Systems, methods, and devices of the various embodiments provide for microfabrication of devices, such as semiconductors, thermoelectric devices, etc. Various embodiments may include a method for fabricating a device, such as a semiconductor (e.g., a silicon (Si)-based complementary metal-oxide-semiconductor (CMOS), etc.), thermoelectric device, etc., using a mask. In some embodiments, the mask may be configured to allow molecules in a deposition plume to pass through one or more holes in the mask. In some embodiments, molecules in a deposition plume may pass around the mask. Various embodiments may provide thermoelectric devices having metallic junctions. Various embodiments may provide thermoelectric devices having metallic junctions rather than junctions formed from semiconductors.

Plasma polymerisation apparatus is disclosed including a reaction zone and at least one gas inlet for supplying at least one monomer in a gaseous form to the reaction zone, a first electrode and a second electrode spaced apart and configured to generate an electric field in the reaction zone to form plasma polymer nanoparticulate material from the at least one monomer, a plurality of collectors configured to collect plasma-polymer nanoparticulate material formed in the reaction zone, the plurality of collectors being located adjacent the second electrode, and a cooling device located adjacent the second electrode and configured to cool the plurality of collectors. Also disclosed is plasma polymerisation apparatus that includes a confinement grid extending between a first electrode and a second electrode of the apparatus.

The present invention relates to a soft actuator moving linearly against external stimuli whose expansion and contraction can be actively controlled, suggesting that the actuator of the invention overcomes the problems of the conventional soft actuators, The soft actuator of the present invention can be repetitively driven quickly and accurately by controlling heating and cooling by using thermoelectric effect and, the soft actuator of the present invention can realize bending, tensioning, compression, and rotational driving of a tubular device containing a driver.

A temperature control component includes a TEC that includes a top surface and a bottom surface. A thermal conduction layer includes a top surface and a bottom surface. The top surface of the thermal conduction layer is coupled to the bottom surface of the TEC. The bottom surface of the thermal conduction layer includes a planar area. The planar area of the thermal conduction layer is to be positioned above two or more electronic devices of multiple electronic devices of an electronic system to transfer the thermal energy at the two or more electronic devices.

The energy conversion performance, mechanical robustness, and cost associated with fabrication of a thermoelectric device may be improved by three-dimensional flexible thermoelectrics.

Micro-scale thermoelectric devices having high thermal resistance and efficiency for use in cooling and energy harvesting applications and relating fabricating methods are disclosed. The thermoelectric devices include first substrates substantially parallel with second substrates. Scaffold members are deposited between the first and second substrate. The scaffold members include a plurality of cavities having sidewalls. The scaffold members may be formed from the second substrate. The sidewalls are substantially vertical with respect to the second substrate. The sidewalls may be substantially parallel. Thermoelectric materials are deposited on the sidewalls.

A thermal conduction unit includes a conductive via, a periphery conductor and an isolation material. The conductive via includes a first thermoelectric material. The periphery conductor encloses the conductive via and includes a second thermoelectric material. An end of the periphery conductor is electrically connected to an end of the conductive via. The isolation material is interposed between the conductive via and the periphery conductor.

A heterogeneously integrated thermal infrared sensing member includes: a substrate; a chamber disposed in or on the substrate; and one or multiple thermal couples formed using materials formed on a sacrificial substrate and transferred to a location above the chamber by way of bonding the substrate to one portion of the materials formed on the sacrificial substrate, removing the sacrificial substrate, and patterning and interconnecting another portion of the material, wherein the thermal couple includes a first conductor and a second conductor, first ends of the first conductor and the second conductor of the thermal couple are connected at a hot junction disposed above the chamber, and second ends of the first conductor and the second conductor of the thermal couple are located at a cold junction region disposed around the chamber.

There are two parts to build fusion carbon metal interconnects. First are the fusing metals/alloys, typically in the Martensite phase and lacking carbon. Second are carbonized materials that have carbon infused. These carbonized materials may be referred to as carbon donating materials. Both parts can be interchanged as the substrate or mounted component, or the parts can form linear interface connections. The finished interfaces have very low electrical resistance and/or zero interface electrical resistance. The interconnect circuit topography materials and connections are endless and is dependent on circuit design. One example of such interface is a solderless thermoelectric device capable of use at higher operating temperatures as compared to conventional low temperature solders thus allowing the thermoelectric device to be used in a Seebeck device, for example. The thermoelectric device forms a fusion layer between a copper metal layer and a semiconductor wafer layer to create a true metallurgical bond.

A thermal conduction unit includes a conductive via, a periphery conductor and an isolation material. The conductive via includes a first thermoelectric material. The periphery conductor encloses the conductive via and includes a second thermoelectric material. An end of the periphery conductor is electrically connected to an end of the conductive via. The isolation material is interposed between the conductive via and the periphery conductor.