A method for etching fragments of aluminum or an aluminum alloy comprising the steps of: a. providing a hydrochloric acid solution in a trough-shaped container; b. inoculating the hydrochloric acid solution by chemically dissolving an amount of aluminum to produce an etching solution; c. adding the fragments to the etching solution immediately after the inoculation; d. etching the fragments for 0.5 to 10 minutes while stirring in such a way that the fragments are entrained by the motion of the etching solution; e. stopping the etching by diluting the etching solution with water; f. removing the etched fragments; g. repeatedly rinsing the fragments with water and h. rinsing the fragments with an organic desiccant. An etched fragment of aluminum or an aluminum alloy and also to a composite material comprising etched fragments.

A conductor for power transportation includes an elongated core constructed from a core material and an elongated conductive casing constructed from a conductive material. The elongated conductive casing is positioned around the elongated core and constructed from various layers of wires. Each layer of wires consists of a set of wires which are positioned next to each other, and at least a fraction of these wires being shaped in such a way that for the cross section of the wire, a circumscribed circle is filled only with between 50% and 90% of wire material. The cross section of the wire has a central portion filled with wire and a plurality of protrusions. The shape of these wires is such that the space taken up by these wires in the stack of wires in the layers is substantially cylindrical.

An aluminum based composite material includes an aluminum parent phase and dispersions dispersed in the aluminum parent phase and formed such that a portion or all of additives react with aluminum in the aluminum parent phase, an average particle diameter of the dispersions is 20 nm or less, a content of the dispersions is 0.25% by mass or more and 0.72% by mass or less in terms of carbon amount, and an interval between the dispersions adjacent to each other is 210 nm or less.

A transmission system including a hybrid cable for optical and electrical data transfer. The smart cable includes an outermost sheath and an inner aluminum foil adjacent to the outermost sheath. The inner aluminum foil defining an annular space that contains a number of cable lines. A filler fills any space within the annular space. The cable lines include at least four optical fiber lines each connected to an optical connector, at least one optical fiber line connected to a Toslink connector; and at least one aux cable. Each of the cable lines can be of a different length from other cable lines.

A flat routing material includes a flat conductive material and an insulating coating covering the conductive material. The routing material includes a bent portion as a part bending in an edgewise direction at a predetermined angle or more, and one or more folds extending toward the outer peripheral side of the bent portion are provided on at least the inner peripheral side of the bent portion. The folds are manufactured by press working.

A method of manufacturing an aluminum alloy wire includes: forming a rough drawing wire composed of an aluminum alloy containing aluminum, an additive element, and unavoidable impurities, the additive element including Si and Mg; obtaining an aluminum alloy wire by performing a treatment on the rough drawing wire, wherein the treatment includes at least one or more wire drawing treatments; forming a first solution treatment material by forming a solid solution of the aluminum and the additive element and then performing a quenching treatment on the solid solution, wherein the first solution treatment is performed directly before the last of the one or more wire drawing treatments is performed; a second solution treatment that forms a second solution treatment material by forming a solid solution of the aluminum and the additive element and then performing a quenching treatment on the solid solution.

A contact pin for connecting a first electrical conductor made of copper or a copper alloy and a second electrical conductor made of aluminum or an aluminum alloy comprises a plug-in section, a connecting section, and a coating disposed at least on the connecting section. The plug-in section is adapted to couple to the first electrical conductor. The connecting section is adapted to connect to the second electrical conductor. The coating is corrosion-resistant and compatible with aluminum and copper.

The present invention discloses a metal composite wire capable of increasing a tightness degree of copper-aluminum bonding. The metal composite wire includes a metal core rod. Continuous spiral grooves are formed in a surface of the core rod. The core rod is cladded with a metal cladding layer with higher electrical conductivity than the core rod. An average depth of the continuous spiral grooves ≤1/10 of a thickness of the metal cladding layer. By setting the thickness of the metal cladding layer as t.sub.1, a specific gravity of the metal cladding layer as ρ.sub.1, a diameter of the core rod as R, the average depth of the continuous spiral grooves as h, and a specific gravity of the core rod as ρ.sub.2, $t_1=\sqrt{\frac{{\left(R-h\right)}^2\times {\rho }_1+k\times {\left(R-h\right)}^2\times {\rho }_2-k\times {\left(R-h\right)}^2\times {\rho }_1}{(}}$

Provided is an aluminum alloy material having high strength and excellent wear resistance, which can be a substitute for an iron-based metal material or a copper-based metal material. The aluminum alloy material has an alloy composition containing 0.05-1.80% by mass of Mg, 0.01-2.00% by mass of Si, and 0.01-1.50% by mass of Fe, the remainder comprising Al and unavoidable impurities, wherein the aluminum alloy material has a fibrous microstructure in which crystal grains extend along substantially one direction, the average value of the short-direction dimension L2 perpendicular to the longitudinal direction of the crystal grains is 500 nm or less in a cross section parallel to the substantially one direction, and the arithmetic mean roughness Ra of a principal surface of the aluminum alloy material is no greater than 1.000 μm.

A surface finish for a printed circuit board (PCB) and semiconductor wafer includes a nickel disposed over an aluminum or copper conductive metal surface. A barrier layer including all or fractions of a nitrogen-containing molecule is deposited on the surface of the nickel layer to make a barrier layer/electroless nickel (BLEN) surface finish. The barrier layer allows solder to be reflowed over the surface finish. Optionally, gold (e.g., immersion gold) may be coated over the barrier layer to create a nickel/barrier layer/gold (NBG) surface treatment. Presence of the barrier layer causes the surface treatment to be smoother than a conventional electroless nickel/immersion gold (ENIG) surface finish. Presence of the barrier layer causes a subsequently applied solder joint to be stronger and less subject to brittle failure than conventional ENIG.