A method of monitoring a curing process for fiber reinforced composite materials that includes positioning an actuator on uncured composite material at a first location. At least one sensor is positioned at a second location that is spaced apart from the first location. The actuator excites waves in the composite part at the first location. At least one sensor is positioned at a second location that is spaced apart from the first location. The actuator excites waves in the composite part at the first location. The waves propagate through the composite part due to internal reflection. At least one wave metric is measured at the second location utilizing the sensor. At least one parameter of the curing process may be adjusted based, at least in part, on a wave metric measured by the sensor.

Surface modifications and improvements to piezoelectric-based sensors, such as QCMs and other piezoelectric devices, that significantly increase the sensitivity and the specificity (selectivity). These modifications can comprise mechanical and chemical changes to the surfaces of the sensors, either individually or together. For example, nanosize structures may be provided on the surface to improve sensitivity. Additionally, chemical coatings may be tethered to the surfaces, walls, or crystal to provide targeted sensitivity. Additionally, porous, layered and multiple senor arrays may be formed to enhance sensitivity and selectivity.

The present disclosure discloses an ultrasonic fingerprint sensor package. The ultrasonic fingerprint sensor package includes a substrate, a control chip, an ultrasonic probe, and packaging material. The substrate includes a substrate top surface and a plurality of first connection electrodes formed on the substrate top surface. The control chip includes a chip bottom surface and a plurality of second connection electrodes formed on the chip bottom surface. The control chip is connected to the substrate using a flip chip mounting technology. The second connection electrodes are connected to the first connection electrodes. The ultrasonic probe is arranged on the control chip, and configured to emit ultrasonic wave and receive ultrasonic wave reflected by an object. The packaging material covers the substrate and the control chip, and fixes the ultrasonic probe using a molding technology.

The present disclosure discloses an ultrasonic transducer. The ultrasonic transducer includes a piezoelectric layer. The piezoelectric layer includes an array of piezoelectric posts, a plurality of emitting electrodes, and a plurality of receiving electrodes. The piezoelectric posts are configured for emitting and receiving ultrasonic wave. The material of each of the piezoelectric posts includes lead zirconate titanate piezoelectric ceramics. The emitting electrodes are formed on a lower surface of the piezoelectric layer by a sputtering process. The receiving electrodes are formed on an upper surface of the piezoelectric layer by the sputtering process. Each of the emitting electrodes and each of the receiving electrodes include lead, zirconium, titanium, and/or alloys thereof. The present disclosure also discloses a method for manufacturing the ultrasonic transducer, an ultrasonic fingerprint recognition sensor having the ultrasonic transducer, and an electronic device having the ultrasonic fingerprint recognition sensor.

The present disclosure discloses an ultrasonic transducer. The ultrasonic transducer includes an active layer. The active layer includes an array of piezoelectric pillars configured for emitting and receiving ultrasound and an attenuation portion surrounding sidewalls of the piezoelectric pillars and configured for attenuating a part of the ultrasound emitted from the sidewalls of the piezoelectric pillars. The present disclosure also relates to an ultrasonic fingerprint recognition sensor and an electronic device having the ultrasonic transducer.

The present disclosure provides a manufacturing method of an ultrasonic fingerprint sensor. The method includes steps of: etching a plurality of through holes arranged in an array on an insulating substrate to form a frame; filling piezoelectric material into the through holes to form a plurality of piezoelectric posts corresponding to the plurality of through holes. The present disclosure also provides an ultrasonic fingerprint sensor. In the ultrasonic fingerprint sensor and the manufacturing method of the same according to the embodiment of the present disclosure, the frame is formed on the insulating substrate by etching, and the piezoelectric material is filled in the frame to form the piezoelectric posts to form the ultrasonic fingerprint sensor. The cost of the ultrasonic fingerprint sensor can be reduced because the etching apparatus is low-cost and the process is simple.

An electronic device includes a substrate; a first thin-film element formed on the substrate and having a lower electrode, a first upper electrode and a first thin-film part disposed between the lower electrode and the first upper electrode; and a second thin-film element formed on the substrate and having the lower electrode, a second upper electrode and a second thin-film part disposed between the lower electrode and the second upper electrode. Film thicknesses of the first and second thin-film parts are different from each other. The first thin-film part is formed by applying a precursor solution using a printing method to form a first precursor thin-film and imparting energy to the first precursor thin-film, and the second thin-film part is formed by applying the precursor solution using the printing method to form a second precursor thin-film and imparting energy to the second precursor thin-film.

A flexible device includes a flexible body and a plurality of piezoelectric materials arranged on the flexible body that deform in response to drive signals causing deformation of the flexible body of the flexible device.

A piezoelectric transducer comprises a piezoelectric element operable to transduce mechanical movement of the piezoelectric element to an electrical signal and to transduce an electrical signal in the piezoelectric element to a mechanical movement thereof, wherein the piezoelectric transducer is operable to transduce above a temperature of 200 C.

An optical element driving mechanism is provided. The optical element driving mechanism includes a movable portion, a fixed portion, and a driving assembly. The movable portion is used for connecting to a first optical element having an optical axis. The movable portion is movable relative to the fixed portion. The driving assembly is used for driving the movable portion to move relative to the fixed portion. When viewed along the optical axis, the optical element driving mechanism is strip-shaped.