H01B1/026

COVERED ELECTRICAL WIRE, TERMINAL-EQUIPPED ELECTRICAL WIRE, COPPER ALLOY WIRE, AND COPPER ALLOY STRANDED WIRE

A covered electrical wire comprises a conductor and an insulating covering layer provided outside the conductor, the conductor being a stranded wire composed of a plurality of copper alloy wires composed of a copper alloy and twisted together, and has a wire diameter of 0.5 mm or less, the copper alloy containing Ni, or Ni and Fe in an amount of 0.1% by mass or more and 1.6% by mass or less in total, and P in an amount of 0.05% by mass or more and 0.7% by mass or less, with a balance being Cu and impurities, in the copper alloy, a ratio of precipitation of P to solid solution of P being 1.1 or more.

COVERED ELECTRICAL WIRE, TERMINAL-EQUIPPED ELECTRICAL WIRE, COPPER ALLOY WIRE, COPPER ALLOY STRANDED WIRE, AND METHOD FOR MANUFACTURING COPPER ALLOY WIRE

A covered electrical wire comprises a conductor and an insulating covering layer provided outside the conductor, the conductor being a stranded wire composed of a plurality of copper alloy wires composed of a copper alloy and twisted together, and having a wire diameter of 0.5 mm or less, the copper alloy containing Fe in an amount of 0.1% by mass or more and 1.6% by mass or less, P in an amount of 0.05% by mass or more and 0.7% by mass or less, and Sn in an amount of 0.05% by mass or more and 0.7% by mass or less, and further including one or more elements selected from Zr, Ti and B in an amount of 1000 ppm by mass or less in total, with a balance being Cu and impurities.

Copper alloy for electronic/electric device, copper alloy sheet/strip material for electronic/electric device, component for electronic/electric device, terminal, and busbar

A copper alloy includes, by mass %: Mg: 0.15%-0.35%; and P: 0.0005%-0.01%, with a remainder being Cu and unavoidable impurities, wherein [Mg]+20×[P]<0.5 is satisfied. Among the unavoidable impurities, H is 10 mass ppm or less, O is 100 mass ppm or less, S is 50 mass ppm or less, and C is 10 mass ppm or less. In addition, 0.20<(NF.sub.J2/(1−NF.sub.J3)).sup.0.5≤0.45 is satisfied where a proportion of J3, in which all three grain boundaries constituting a grain boundary triple junction are special grain boundaries, to a total grain boundary triple junctions is NF.sub.J3, and a proportion of J2, in which two grain boundaries constituting a grain boundary triple junction are special grain boundaries and one grain boundary is a random grain boundary, to the total grain boundary triple junctions is NF.sub.J2.

Metal composite wire

The present invention discloses a metal composite wire capable of increasing a tightness degree of copper-aluminum bonding. The metal composite wire includes a metal core rod. Continuous spiral grooves are formed in a surface of the core rod. The core rod is cladded with a metal cladding layer with higher electrical conductivity than the core rod. An average depth of the continuous spiral grooves ≤1/10 of a thickness of the metal cladding layer. By setting the thickness of the metal cladding layer as t.sub.1, a specific gravity of the metal cladding layer as ρ.sub.1, a diameter of the core rod as R, the average depth of the continuous spiral grooves as h, and a specific gravity of the core rod as ρ.sub.2, t 1 = ( R - h ) 2 × ρ 1 + k × ( R - h ) 2 × ρ 2 - k × ( R - h ) 2 × ρ 1 (

PRINTED CIRCUIT SURFACE FINISH, METHOD OF USE, AND ASSEMBLIES MADE THEREFROM
20210193346 · 2021-06-24 · ·

A surface finish for a printed circuit board (PCB) and semiconductor wafer includes a nickel disposed over an aluminum or copper conductive metal surface. A barrier layer including all or fractions of a nitrogen-containing molecule is deposited on the surface of the nickel layer to make a barrier layer/electroless nickel (BLEN) surface finish. The barrier layer allows solder to be reflowed over the surface finish. Optionally, gold (e.g., immersion gold) may be coated over the barrier layer to create a nickel/barrier layer/gold (NBG) surface treatment. Presence of the barrier layer causes the surface treatment to be smoother than a conventional electroless nickel/immersion gold (ENIG) surface finish. Presence of the barrier layer causes a subsequently applied solder joint to be stronger and less subject to brittle failure than conventional ENIG.

ISOLATED ELECTRICALLY CONDUCTIVE ELEMENT AND METHOD FOR MANUFACTURING THE SAME
20210183536 · 2021-06-17 ·

An insulated electrically conductive element, including at least one inner electrically conductive element and at least one outer insulating element, and to a method for producing such an insulated electrically conductive element.

LCDI power cord system and method

A system and method for an LCDI power cord and associated circuits is provided. The system and method include energizing shielded neutral wires and shielded line wires and monitoring the energized shields for surges, e.g., arcing, detected by a Leakage Current Detection Circuit (LCDC) and/or voltage drops, e.g., shield breaks, detected by a Shield Integrity Circuit (SIC).

LCDI power cord system and method

A system and method for an LCDI power cord and associated circuits is provided. The system and method include energizing shielded neutral wires and shielded line wires and monitoring the energized shields for surges, e.g., arcing, detected by a Leakage Current Detection Circuit (LCDC) and/or voltage drops, e.g., shield breaks, detected by a Shield Integrity Circuit (SIC).

Copper alloy plate having excellent electrical conductivity and bending deflection coefficient

There are provided a copper alloy plate having high strength, high electrical conductivity, a high bending deflection coefficient, and excellent stress relaxation characteristics, and an electronic component preferred for high current applications or heat dissipation applications. A copper alloy plate comprising 0.8 to 5.0% by mass of one or more of Ni and Co and 0.2 to 1.5% by mass of Si, with the balance being copper and an unavoidable impurity, having a tensile strength of 500 MPa or more, and having an A value of 0.5 or more, the A value being given by the following formula:
A=2X.sub.(111)+X.sub.(220)−X.sub.(200)
X.sub.(hkl)=I.sub.(hkl)/I.sub.0(hkl)
wherein I.sub.(hkl) and I.sub.0(hkl) are diffraction integrated intensities of a (hkl) face obtained for a rolled face and a copper powder, respectively, using an X-ray diffraction method.

ELECTRIC WIRE CONDUCTOR, COVERED ELECTRIC WIRE, AND WIRING HARNESS

A wiring harness comprises a first covered electric wire, and a second covered electric wire. The first covered electric wire comprises a first electric wire conductor made of aluminum or an aluminum alloy and an insulator covering the first electric wire conductor. The first electric wire conductor comprises a wire strand of a plurality of elemental wires twisted together, and has a flat portion where a cross-section of the wire strand intersecting an axial direction of the wire strand has a flat shape. The second covered electric wire comprises a second electric wire conductor made of copper or a copper alloy and an insulator covering the second electric wire conductor. The second electric wire conductor has a lower flatness and a smaller conductor cross-sectional area than the first electric wire conductor of the first covered electric wire.