fluid lines. The plurality of first sheet-metal shaped parts may be thermally and mechanically coupled to the plurality of thermoelectric modules. The device may further include a plurality of elongated second sheet-metal shaped parts thermally coupling the plurality of thermoelectric modules to two second fluid lines. Each of the first sheet-metal shaped parts and each of the second sheet-metal shaped parts may have a respective main section. The respective main section may transition into a respective end section at two respective longitudinal ends. The respective end section may be thermally and mechanically connected to an associated fluid line of the two first fluid lines and the two second fluid lines.

A thermoelectric module comprising a central thermoelectric assembly of cylindrical tubular shape inside which a first cold fluid flows and outside which a hot fluid flows.

This module is characterized in that it also comprises at least one peripheral thermoelectric assembly having: an outer face in contact with a second cold fluid; an inner face positioned on a peripheral boundary surrounding the central thermoelectric assembly, said boundary defining a channel between said central and peripheral thermoelectric assemblies where the hot fluid flows.

A system for recapturing energy may include a thermoelectric generator (TEG) assembly for thermally attaching to a surface heated by plasma or ionization heating. The TEG assembly may include a first level thermoelectric generator module (TEM). The first level TEM may include a hot side that is thermally attached to the surface, a cold side and a plurality of TEG devices disposed between the hot side and the cold side. A second level TEM may be stacked on the first level TEM. A hot side of the second level TEM may be thermally attached to the cold side of the first level TEM. The plurality of TEG devices generate an electric current based on a temperature differential across the TEG devices. The TEG assembly may also include an electrical wiring system that electrically connects the TEMs and supplies the electric current generated to an electrical power apparatus.

An apparatus for generating electricity. The apparatus comprises a collar arranged to couple to a pipe and a support having a first planar face, the support being attached to the collar such that it projects away from the collar. The apparatus also has at least one thermoelectric generator attached to the first planar face of the support and a cover attached to the at least one thermoelectric generator.

A thermoelectric device has a foam substrate, thermoelectric elements and metallic foil strip assemblies. The foam substrate has apertures therein. The thermoelectric elements are inserted into the apertures. The metallic foil strip assemblies include upper and lower foil strips. A first end of a first upper foil strip is inserted into a first aperture contacting an upper heat transferring surface of the first thermoelectric element. A second end is inserted into a second aperture contacting an upper heat transferring surface of a second thermoelectric element with an elongated portion of the metallic foil strip assembly extending between the first aperture and the second aperture along the upper surface. A first end of a second upper foil strip is inserted into the second aperture contacting the upper heat transferring surface of the second thermoelectric element and a second end is similarly inserted into a third aperture.

A solderless thermoelectric device is capable of use at higher operating temperatures as compared to conventional low temperature solders thus allowing the thermoelectric device to be used in a Seebeck device, for example. The thermoelectric device forms a fusion layer between a copper metal layer and a semiconductor wafer layer by impregnating and surface coating graphene on the semiconductor wafer and heating, under pressure, the graphene coated semiconductor wafer to create a true metallurgical bond of the layers with superconducting interfaces and good thermoelectric properties.

A thermoelectric heat pump cascade and a method of manufacturing such are disclosed herein. In some embodiments, a thermoelectric heat pump cascade includes a first stage plurality of thermoelectric devices attached to a first stage circuit board and a first stage thermal interface material between the thermoelectric devices and the heat spreading lid over the thermoelectric devices. The thermoelectric heat pump cascade component also includes a second stage plurality of thermoelectric devices attached to a second stage circuit board where the second stage plurality of thermoelectric devices has a greater heat pumping capacity than the first stage plurality of thermoelectric devices, and a second stage thermal interface material between the second stage plurality of thermoelectric devices and the first stage plurality of thermoelectric devices. In this way, a greater temperature difference can be achieved while allowing for protection of the thermoelectric devices, simplifying design, and improving reliability of the product.

A system for recapturing energy may include a thermoelectric generator (TEG) assembly for thermally attaching to a surface heated by plasma or ionization heating. The TEG assembly may include a first level thermoelectric generator module (TEM). The first level TEM may include a hot side that is thermally attached to the surface, a cold side and a plurality of TEG devices disposed between the hot side and the cold side. A second level TEM may be stacked on the first level TEM. A hot side of the second level TEM may be thermally attached to the cold side of the first level TEM. The plurality of TEG devices generate an electric current based on a temperature differential across the TEG devices. The TEG assembly may also include an electrical wiring system that electrically connects the TEMs and supplies the electric current generated to an electrical power apparatus.

A thermoelectric device may include a plurality of electrically conductive first threads and a plurality of electrically insulating second threads structured and arranged to define a fabric. At least one first thread of the plurality of first threads may include a plurality of p-doped thread sections and a plurality of n-doped thread sections arranged in alternating relationship with one another. The plurality of first threads may extend in a wavy course defining a plurality of curvature-turning points. The plurality of p-doped thread sections and the plurality of n-doped thread sections may be arranged in a respective curvature-turning point of the plurality of curvature-turning points.