Patent classifications
H10N30/101
POSITIONING APPARATUS
A positioning apparatus comprises a base element provided for fastening to a robot, a base movably supported at the base element, and a piezoactuator by which the base is movable in a direction relative to the base element. A second piezoactuator is provided by which a counterweight is simultaneously movable in an opposite direction.
Multi-axis piezoelectric transducer
A multi-axis transducer is provided. The transducer includes: a stationary member; at least two connecting members and two or more energy-conversion elements disposed on each connecting member. Each connecting member is attached at one location thereof to one of the stationary member or a second connecting member and, in response to a stimuli, is free to move along any of three geometric axes that are perpendicular to each other. Each energy-conversion element operates to convert motion of the connecting member to electrical energy or vice versa. A common geometric plane passes through each of the at least two connecting members and the stationary member, and the two largest dimensions of each connecting member defines a geometric plane that is parallel with the common geometric plane.
Ultrasonic fingerprint sensor package
The present disclosure discloses an ultrasonic fingerprint sensor package. The ultrasonic fingerprint sensor package includes a substrate, a control chip, an ultrasonic probe, and packaging material. The substrate includes a substrate top surface and a plurality of first connection electrodes formed on the substrate top surface. The control chip includes a chip bottom surface and a plurality of second connection electrodes formed on the chip bottom surface. The control chip is connected to the substrate using a flip chip mounting technology. The second connection electrodes are connected to the first connection electrodes. The ultrasonic probe is arranged on the control chip, and configured to emit ultrasonic wave and receive ultrasonic wave reflected by an object. The packaging material covers the substrate and the control chip, and fixes the ultrasonic probe using a molding technology.
Acoustic resonator including extended cavity
A BAW resonator includes a nonlinear substrate defining a cavity, and an acoustic stack over the cavity, including a bottom electrode, a piezoelectric layer, and a top electrode, where an active region of the acoustic stack includes overlapping portions of the cavity, the bottom electrode, the piezoelectric layer and the top electrode. The BAW resonator further includes a connecting strip extending from a portion of the top electrode for providing electrical excitation of the acoustic stack, where an E-field generated in the BAW resonator begins at the top electrode and terminates at the bottom electrode in response to the electrical excitation. The cavity includes an inner portion in the active region and an extended portion extending from an outer perimeter of the active region underneath the connecting strip. A length of the extended portion are sufficient to substantially prevent portions of the E-field from passing through the substrate.
Control Device Of Piezoelectric Drive Device And Control Method Of Piezoelectric Drive Device
A control device of a piezoelectric drive device includes a drive pulse signal generation unit that generates a binary drive pulse signal, a drive signal generation unit that generates a drive signal which is applied to the piezoelectric element for drive from the drive pulse signal, a detection pulse signal generation unit that generates a detection pulse signal by binarizing the detection signal which is output from the piezoelectric element for detection, and a phase difference acquisition unit that acquires a phase difference between the drive pulse signal and the detection pulse signal, based on a rising edge and a falling edge of the drive pulse signal and a rising edge and a falling edge of the detection pulse signal.
PIEZOELECTRIC DRIVING DEVICE, PIEZOELECTRIC MOTOR, ROBOT, ELECTRONIC-COMPONENT CONVEYING APPARATUS, PRINTER, AND PROJECTOR
A piezoelectric driving device includes a substrate, a first insulating film disposed on the substrate, a piezoelectric element for driving disposed on the first insulating film and configured to vibrate the substrate, a piezoelectric element for detection configured to detect the vibration of the substrate, a wire for driving electrically connected to the piezoelectric element for driving, a wire for detection electrically connected to the piezoelectric element for detection, and a lower layer wire disposed between the first insulating film and the substrate and set to fixed potential. At least one of the wire for driving and the wire for detection overlaps at least a part of the lower layer wire.
Ultrasound Transducer and Manufacturing Method Thereof
An ultrasound transducer used in an ultrasound system and a method of manufacturing the same are disclosed. The ultrasound transducer is manufactured by forming a backing block including a plurality of surfaces; forming a piezoelectric layer including a first portion formed on the backing block to be in contact therewith and a second portion extending from the first portion; electrically connecting a plurality of pins to the second portion by attaching a connector having the plurality of pins for electrical connection with at least one of a transmitting unit and a receiving unit of an ultrasound system to at least one surface of the plurality of surfaces of the backing block; cutting the first portion and the second portion of the piezoelectric layer into a plurality of piezoelectric elements, wherein each of the plurality of piezoelectric elements is connected to a corresponding one of the plurality of pins of the connector; and forming a ground layer connected to the piezoelectric layer.
Extreme environment capable multilaminar transductive biomorph device
A wire-free multilayer biomorph device is provided where the layers are bonded without use of adhesive. The device includes a plurality of stacked perforated metal plates with interposed transductive assembly layers. The perforated metal plates and transductive assembly layers are bonded by a conductive metal ink that is subject to a thermal cycle process. Electrical connection of the perforated metal plates and transductive assembly are realized through structural connectors thru-connectors thereby obviating the need for wiring.
POSITIONING DEVICE AND METHOD FOR OPERATING SUCH A POSITIONING DEVICE
The invention relates to a positioning device (1) comprising a positioning unit (2) having at least one piezoelectric actuator (4), a drive element (5) to be coupled with an element (6) to be positioned, and a controller (3). The positioning device has a defect analysis device (16) for detecting defects in the positioning unit (2), wherein the actuator (4) or actuators, in addition to functioning as a drive for the drive element (5), functions or function as a generator (12) or a receiver (13) of ultrasonic sound waves, and the defect analysis device (16) comprises a measurement signal generator (22) for generating a sinusoidal electrical voltage for exciting the or a generator (12) and a resonance analyser (24) for analysing an electrical signal generated by the or a receiver (13). The invention also relates to a method for operating such a positioning device in order to detect defects in the positioning unit (2).
ULTRASONIC MODULE AND METHOD FOR MANUFACTURING THE SAME
An ultrasonic module and a manufacturing method for ultrasonic module are provided. The ultrasonic module includes a substrate, a composite layer, and a covering layer. The substrate has an upper surface. The composite layer has a top surface, a bottom surface, and a recessed surface recessed toward the bottom surface. The bottom surface is on the upper surface of the substrate. One or more space is formed between the recessed surface and the upper surface. The composite layer has one or more first groove extending from the top surface toward the recessed surface. The first groove separates the composite layer into a circuit structure and an ultrasonic structure connected to the circuit structure. The covering layer is assembled on the top surface of the composite layer.