Patent classifications
H10N60/01
Qubit frequency tuning structures and fabrication methods for flip chip quantum computing devices
In an embodiment, a method includes forming a first chip having a first substrate and one or more qubits disposed on the first substrate, each of the one or more qubits having an associated resonance frequency. In an embodiment, the method includes forming a second chip having a second substrate and at least one conductive surface disposed on the second substrate opposite the one or more qubits, the at least one conductive surface having at least one dimension configured to adjust the resonance frequency associated with at least one of the one or more qubits to a determined frequency adjustment value.
SAG NANOWIRE GROWTH WITH ION IMPLANTATION
The present disclosure relates to a nanowire structure, which includes a substrate with a substrate body and an ion implantation region, a patterned mask with an opening over the substrate, and a nanowire. Herein, the substrate body is formed of a conducting material, and the ion implantation region that extends from a top surface of the substrate body into the substrate body is electrically insulating. A surface portion of the substrate body is exposed through the opening of the patterned mask, while the ion implantation region is fully covered by the patterned mask. The nanowire is directly formed over the exposed surface portion of the substrate body and is not in contact with the ion implantation region. Furthermore, the nanowire is confined within the ion implantation region, such that the ion implantation region is configured to provide a conductivity barrier of the nanowire in the substrate.
SAG NANOWIRE GROWTH WITH A PLANARIZATION PROCESS
The present disclosure relates to a method of manufacturing a nanowire structure. According to an exemplary process, a substrate is firstly provided. An intact buffer region is formed over the substrate, and a sacrificial top portion of the intact buffer region is eliminated to provide a buffer layer with a planarized top surface. Herein, the planarized top surface has a vertical roughness below 10 Å. Next, a patterned mask with an opening is formed over the buffer layer, such that a portion of the planarized top surface of the buffer layer is exposed. A nanowire is formed over the exposed portion of the planarized top surface of the buffer layer through the opening of the patterned mask. The buffer layer is configured to have a lattice constant that provides a transition between the lattice constant of the substrate and the lattice constant of the nanowire.
SCHEDULING OF TASKS FOR EXECUTION IN PARALLEL BASED ON GEOMETRIC REACH
Systems and methods related to scheduling of tasks for execution in parallel based on geometric reach are described. An example method includes processing information pertaining to connectivity among superconducting components and nodes included in a shared floor plan to generate a plurality of areas of reach, where each of the plurality of areas of reach corresponds to a portion of the shared floor plan. The method further includes generating a plurality of inflated areas of reach by inflating each of the plurality of areas of reach based on a target inductance of wires for routing signals among the superconducting components and the nodes included in the shared floor plan. The method further includes scheduling parallel execution of tasks for routing wires among a subset of the superconducting components and the nodes within any of the plurality of inflated areas of reach satisfying a geometric constraint.
METHOD OF MAKING A QUANTUM DEVICE
A method for producing a quantum device comprising providing a substrate having a front face and carrying at least one transistor pattern on the front face thereof, said transistor pattern comprising, in a stack a gate dielectric on the front face of the substrate, and a gate on the gate dielectric, said gate having a top and sidewalls. The method further includes forming a protective layer at the front face of the substrate, said protective layer being configured to prevent diffusion of at least one metal species in the substrate, forming a metal layer that has, as a main component, at least one metal species, at least on the sidewalls of the gate, said at least one metal species comprising at least one superconducting element, and forming a superconducting region in the gate by lateral diffusion of the at least one superconducting element from the sidewalls of said gate.
Glassy carbon mask for immersion implant and selective laser anneal
According to an embodiment of the present invention, a method of producing a computing device includes providing a semiconductor substrate, and patterning a mask on the semiconductor substrate, the mask exposing a first portion of the semiconductor substrate and covering a second portion of the semiconductor substrate. The method includes implanting the first portion of the semiconductor substrate with a dopant. The method includes annealing the first portion of the semiconductor substrate to form an annealed doped region, while maintaining the second portion of the semiconductor substrate as an unannealed portion.
METHOD OF FABRICATING A SEMICONDUCTOR DEVICE
A semiconductor device is fabricated by: forming a shadow wall on a substrate; subsequently growing a nanowire of semiconductor material on the substrate; and directionally depositing a layer of a further material on the nanowire from a direction selected such that the shadow wall casts a shadow on the nanowire, the shadow being a region in which the further material is not deposited. The nanowire is vertically orientated relative to the substrate. The shadow wall comprises a base portion and a bridge portion. The bridge portion overhangs the substrate and is supported by the base portion. Patterning of the further material may be achieved without the use of etching, thereby avoiding damage to the semiconductor. Also provided is a semiconductor-superconductor hybrid device; a quantum computing device comprising the semiconductor-superconductor hybrid device; and a shadow wall for controlling directional deposition of a material.
METHOD OF FABRICATING A SEMICONDUCTOR DEVICE
A semiconductor device is fabricated by: forming a shadow wall on a substrate; subsequently growing a nanowire of semiconductor material on the substrate; and directionally depositing a layer of a further material on the nanowire from a direction selected such that the shadow wall casts a shadow on the nanowire, the shadow being a region in which the further material is not deposited. The nanowire is vertically orientated relative to the substrate. The shadow wall comprises a base portion and a bridge portion. The bridge portion overhangs the substrate and is supported by the base portion. Patterning of the further material may be achieved without the use of etching, thereby avoiding damage to the semiconductor. Also provided is a semiconductor-superconductor hybrid device; a quantum computing device comprising the semiconductor-superconductor hybrid device; and a shadow wall for controlling directional deposition of a material.
THREE-DIMENSIONAL SUPERCONDUCTING QUBIT AND A METHOD FOR MANUFACTURING THE SAME
A three-dimensional superconducting qubit and a method for manufacturing the same are disclosed. In an example, a three-dimensional superconducting qubit comprises a structural base comprising one or more insulating materials, and superconductive patterns on surfaces of the structural base. The superconductive patterns form at least a capacitive part and an inductive part of the three-dimensional superconducting qubit. A first surface of the surfaces of the structural base defines a first plane and a second surface of the surfaces of the structural base defines a second plane, the second plane being oriented differently than the first plane. At least one superconductive pattern of the superconductive patterns extends from the first surface to the second surface.
METHOD FOR PRODUCING SEMICONDUCTOR APPARATUS FOR QUANTUM COMPUTER
A method produces a semiconductor apparatus for a quantum computer. The apparatus includes: a semiconductor substrate; a quantum computer device formed on the semiconductor substrate; and a peripheral circuit formed on the semiconductor substrate and connected to the quantum computer device. The apparatus is to be used as a quantum computer. The method includes: a step of forming the quantum computer device and the peripheral circuit on the semiconductor substrate; and a step of deactivating a carrier in the semiconductor substrate by irradiation of a particle beam to at least a formation part for the quantum computer device and a formation part for the peripheral circuit in the semiconductor substrate. The method for producing a semiconductor apparatus for a quantum computer can produce a semiconductor apparatus for a quantum computer having excellent 3HD characteristics.