A flexible device includes a flexible body and a plurality of piezoelectric materials arranged on the flexible body that deform in response to drive signals causing deformation of the flexible body of the flexible device.

The present invention relates to a component (1) for generating active haptic feedback, comprising a main body (2) having first and second internal electrodes (3, 4) stacked one above another in a stacking direction (S), wherein a respective piezoelectric layer (9) is arranged between the internal electrodes (3, 4), wherein the component (1) is configured to identify a force exerted on the component (1), wherein the component (1) is configured to generate active haptic feedback if a force exerted on the component (1) is identified, and wherein the haptic feedback is generated by virtue of an electrical voltage being applied between the first and second internal electrodes (3, 4), said electrical voltage resulting in a change in length of the main body (2).

Provided is a vibration wave motor, including: a vibration body; a friction member; a press member configured to pressurize the vibration body against the friction member; a base member configured to fix the friction member; and a damping member configured to damp vibration, wherein the vibration body and the friction member are configured to move relative to each other, wherein the friction member includes: a first surface having a first region held in abutment against the vibration body; and a second surface, which is a back surface of the first surface, and has a second region held in abutment against the base member, wherein at least one of the first surface and the second surface has a third region held in contact with the damping member, and wherein positions of the first region and the third region in a pressurizing direction of the press member are different from each other.

An electronic device comprises a CMOS substrate having a first surface and a second surface opposite the first surface. A plurality of ultrasonic transducers is provided having a transmit/receive surface. A contact surface is piezoelectrically associated with the plurality of ultrasonic transducers and is formed on the first surface of the CMOS substrate. The plurality of ultrasonic transducers is disposed on the second surface of the CMOS substrate, with the transmit/receive side attached to the second surface thereof such that the CMOS substrate is between the plurality of ultrasonic transducers and the platen. An image sensing system is also provided, together with a method for ultrasonic sensing in the electronic device.

Haptic interfaces are described. One haptic interface includes a piezoelectric body and first and second electrodes coupled to the piezoelectric body. The haptic interface also includes a control circuit. The control circuit includes a haptic actuator, a haptic sensor circuit, and an overcurrent protection circuit. The haptic actuator circuit is coupled to the first electrode and configured to charge the piezoelectric body. The charging causes the piezoelectric body to provide a haptic output. The haptic sensor circuit is coupled to the second electrode and configured to sense an electrical change at the second electrode. The electrical change is related to a haptic input received by the piezoelectric body. The overcurrent protection circuit is coupled to the second electrode and configured to limit a current flow into the haptic sensor circuit while the haptic actuator circuit is charging the piezoelectric body.

The present disclosure discloses an ultrasonic transducer. The ultrasonic transducer includes a piezoelectric layer. The piezoelectric layer includes an array of piezoelectric posts, a plurality of emitting electrodes, and a plurality of receiving electrodes. The piezoelectric posts are configured for emitting and receiving ultrasonic wave. The material of each of the piezoelectric posts includes lead zirconate titanate piezoelectric ceramics. The emitting electrodes are formed on a lower surface of the piezoelectric layer by a sputtering process. The receiving electrodes are formed on an upper surface of the piezoelectric layer by the sputtering process. Each of the emitting electrodes and each of the receiving electrodes include lead, zirconium, titanium, and/or alloys thereof. The present disclosure also discloses a method for manufacturing the ultrasonic transducer, an ultrasonic fingerprint recognition sensor having the ultrasonic transducer, and an electronic device having the ultrasonic fingerprint recognition sensor.

Substrate is produced by using a MEMS technique to form multiple diaphragms in a substrate by forming piezoelectric material layer on one surface of the substrate and thereafter by forming openings in the substrate from the other surface of the substrate; substrate and substrate on which signal detection circuit is formed are aligned to each other using at least one of multiple diaphragms as alignment diaphragm; and substrate and substrate are bonded together.

Implementations of the subject matter described herein relate to sensors including piezoelectric micromechanical ultrasonic transducer (PMUT) sensor elements and arrays thereof. The PMUT sensor elements may be switchable between a non- ultrasonic force detection mode and an ultrasonic imaging mode. A PMUT sensor element may include a diaphragm that is capable of a static displacement on application of a force and is capable of a dynamic displacement when the PMUT sensor element transmits or receives ultrasonic signals. In some implementations, a PMUT sensor element includes a two dimensional-electron gas structure on the diaphragm. The sensors may further include a sensor controller configured to switch between a non-ultrasonic force detection mode and an ultrasonic imaging mode for one or more of the PMUT sensor elements, wherein an applied force is measured in the non-ultrasonic force detection mode and wherein an object is imaged ultrasonically during the ultrasonic imaging mode.

A sound wave delivery structure of the present invention comprises unit structure cells each formed to have a cubic shape and comprising a column portion formed on a region corresponding to sides, and a space portion formed in an internal region surrounded by the column portion. There are a plurality of unit structure cells which are successively arranged in a first direction, in which sound waves are delivered, and a second direction crossing the first direction.

The present disclosure provides a sensor comprising: a sensing assembly, the sensing assembly including a sensing piezoelectric layer and a sensing electrode layer; a frequency adjustment assembly, the frequency adjustment assembly being physically connected to the sensing assembly, and being deformed under the action of an electrical signal to deform the sensing piezoelectric layer, thereby changing a resonance frequency of the sensing assembly; and a substrate, the substrate being configured carry the sensing assembly and the frequency adjustment assembly.