In a chip-on-array approach, acoustic and electronic modules are separately formed. The acoustic stack is connected to one interposer, and the electronics are connected to another interposer. Different connection processes (e.g., using low temperature bonding for the acoustic stack and higher temperature-based interconnect for the electronics) may be used. This arrangement may allow for different pitches of the transducer elements and the I/O of the electronics by staggering vias in the interposers. The two interposers are then connected to form the chip-on-array.

A multilayer piezoelectric ceramic is constituted by: piezoelectric ceramic layers which do not contain lead as a constituent element, have a perovskite compound expressed by the composition formula Li.sub.xNa.sub.yK.sub.1−x−yNbO.sub.3 (where 0.02<x≤0.1, 0.02<x+y≤1) as the primary component, and contain 0.2 to 3.0 mol of Li relative to 100 mol of the primary component; and internal electrode layers which are constituted by a metal that contains silver by 80 percent by mass or more; wherein the multilayer piezoelectric ceramic is such that Li compounds other than the primary component are localized therein. The multilayer piezoelectric element can offer excellent insulating property.

A microphone including a casing having a front wall, a back wall, and a side wall joining the front wall to the back wall, a transducer mounted to the front wall, the transducer including a substrate and a transducing element, the transducing element having a transducer acoustic compliance dependent on the transducing element dimensions, a back cavity cooperatively defined between the back wall, the side wall, and the transducer, the back cavity having a back cavity acoustic compliance. The transducing element is dimensioned such that the transducing element length matches a predetermined resonant frequency and the transducing element width, thickness, and elasticity produces a transducer acoustic compliance within a given range of the back cavity acoustic compliance.

A vibration device includes a piezoelectric vibrator having a piezoelectric element and a diaphragm having a pair of main surfaces facing each other, the piezoelectric element being bonded to the main surface, a vibration member where the piezoelectric vibrator is disposed, and an adhesive member disposed between the diaphragm and the vibration member and bonding the diaphragm and the vibration member. Each of the pair of main surfaces of the diaphragm has a rectangular shape when viewed from a facing direction of the pair of main surfaces, and the adhesive member is disposed in a facing manner on at least a pair of sides of the main surfaces.

An electroactive device may include (1) an electroactive polymer element having a first surface and a second surface opposite the first surface, the electroactive polymer element comprising a nanovoided polymer material, (2) a primary electrode abutting the first surface of the electroactive polymer element, and (3) a secondary electrode abutting the second surface of the electroactive polymer element. The electroactive polymer element may be deformable from an initial state to a deformed state by application of an electrostatic field produced by a potential difference between the primary electrode and the secondary electrode. Various other devices, systems, and methods are also disclosed.

A method may include measuring an electrical parameter of an electromagnetic load having a moving mass during the absence of a driving signal actively driving the electromagnetic load, measuring a mechanical parameter of mechanical motion of a host device comprising the electromagnetic load, correlating a relationship between the mechanical parameter and the electrical parameter, and calibrating the electromagnetic load across a plurality of mechanical motion conditions based on the relationship.

An apparatus may include a vibration member and a vibration device configured to vibrate the vibration member. The vibration device may be configured to comprise a first vibration portion and a second vibration portion which is different from the first vibration portion.

An apparatus may include a vibration member and a vibration device configured to vibrate the vibration member. The vibration device may be configured to comprise a first vibration portion and a second vibration portion which is different from the first vibration portion.

A piezoelectric device includes a first substrate including a first surface on which piezoelectric elements and a common terminal coupled to the piezoelectric elements are placed, a second substrate including a second surface on which a common connecting terminal coupled to a control circuit is placed, a third substrate placed between the first substrate and the second substrate and including a third surface joined to the first surface and a fourth surface facing the second surface, and bonding portions bonding the second substrate and the third substrate by an adhesive, wherein the third substrate includes a first through hole penetrating from the third surface to the fourth surface and a first through electrode provided in the first through hole and coupled to the common terminal, the common connecting terminal is coupled to the first through electrode and electrically coupled to the common terminal via the first through electrode, and the second substrate includes a wall suppressing an outflow of the adhesive on the second surface facing the third substrate.

An actuator assembly includes (i) a first actuator stack having a first primary electrode, a first secondary electrode overlapping at least a portion of the first primary electrode, and a first electroactive layer disposed between and abutting the first primary electrode and the first secondary electrode, (ii) a second actuator stack having a second primary electrode, a second secondary electrode overlapping at least a portion of the second primary electrode, and a second electroactive layer disposed between and abutting the second primary electrode and the second secondary electrode; and (iii) a bonding layer disposed between the first actuator stack and the second actuator stack.