An electrical train messenger wire and a catenary system for an electrical train including the electrical train messenger wire. The messenger wire includes a fiber-reinforced composite strength member and a conductive layer surrounding the fiber-reinforced composite strength member, where the conductive layer is fabricated from copper or a copper alloy. The fiber-reinforced strength member advantageously has a high tensile strength, thereby reducing the sag of a contact wire supported by the messenger wire. The catenary system employing the messenger wire may facilitate faster train speeds and may obviate the need for cantilever systems such as balanced weight anchors to maintain tension in the contact wire.

There are provided an inexpensive copper powder, which has a low content of oxygen even it has a small particle diameter and which has a high shrinkage starting temperature when it is heated, and a method for producing the same. While a molten metal of copper heated to a temperature, which is higher than the melting point of copper by 250 to 700° C. (preferably 350 to 650° C. and more preferably 450 to 600° C.), is allowed to drop, a high-pressure water is sprayed onto the heated molten metal of copper in a non-oxidizing atmosphere (such as an atmosphere of nitrogen, argon, hydrogen or carbon monoxide) to rapidly cool and solidify the heated molten metal of copper to produce a copper powder which has an average particle diameter of 1 to 10 μm and a crystallite diameter Dx.sub.(200) of not less than 40 nm on (200) plane thereof, the content of oxygen in the copper powder being 0.7% by weight or less.

A high strength/highly conductive copper alloy plate material of the present invention contains silver in a range of 4% by mass or more and 13% by mass or less, and balancing copper and unavoidable impurities. In the high strength/highly conductive copper alloy plate material, a minimum value of a tensile strength (UTS) is 600 MPa or more and 1250 MPa or less, and a conductivity (% IACS) is 60% or more and 90% or less.

A composite wire material may comprise a core wire comprising copper (Cu). The core wire material may comprise a first layer on a circumferential surface of the core wire, where the first layer comprises graphene. The composite wire material may comprise a second layer on a circumferential surface of the first layer, where the second layer comprises nickel (Ni).

In various embodiments, electronic devices such as touch-panel displays incorporate interconnects featuring a conductor layer and, disposed above the conductor layer, a capping layer comprising an alloy of Cu and one or more refractory metal elements selected from the group consisting of Ta, Nb, Mo, W, Zr, Hf, Re, Os, Ru, Rh, Ti, V, Cr, and Ni.

The invention is a copper alloy with excellent comprehensive performance, including the following components in percentage by weight: 0.4 wt %-2.0 wt % of Ni, 0.2 wt %-2.5 wt % of Sn, 0.02 wt %-0.25 wt % of P, 0.001 wt %-0.5 wt % of Si, and the balance of Cu and unavoidable impurities. The copper alloy has a yield strength of 550 MPa or above, and an electrical conductivity of 38% IACS or above. A bending workability is as follows: the value of R/t in the GW direction is less than or equal to 1, and the value of R/t in the BW direction is less than or equal to 2; and after the copper alloy is kept at 150° C. for 1000 hours, a residual stress rate is greater than or equal to 75%, and the stress relaxation resistance is excellent.

This copper alloy for electronic or electric devices includes: Mg: 0.15 mass % or greater and less than 0.35 mass %; and P: 0.0005 mass % or greater and less than 0.01 mass %, with a remainder being Cu and unavoidable impurities, wherein an amount of Mg [Mg] and an amount of P [P] in terms of mass ratio satisfy [Mg]+20×[P]<0.5, and 0.20<(NF.sub.J2/(1−NF.sub.J3)).sup.0.5≤0.45 is satisfied in a case where a proportion of J3, in which all three grain boundaries constituting a grain boundary triple junction are special grain boundaries, to total grain boundary triple junctions is represented by NF.sub.J3, and a proportion of J2, in which two grain boundaries constituting a grain boundary triple junction are special grain boundaries and one grain boundary is a random grain boundary, to the total grain boundary triple junctions is represented by NF.sub.J2.

A terminal plating material includes a metallic base that contains copper or a copper alloy, and a carbon composite silver plating layer that disposed on the metallic base and contains either silver or a silver alloy and carbon.

A cable is provided with a cable core including one or more electric wires, a shield layer provided to cover around the cable core and composed of a laterally wound shield formed by winding metal wire strands helically, and a sheath provided to cover around the shield layer. The metal wire strands are semi-hard copper alloy wires, and P/PD, which is the ratio of the winding pitch P in the laterally wound shield to the pitch diameter PD of the shield layer, is less than 9.9.

A covered electrical wire comprises a conductor and an insulating covering layer provided outside the conductor, the conductor being a stranded wire composed of a plurality of copper alloy wires composed of a copper alloy and twisted together, and having a wire diameter of 0.5 mm or less, the copper alloy containing Fe in an amount of 0.1% by mass or more and 1.6% by mass or less, P in an amount of 0.05% by mass or more and 0.7% by mass or less, and one or more elements selected from Ni, Al, Cr and Co in an amount of 0.01% by mass or more and 0.7% by mass or less in total, with a balance being Cu and impurities.