H10N30/01

METHODS FOR DESIGNING AND PRODUCING A DEVICE COMPRISING AN ARRAY OF MICRO-MACHINED ELEMENTS, AND DEVICE PRODUCED BY SAID METHODS
20230292618 · 2023-09-14 ·

A design process is used for designing a device comprising a plurality of micro-machined elements, each comprising a flexible membrane, the elements being arranged in a plane in a determined topology. The design process comprises a step of defining the determined topology so that it has a character compatible with a generic substrate having cavities, the characteristics of which are pre-established. Each flexible membrane of the micro-machined elements is associated with one cavity of the generic substrate. The present disclosure also relates to a fabrication process for fabricating a device comprising a plurality of micro-machined elements, and to this device itself, wherein only some of the pairs of cavities and flexible membranes are configured to form a set of functional micro-machined elements.

METHODS FOR DESIGNING AND PRODUCING A DEVICE COMPRISING AN ARRAY OF MICRO-MACHINED ELEMENTS, AND DEVICE PRODUCED BY SAID METHODS
20230292618 · 2023-09-14 ·

A design process is used for designing a device comprising a plurality of micro-machined elements, each comprising a flexible membrane, the elements being arranged in a plane in a determined topology. The design process comprises a step of defining the determined topology so that it has a character compatible with a generic substrate having cavities, the characteristics of which are pre-established. Each flexible membrane of the micro-machined elements is associated with one cavity of the generic substrate. The present disclosure also relates to a fabrication process for fabricating a device comprising a plurality of micro-machined elements, and to this device itself, wherein only some of the pairs of cavities and flexible membranes are configured to form a set of functional micro-machined elements.

PIEZOELECTRIC MEMS DEVICE WITH A SUSPENDED MEMBRANE HAVING HIGH MECHANICAL SHOCK RESISTANCE AND MANUFACTURING PROCESS THEREOF

A MEMS device having a body with a first and a second surface, a first portion and a second portion. The MEMS device further has a cavity extending in the body from the second surface; a deformable portion between the first surface and the cavity; and a piezoelectric actuator arranged on the first surface, on the deformable portion. The deformable portion has a first region with a first thickness and a second region with a second thickness greater than the first thickness. The second region is adjacent to the first region and to the first portion of the body.

MULTI-FREQUENCY HYBRID PIEZO ACTUATION AND CAPACTIVE TRANSDUCER
20230311161 · 2023-10-05 ·

A method includes receiving, by a piezoelectric stack of a transducer, a first piezoelectric voltage. The transducer has a base structure and a first layer, the base structure having a first displacement between a first portion of the base structure and the first layer. The method also includes transmitting, by the transducer, a first ultrasound frequency while receiving a first piezoelectric voltage, and receiving, by the transducer, a first bias voltage. The received first bias voltage alters the first displacement between the first portion of the base structure and the first layer, and the altered first displacement is smaller than the first displacement. The method further includes receiving, by the piezoelectric stack of the transducer, a second piezoelectric voltage to the transducer, and transmitting, by the transducer, a second ultrasound frequency while receiving the first bias voltage and the second piezoelectric voltage.

PIEZOELECTRIC-BODY FILM JOINT SUBSTRATE AND MANUFACTURING METHOD THEREOF

A piezoelectric-body film joint substrate includes a substrate, a substrate electrode provided on the substrate, a first piezoelectric-body film stuck on the substrate electrode and including a first piezoelectric film and a first upper electrode film formed on the first piezoelectric film, and a second piezoelectric-body film stuck on the first upper electrode film and including a second piezoelectric film different from the first piezoelectric film and a second upper electrode film formed on the second piezoelectric film.

Film structure and method for manufacturing the same
11758817 · 2023-09-12 · ·

A film structure (10) includes a substrate (11), a piezoelectric film (14) formed on the substrate (11) and containing first composite oxide represented by a composition formula Pb(Zr.sub.1-xTi.sub.x)O.sub.3, and a piezoelectric film (15) formed on the piezoelectric film (14) and containing second composite oxide represented by a composition formula Pb(Zr.sub.1-yTi.sub.y)O.sub.3. In the composition formulae, x satisfies 0.10<x≤0.20, and y satisfies 0.35≤y≤0.55. The piezoelectric film (14) has tensile stress, and the piezoelectric film (15) has compressive stress.

MEMS device

A MEMS device includes a membrane portion, a piezoelectric layer made of a piezoelectric single crystal, a first electrode on a first surface of the piezoelectric layer, a second electrode on a second surface of the piezoelectric layer opposite to the first direction, and a first layer covering the first surface of the piezoelectric layer. At least a portion of the piezoelectric layer is included in the membrane portion. Each of the first electrode and the second electrode has a tapered cross-sectional shape with a width which decreases with increasing distance from the piezoelectric layer on a cross section along a plane vertical to the surface in the first direction.

Sound producing package structure and manufacturing method thereof
11758312 · 2023-09-12 · ·

A sound producing package structure includes a first sub-package structure and a second sub-package structure. The first sub-package structure includes a first substrate having a first opening and a first chip including a first membrane, wherein a first cavity is formed between the first membrane and the first substrate. The first sub-package structure and the second sub-package structure are stacked, and the second sub-package structure includes a second substrate and a second chip. The second substrate is connected to the first substrate and has a second opening. The second chip includes a second membrane, wherein a second cavity is formed between the second membrane and the second substrate. A gap, connected to the first opening and the second opening, is formed between the first substrate and the second substrate, such that an ambient of the sound producing package structure, the first cavity and the second cavity are connected.

Systems and methods for adaptive content distribution

An application displaying primary content, such as a webpage, may include unused space. The unused space may exist within the application displaying the primary content (e.g., within the browser window) or on other portions of the display (e.g., outside of the browser window). The unused space is identified and leveraged to display secondary content on the client display along with the primary content. The secondary content may be adaptable to conform to different sizes and/or configurations of the unused space. The secondary content may be updated as the user interacts with elements on the client display.

Systems and methods for adaptive content distribution

An application displaying primary content, such as a webpage, may include unused space. The unused space may exist within the application displaying the primary content (e.g., within the browser window) or on other portions of the display (e.g., outside of the browser window). The unused space is identified and leveraged to display secondary content on the client display along with the primary content. The secondary content may be adaptable to conform to different sizes and/or configurations of the unused space. The secondary content may be updated as the user interacts with elements on the client display.