Methods of etching metal by depositing a material reactive with a metal to be etched and a halogen to form a volatile species and exposing the substrate to a halogen-containing gas and activation gas to etch the substrate are provided. Deposited materials may include silicon, germanium, titanium, carbon, tin, and combinations thereof. Methods are suitable for fabricating MRAM structures and may involve integrating ALD and ALE processes without breaking vacuum.

In a method of manufacturing a piezoelectric device, during an isolation formation step, a supporting substrate has a piezoelectric thin film formed on its front with a compressive stress film present on its back. The compressive stress film compresses the surface on a piezoelectric single crystal substrate side of the supporting substrate, and the piezoelectric thin film compresses the back of the supporting substrate, which is opposite to the surface on the piezoelectric single crystal substrate side. Thus, the compressive stress produced by the compressive stress film and that produced by the piezoelectric thin film are balanced in the supporting substrate, which causes the supporting substrate to be free of warpage and remain flat. A driving force that induces isolation in the isolation formation step is gasification of the implanted ionized element rather than the compressive stress to the isolation plane produced by the piezoelectric thin film.

Various embodiments to mitigate the contamination of electroplated cobalt-platinum films on substrates are described. In one embodiment, a device includes a substrate, a titanium nitride diffusion barrier layer formed upon the substrate, a titanium layer formed upon the titanium nitride diffusion barrier layer, a platinum seed layer, and a cobalt-platinum magnetic layer formed upon the platinum seed layer. Based in part on the use of the titanium nitride diffusion barrier layer and/or the platinum seed layer, improvements in the interfaces between the layers can be achieved after annealing, with less delamination, and with substantial improvements in the magnetic properties of the cobalt-platinum magnetic layer. Further, the cobalt-platinum magnetic layer can be formed at a relatively thin thickness of hundreds of nanometers to a few microns while still maintaining good magnetic properties.

A transport device (100) comprises a housing (110), an actuator (130) and a drive (150). The housing has a fluid inlet (111, 113) and a fluid outlet (113, 111). The actuator (130) comprises a magnetic shape-memory alloy, and the actuator (130) is arranged at least in sections in the housing (110). The actuator (130) can be deformed by the drive (150) in such a way that at least one cavity (135, 135) for the fluid is formed in the actuator (130), which cavity can be moved by the drive (150) in order to transport the fluid in the cavity (135, 135) from the fluid inlet (111, 113) to the fluid outlet (113, 111). At least one section of the actuator (130) has a separation layer (1380) by which a direct contact between the fluid and the actuator (130) is prevented in said section of the actuator (130).

A transport device (100) comprises a housing (110), an actuator (130) and a drive (150). The housing has a fluid inlet (111, 113) and a fluid outlet (113, 111). The actuator (130) comprises a magnetic shape-memory alloy, and the actuator (130) is arranged at least in sections in the housing (110). The actuator (130) can be deformed by the drive (150) in such a way that at least one cavity (135, 135) for the fluid is formed in the actuator (130), which cavity can be moved by the drive (150) in order to transport the fluid in the cavity (135, 135) from the fluid inlet (111, 113) to the fluid outlet (113, 111). At least one section of the actuator (130) has a separation layer (1380) by which a direct contact between the fluid and the actuator (130) is prevented in said section of the actuator (130).

An improved method for etching a magnetic tunneling junction (MTJ) structure is achieved. A stack of MTJ layers is provided on a bottom electrode. The MTJ stack is patterned to form a MTJ device wherein sidewall damage or sidewall redeposition is formed on sidewalls of the MTJ device. A dielectric layer is deposited on the MTJ device and the bottom electrode. The dielectric layer is etched away using ion beam etching at an angle relative to vertical of greater than 50 degrees wherein the dielectric layer on the sidewalls is etched away and wherein sidewall damage or sidewall redeposition is also removed and wherein some of the dielectric layer remains on horizontal surfaces of the bottom electrode.

In a method of manufacturing a piezoelectric device, during an isolation formation step, a supporting substrate has a piezoelectric thin film formed on its front with a compressive stress film present on its back. The compressive stress film compresses the surface on a piezoelectric single crystal substrate side of the supporting substrate, and the piezoelectric thin film compresses the back of the supporting substrate, which is opposite to the surface on the piezoelectric single crystal substrate side. Thus, the compressive stress produced by the compressive stress film and that produced by the piezoelectric thin film are balanced in the supporting substrate, which causes the supporting substrate to be free of warpage and remain flat. A driving force that induces isolation in the isolation formation step is gasification of the implanted ionized element rather than the compressive stress to the isolation plane produced by the piezoelectric thin film.

An improved method for etching a magnetic tunneling junction (MTJ) structure is achieved. A stack of MTJ layers is provided on a bottom electrode. The MTJ stack is patterned to form a MTJ device wherein sidewall damage or sidewall redeposition is formed on sidewalls of the MTJ device. A dielectric layer is deposited on the MTJ device and the bottom electrode. The dielectric layer is etched away using ion beam etching at an angle relative to vertical of greater than 50 degrees wherein the dielectric layer on the sidewalls is etched away and wherein sidewall damage or sidewall redeposition is also removed and wherein some of the dielectric layer remains on horizontal surfaces of the bottom electrode.

Disclosed is a flexible tactile actuator including a tactile transmitter configured to be flexible and including magnetic particles capable of being polarized in response to an external magnetic field and a matrix layer including the magnetic particles, a magnetic field generator disposed below the tactile transmitter and configured to generate a magnetic field in the tactile transmitter, and an elastic member provided in a shape of a film, having at least a portion in surface contact with the magnetic field generator, and attached to be in surface contact with one of a top surface and a bottom surface of the tactile transmitter.

Disclosed is a flexible tactile actuator including a tactile transmitter configured to be flexible and including magnetic particles capable of being polarized in response to an external magnetic field and a matrix layer including the magnetic particles, a magnetic field generator disposed below the tactile transmitter and configured to generate a magnetic field in the tactile transmitter, and an elastic member provided in a shape of a film, having at least a portion in surface contact with the magnetic field generator, and attached to be in surface contact with one of a top surface and a bottom surface of the tactile transmitter.