A resonant member of a MEMS resonator oscillates in a mechanical resonance mode that produces non-uniform regional stresses such that a first level of mechanical stress in a first region of the resonant member is higher than a second level of mechanical stress in a second region of the resonant member. A plurality of openings within a surface of the resonant member are disposed more densely within the first region than the second region and at least partly filled with a compensating material that reduces temperature dependence of the resonant frequency corresponding to the mechanical resonance mode.

An optical scanning device includes a mirror and a drive beam. The drive beam includes a piezoelectric portion. The piezoelectric portion is partitioned by a plurality of first grooves into a plurality of piezoelectric bodies. The piezoelectric bodies are reduced in length in an X-axis direction as the piezoelectric bodies approach one end side connected to an anchor. The piezoelectric bodies are reduced in length in the X-axis direction as the piezoelectric bodies approach the other end side connected to a link beam.

An optical scanning device includes a mirror and a drive beam. The drive beam includes a piezoelectric portion. The piezoelectric portion is partitioned by a plurality of first grooves into a plurality of piezoelectric bodies. The piezoelectric bodies are reduced in length in an X-axis direction as the piezoelectric bodies approach one end side connected to an anchor. The piezoelectric bodies are reduced in length in the X-axis direction as the piezoelectric bodies approach the other end side connected to a link beam.

Methods for forming an integrated circuit are provided. Aspects include providing a wafer substrate having an embedded memory area interconnect structure and an embedded non-memory area interconnect structure, the memory area interconnect structure comprising metal interconnects formed within a first interlayer dielectric, recessing a portion of the memory area interconnect structure, forming a bottom electrode contact on the recessed portion of the memory area interconnect structure, forming a bottom electrode over the bottom electrode contact, forming a protective dielectric layer over the non-memory area interconnect structure, and forming memory element stack layers on a portion of the bottom electrode.

A pressure visualization device includes a flexible substrate, a piezoelectric module and an electrochromic module disposed on a surface of the flexible substrate and adjacent to each other, a first attachment layer on a surface of the piezoelectric module facing away from the flexible substrate, and a second attachment layer on the other surface of the flexible substrate; the piezoelectric module includes a plurality of piezoelectric units each including a first electrode, a second electrode, and a piezoelectric layer between the first electrode and the second electrode; the electrochromic module includes a plurality of electrochromic units each including a third electrode, a fourth electrode, an electrochromic layer between the third electrode and the fourth electrode; wherein the second electrode is electrically connected to the third electrode, and the fourth electrode is a transparent electrode.

A method for designing a piezoelectric element unit, a ultrasonic element having the piezoelectric element manufactured using the method, a method for manufacturing the ultrasonic element, and an acoustic pressure focusing device having the ultrasonic element are provided. In the method for designing a piezoelectric element unit, a target position and a target distance are selected. A basic information of a piezoelectric element base material is inputted. Each of a plurality of grids is grouped into a unit grid group. A size of an output acoustic pressure outputted at each unit grid group is calculated. The unit grid group outputting the output acoustic pressure included in a range of a reference acoustic pressure among a plurality of the unit groups is decided. The plurality of ring patterns being concentric is determined based on a pattern shape information.

The MEMS actuator is formed by a substrate, which surrounds a cavity; by a deformable structure suspended on the cavity; by an actuation structure formed by a first piezoelectric region of a first piezoelectric material, supported by the deformable structure and configured to cause a deformation of the deformable structure; and by a detection structure formed by a second piezoelectric region of a second piezoelectric material, supported by the deformable structure and configured to detect the deformation of the deformable structure.

In some examples, techniques are provided for quick haptic feedback, without the use of a controller, which is local to individual, non-actuating keys, such as keys of a thin keyboard or keypad. The haptic feedback may be in the form of a simulated “key-click” feedback for an individual key that is pressed by a user such that the finger used to press the key feels the tactile sensation. The haptic feedback mimics the tactile sensation of a mechanical key (e.g., buckling spring, pop-dome key switch) to give a user the perception that they have actuated a mechanically movable key.

In some examples, techniques are provided for quick haptic feedback, without the use of a controller, which is local to individual, non-actuating keys, such as keys of a thin keyboard or keypad. The haptic feedback may be in the form of a simulated “key-click” feedback for an individual key that is pressed by a user such that the finger used to press the key feels the tactile sensation. The haptic feedback mimics the tactile sensation of a mechanical key (e.g., buckling spring, pop-dome key switch) to give a user the perception that they have actuated a mechanically movable key.

A piezoelectric assembly includes at least two piezoelectric components, a positive circuit board, and a negative circuit board. Each piezoelectric component includes a main body portion and a connecting portion. Respective first surfaces of the main body portion and the connecting portion are a positive electrode, and respective second surfaces of the main body portion and the connecting portion are a negative electrode. Main body portions of the at least two piezoelectric components are stacked, connecting portions of the at least two piezoelectric components are distributed in a staggered manner along a set edge. The positive circuit board is coupled to the first surface of the connecting portion, and the negative circuit board is coupled to the second surface of the connecting portion.