An electronic device, a method and apparatus for producing an electronic device, and a composition therefor are disclosed. An adhesive material is applied in a first pattern on a surface of a receiver substrate. A carrier having a metal foil disposed thereon is brought into contact with the first substrate such that a portion of the metal foil contacts the adhesive material. The adhesive material includes a first polymer, a second polymer, and a conductive carbon black dispersion, and is activated using at least one of mechanical pressure and heat while the portion of the metal foil is in contact with the adhesive material. The first substrate and the second substrate are separated, whereby the portion of the metal foil is transferred to the first substrate. The adhesive is electrically conductive to maximize the possibility of maintaining electrical connectivity even when there is a break in the metal foil.

An insulated electric conductor having a copper core, a layer of aluminum formed on the copper core, and a second layer of aluminum in the form of high-purity aluminum is disclosed. The copper core may be a solid core or may be formed from a plurality of copper strands. The layer of aluminum formed over the copper core is at least partially anodized to form an aluminum oxide dielectric layer. The layer of high-purity aluminum may be formed by evaporation deposition, sputter deposition, or co-extrusion. Once the layer of high-purity aluminum is formed, it is anodized. More than two layers of aluminum may be formed over the copper core.

A copper alloy sheet or strip for a lead frame of LED includes specific amounts of Fe, P, Zn, and Sn with the remainder being Cu and unavoidable impurities. A surface roughness thereof is less than 0.06 μm in terms of arithmetic average roughness Ra and is less than 0.5 μm in terms of ten-point average roughness Rz.sub.JIS. The number of groove-shaped recesses present on the surface, each having a length of 5 μm or more and a depth of 0.25 μm or more, is 2 or less in a range of a square of 200 μm×200 μm with a pair of its sides running in transverse to a rolling direction. A thickness of a work affected layer formed of fine grains on the surface is 0.5 μm or less.

A method for producing a contact region for a layer of an electrical heating device for a motor vehicle may include providing the layer made of a thermally sprayed, electrically conductive material, providing a laser beam having a focus, introducing a powder of an electrically conductive material into the focus of the laser beam, and thereby melting the powder, applying the molten powder to a region of the layer, and thereby forming the contact region from the electrically conductive material for making contact with the layer.

An all-wire weft-knit tubular sleeve can be knit from a plurality of electrically conductive wire filaments. Further, an electrically conductive bus wire can be interlaced in the weft knit pattern of the tubular sleeve to provide improved electrical contact along the entire length of the gasket. The exemplary weft-knit sleeve can allow for at least a 15% axial stretch without breaking the bus wire. The conductive wire filaments can be a copper/nickel alloy having a wire diameter of between about 0.075 mm and about 0.1 mm, a tensile strength of between about 70-125 KSI and an elongation of at least 12%.

A dilute copper alloy material includes, based on a total mass of the dilute copper alloy material, 2 to 12 mass ppm of sulfur, 2 to 30 mass ppm of oxygen, 4 to 55 mass ppm of titanium, and a balance of pure copper and inevitable impurity. A part of the sulfur and the titanium forms a compound or an aggregate of TiO, TiO.sub.2, TiS or Ti—O—S, and an other part of the sulfur and the titanium forms a solid solution. TiO, TiO.sub.2, TiS and Ti—O—S distributed in a crystal grain of the dilute copper alloy material are not more than 200 nm, not more than 1000 nm, not more than 200 nm and not more than 300 nm, respectively, in particle size thereof, and not less than 90% of particles distributed in a crystal grain of the dilute copper alloy material are 500 nm or less in particle size.

The present specification provides a conductive structure body comprising: a substrate; a conductive layer; at least one intermediate layer; and a darkening layer, and a method of manufacturing the same. The conductive structure body may prevent reflectance by the conductive layer without affecting conductivity of the conductive layer, and may improve a concealing property of the conductive layer by improving absorbance. Accordingly, a display panel having improved visibility may be developed by using the conductive structure body.

The present invention relates to a composition for forming a conductive pattern and a resin structure having a conductive pattern, wherein the composition makes it possible to form a fine conductive pattern on various polymer resin products or resin layers through a simple process, and can more effectively meet needs of the art, such as displaying various colors. The composition for forming a conductive pattern, comprises: a polymer resin; and a non-conductive metal compound having a predetermined chemical structure, and may be a composition for forming a conductive pattern through electromagnetic irradiation, by which a metal nucleus is formed from the non-conductive metal compound.

A stranded conductor (2) including a specific number of a first type of wire (5) which, in cross-section of the stranded conductor, are arranged in a hexagonal pattern around a central wire in at least two layers. The wires arranged at the vertices of the hexagonal pattern are of a second type of wire having in principle a smaller diameter than the first type of wires. The interstitial spaces (10) between the first and the second wires are filled by a sealing agent (3).

Provided is a dendritic silver-coated copper powder which is prevented from agglomeration, while ensuring excellent electrical conductivity by increasing contact points in cases where silver-coated dendritic copper powder particles are in contact with each other. This dendritic silver-coated copper powder is suitable for use in conductive pastes, electromagnetic shielding materials and the like. A dendritic silver-coated copper powder 1 according to the present invention has a dendritic form which comprises a linearly grown main trunk 2 and a plurality of branches 3 arising from the main trunk 2. The main trunk 2 and the branches 3 are configured of copper particles which have plate-like shapes having an average cross-sectional thickness of 0.2-1.0 μm, and the surfaces of which are coated with silver. This dendritic silver-coated copper powder 1 has an average particle diameter (D50) of 5.0-30 μm as determined by a laser diffraction/scattering particle size distribution measuring method.