H10N30/50

CERAMIC CUTTER MATERIAL WITH A PIEZOELECTRIC EFFECT AND PREPARATION METHOD THEREOF, AND CUTTING TOOL

A ceramic tool material, in particular with piezoelectric effect and a preparation method thereof, and a cutting tool. The ceramic tool material includes the following raw materials by weight: 30-70 parts of matrix material, 30-70 parts of piezoelectric material, 5-10 parts of binder, and 10-20 parts of reinforcing phase and can be made into cutting tools. The cutting tool has a piezoelectric effect and excellent mechanical properties and can convert the cutting force signal into the charge signal during machining. By collecting charge signals, a cutting force can be measured and ceramic cutting tool condition can be monitored. Cutting force measurement function and high mechanical properties are integrated. A ceramic tool material with piezoelectric effect can measure the cutting force on the premise by meeting the cutting performance requirements.

Waveform Improvement Method and Ultrasonic Transducer Capable of Optimizing Acoustic Impedance
20230226572 · 2023-07-20 · ·

A waveform improvement method includes providing a piezoelectric material coupled to a matching material, generating a plurality of first grooves in a matching layer of at least one matching layer, packaging an isolation material into the plurality of first grooves, and providing two input voltages to the piezoelectric material for generating an ultrasonic signal by the piezoelectric material. The piezoelectric material includes at least one piezoelectric layer. The matching material includes at least one matching layer. The matching material is used to match acoustic impedance of the piezoelectric material. The plurality of first grooves in the matching layer are used to optimize the acoustic impedance and a vibration isolation effect.

Waveform Improvement Method and Ultrasonic Transducer Capable of Optimizing Acoustic Impedance
20230226572 · 2023-07-20 · ·

A waveform improvement method includes providing a piezoelectric material coupled to a matching material, generating a plurality of first grooves in a matching layer of at least one matching layer, packaging an isolation material into the plurality of first grooves, and providing two input voltages to the piezoelectric material for generating an ultrasonic signal by the piezoelectric material. The piezoelectric material includes at least one piezoelectric layer. The matching material includes at least one matching layer. The matching material is used to match acoustic impedance of the piezoelectric material. The plurality of first grooves in the matching layer are used to optimize the acoustic impedance and a vibration isolation effect.

Piezoelectric device and method of manufacturing the same

A piezoelectric device includes a piezoelectric single crystal body with a homogeneous polarization state and of which at least a portion flexurally vibrates, an upper electrode on an upper surface of the piezoelectric single crystal body, a lower electrode on a lower surface of the piezoelectric single crystal body, and a supporting substrate below the piezoelectric single crystal body. A recess extends from a lower surface of the supporting substrate toward the lower surface of the piezoelectric single crystal body.

Piezoelectric device and method of manufacturing the same

A piezoelectric device includes a piezoelectric single crystal body with a homogeneous polarization state and of which at least a portion flexurally vibrates, an upper electrode on an upper surface of the piezoelectric single crystal body, a lower electrode on a lower surface of the piezoelectric single crystal body, and a supporting substrate below the piezoelectric single crystal body. A recess extends from a lower surface of the supporting substrate toward the lower surface of the piezoelectric single crystal body.

OPTOELECTRONIC COMPONENT COMPRISING, ON A SINGLE SUBSTRATE, AN OPTICAL TRANSDUCER MADE OF A SEMI-CONDUCTOR MATERIAL III-V AND AN OPTICALLY SCANNING MICROELECTROMECHANICAL SYSTEM

An optoelectronic component includes an optical transducer made of III-V semiconductor material and an optical scanning microelectromechanical system comprising a mirror. The optical transducer and the optical scanning microelectromechanical system are produced on a common wafer comprising at least a first layer made of silicon or silicon nitride with a thickness of less than one micron and wherein at least the mirror and its holding springs are produced. In a first variant, the mobile parts of the optical scanning microelectromechanical system are produced in various layers of silicon. In a second variant, the mobile parts of the optical scanning microelectromechanical system are produced in the layer of III-V semiconductor material.

LAMINATED PIEZOELECTRIC ELEMENT AND ELECTROACOUSTIC TRANSDUCER

Provided are a laminated piezoelectric element and an electroacoustic transducer capable of obtaining high piezoelectric characteristics and easily ensuring an electric contact to an electrode layer. A plurality of layers of piezoelectric films, each of which is formed by laminating a first protective layer, a first electrode layer, a piezoelectric layer, a second electrode layer, and a second protective layer in this order, are laminated. Each of the piezoelectric layers is polarized in a thickness direction. In each of the piezoelectric films, the first electrode is disposed on an upstream side in a polarization direction of the piezoelectric layer, and the second electrode is disposed on a downstream side. Each of the plurality of piezoelectric films has a cemented portion which is cemented to an adjacent piezoelectric film and a protruding portion which is not cemented to the adjacent piezoelectric film and in which at least the first electrode layer and the first protective layer or the second electrode layer and the second protective layer protrude from the cemented portion toward the outside in a plane direction. At the protruding portion of each of the piezoelectric films, at least one of a first contact, to which the first electrode layers of the piezoelectric films are electrically connected to each other, or a second contact, to which the second electrode layers of the piezoelectric films are electrically connected to each other, is formed.

Vibration generating device and electronic equipment

A vibration generating device 10 includes: a diaphragm 11; and a first piezoelectric actuator 12 and a second piezoelectric actuator 13 attached on an upper surface 11a and a lower surface 11b of the diaphragm 11, respectively, so as to sandwich the diaphragm 11 therebetween in a vicinity of an end surface of the diaphragm 11, wherein, in a top view of the upper surface 11a of the diaphragm 11, the first piezoelectric actuator 12 is disposed at a position shifted with respect to the second piezoelectric actuator 13.

PIEZOELECTRIC ACTUATOR
20230010598 · 2023-01-12 · ·

A piezoelectric actuator includes a piezoelectric element having a longitudinal direction, a case including a lid portion, a bottom portion, and a tubular portion and housing the piezoelectric element inside, and a strain gauge positioned at the tubular portion. The tubular portion includes a plurality of bent portions in the longitudinal direction, each of the plurality of bent portions bending in response to extension and contraction of the piezoelectric element. The strain gauge is positioned at the bent portion.

ULTRASOUND TRANSDUCER WITH DISTRIBUTED CANTILEVERS

An ultrasound transducer of a vehicle system includes a support member that attaches to and connects to the bottom portion of a membrane of the ultrasound transducer and supports the membrane, wherein the support member includes one or more cantilevers with a first end attaching to the membrane and a second end attaching to a support portion of the support member that attaches to the substrate, wherein the cantilever extends across and floats above the substrate, wherein the first end of the cantilever includes a stub extending away from a surface of the cantilever, wherein the stub extends away from the surface without contacting the substrate, wherein the one or more cantilevers includes one or more piezoelectric layers on the surface of the cantilever.