A copper electrode material comprising Cu and unavoidable impurities, wherein the content of the unavoidable impurities is 1 ppm by mass or less and the average crystal grain diameter is 100 μm or less. A copper-containing electrode material having improved corrosion resistance is provided by the copper electrode material.

An electroconductive substrate including a base material and a metal wiring made of at least either of silver and copper, and the electroconductive substrate has an antireflection region formed on part or all of the metal wiring surface. This antireflection region is composed of roughened particles made of at least either of silver and copper and blackened particles finer than the roughened particles and embedded between the roughened particles. The blackened particles are made of silver or a silver compound, copper or a copper compound, or carbon or an organic substance having a carbon content of 25 wt % or more. The antireflection region has a surface with a center line average roughness of 15 nm or more and 70 nm or less. The electroconductive substrate is formed from metal wiring from a metal ink that forms roughened particles, followed by application of a blackening ink containing blackened particles.

A method for synthesizing a copper-silver alloy includes an ink preparation step, a coating step, a crystal nucleus formation step and a crystal nucleus synthesis step. In the ink preparation step, a copper salt particle, an amine-based solvent, and a silver salt particle are mixed, thereby preparing a copper-silver ink. In the coating step, a member to be coated is coated with the copper-silver ink. In the crystal nucleus formation step, at least one of a crystal nucleus of copper having a crystal grain diameter of 0.2 μm or less and a crystal nucleus of silver having a crystal grain diameter of 0.2 μm or less is formed from the copper-silver ink. In the crystal nucleus synthesis step, the crystal nucleus of copper and the crystal nucleus of silver are synthesized.

A composition and method for reducing the coefficient of friction and required pulling force of a wire or cable are provided. A composition of aqueous emulsion is provided that is environmentally friendly, halogen free and solvent free. The composition is compatible with various types of insulating materials and may be applied after the wire or cable is cooled and also by spraying or submerging the wire or cable in a bath. The composition contains lubricating agents that provide lower coefficient of friction for wire or cable installation and continuous wire or cable surface lubrication thereafter.

A deep sea lifting cable having a cable core (36) surrounded by armouring (32), wherein the armouring is surrounded by an outer jacket (33), wherein the cable core comprises at least one power cable (10) is disclosed. The armouring (32) comprises synthetic stiff ropes and interstices (35) between the stiff ropes are filed with a high viscous filler.

The evaluation jig includes a pair of female terminals connectable to a pair of male terminals of a charging connector and an electric wire that connects the paired female terminals to each other. The electric wire has a cross-sectional area of 70 mm.sup.2 or more and 95 mm.sup.2 or less. The electric wire has a length of 2 m or more.

This anisotropic conductive sheet has an insulation layer, a plurality of conduction paths, and a plurality of adhesion layers disposed therebetween. The adhesion layers each contain a silane coupling agent composition containing a silane coupling agent having a vinyl group and a hydrolyzable group, or a polycondensate of said composition. In the anisotropic conductive sheet: a) the insulation layer contains an addition crosslinked product of a silicone rubber composition containing an organopolysiloxane having a SiH group, and the vinyl groups of the adhesion layers is bound to the SiH group of the insulation layer through an addition reaction; or b) the insulation layer contains an organic peroxide crosslinked product of a silicone rubber composition containing an organopolysiloxane having a SiCH.sub.3 group, the vinyl groups of the adhesion layers is bound to the SiCH.sub.3 group of the insulation layer through a radical addition reaction.

A copper alloy plastically-worked material comprises Mg in the amount of 10-100 mass ppm and a balance of Cu and inevitable impurities, which comprise 10 mass ppm or less of S, 10 mass ppm or less of P, 5 mass ppm or less of Se, 5 mass ppm or less of Te, 5 mass ppm or less of Sb, 5 mass ppm or less of Bi and 5 mass ppm or less of As. The total amount of S, P, Se, Te, Sb, Bi, and As is 30 mass ppm or less. The mass ratio of [Mg]/[S+P+Se+Te+Sb+Bi+As] is 0.6 or greater and 50 or less. The electrical conductivity is 97% IACS or greater. The tensile strength is 275 MPa or less. The heat-resistant temperature after draw working is 150° C. or higher.

A copper powder containing copper particulates, wherein the copper powder has a number of particles with a particle size of 1.5 pm or more of 10000 or less per 10 mL of a solution, as measured in the solution using an in-liquid particle counter, the solution having a copper ion concentration of 10 g/L and being obtained by dissolving the copper particulates of the copper powder in nitric acid.

Metallic alloy interconnects (which can comprise copper) with low electrical resistivity and methods for making the same are disclosed. The electrical resistivity of thin film copper alloys was reduced by 36% with niobium solute and by 51% with iron solute compared to pure copper counterpart in dilute solute regimes (0-1.5 atomic %). The fabrication method is operated at room temperature, and does not require a high temperature annealing step.